公开(公告)号：US07351433B2

公开(公告)日：2008-04-01

申请号：US10809509

申请日：2004-03-26

Applicant: Hyun Seung Yu ,  Dong Soo Lee ,  Kug Sun Hong ,  Choon Ki Lee ,  Jae hyup Lee ,  Dong Ho Lee ,  Bong Soon Chang ,  Jin Young Kim ,  Sung Soo Chung

Inventor： Hyun Seung Yu ,  Dong Soo Lee ,  Kug Sun Hong ,  Choon Ki Lee ,  Jae hyup Lee ,  Dong Ho Lee ,  Bong Soon Chang ,  Jin Young Kim ,  Sung Soo Chung

IPC: A61K33/42 ,  A61L27/32 ,  A61L33/00

CPC classification number: A61L27/32 ,  A61K33/42 ,  A61L27/12 ,  A61K2300/00

Abstract: Disclosed is a method for producing a transparent and homogenized polymeric sol of a calcium phosphate compound, containing apatite and having excellent wettability and bioactivity, according to a sol-gel synthesis, and a method for coating the polymeric sol on a metal implant, in which the polymeric sol is coated on the metal implant and then heat-treated to form a dense coated layer strongly bonded to the metal implant. The polymeric sol is obtained by process of preparing a calcium salt solution, containing calcium ethoxide dissolved in organic acid, and a phosphate solution, containing triethyl phosphite or triethyl phosphate dissolved in the organic acid, mixing the calcium salt solution with the phosphate solution to produce a mixed solution, and aging the mixed solution.

Abstract translation: 本发明公开了一种根据溶胶 - 凝胶合成法生产含有磷灰石并具有优异的润湿性和生物活性的磷酸钙化合物的透明均化聚合物溶胶的方法，以及在金属植入物上涂覆聚合物溶胶的方法，其中 将聚合物溶胶涂覆在金属植入物上，然后进行热处理以形成与金属植入物牢固结合的致密涂层。 通过制备溶解在有机酸中的含有乙醇钙的钙盐溶液和溶解在有机酸中的含有亚磷酸三乙酯或磷酸三乙酯的磷酸盐溶液，将钙盐溶液与磷酸盐溶液混合，得到聚合物溶胶 混合溶液，老化混合溶液。

公开(公告)号：US20080025688A1

公开(公告)日：2008-01-31

申请号：US11727055

申请日：2007-03-23

Applicant: Dong Ho Lee ,  Won Ki Cho ,  Wan Soo Han ,  Ho Seok Ko ,  Sang Hoon Lee ,  Hee Chan Eum ,  Jong Kyo Jeong

Inventor： Dong Ho Lee ,  Won Ki Cho ,  Wan Soo Han ,  Ho Seok Ko ,  Sang Hoon Lee ,  Hee Chan Eum ,  Jong Kyo Jeong

IPC: G02B6/10

CPC classification number: G02B6/0038 ,  G02B6/0043

Abstract: A light guide member for guiding light received from a light source unit, the light source unit illuminating light toward the light guide member, the light guide member may include a plurality of first grooves on a first side of the light guide member, the first grooves extending along a first direction, and a plurality of first projections projecting from surfaces of the first grooves.

公开(公告)号：US20080025687A1

公开(公告)日：2008-01-31

申请号：US11727053

申请日：2007-03-23

Applicant: Dong Ho Lee ,  Won Ki Cho ,  Jae Myung Kim ,  Kyung Il Park

Inventor： Dong Ho Lee ,  Won Ki Cho ,  Jae Myung Kim ,  Kyung Il Park

IPC: G02B6/10

CPC classification number: G02B6/0038 ,  G02B6/0036 ,  G02B6/0053 ,  G02B6/0061

Abstract: A light guide member for guiding light may include a first pattern on a first side of the light guide member, the first pattern may include a plurality of first features extending along a first direction, and a plurality of second features extending along a second direction, wherein the first direction crosses the second direction, the first feature has a first feature size, the second feature has a second feature size, and the first feature size may be less than the second feature size.

Abstract translation: 用于引导光的导光构件可以包括在导光构件的第一侧上的第一图案，第一图案可以包括沿着第一方向延伸的多个第一特征和沿着第二方向延伸的多个第二特征， 其中所述第一方向跨越所述第二方向，所述第一特征具有第一特征尺寸，所述第二特征具有第二特征尺寸，并且所述第一特征尺寸可以小于所述第二特征尺寸。

公开(公告)号：US20080014735A1

公开(公告)日：2008-01-17

申请号：US11775120

申请日：2007-07-09

Applicant: Hyun-Soo CHUNG ,  Seung-Kwan RYU ,  Ju-Il CHOI ,  Dong-Ho LEE ,  Seong-Deok HWANG

Inventor： Hyun-Soo CHUNG ,  Seung-Kwan RYU ,  Ju-Il CHOI ,  Dong-Ho LEE ,  Seong-Deok HWANG

IPC: H01L21/44

CPC classification number: H01L21/76898 ,  H01L23/3128 ,  H01L23/3178 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/82 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/02313 ,  H01L2224/02372 ,  H01L2224/02379 ,  H01L2224/0239 ,  H01L2224/036 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05009 ,  H01L2224/05548 ,  H01L2224/06181 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16235 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2225/1058 ,  H01L2924/00 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/01028 ,  H01L2224/03

Abstract: Provided are methods of fabricating semiconductor chips, semiconductor chips formed by the methods, and chip-stack packages having the semiconductor chips. One embodiment specifies a method that includes patterning a scribe line region of a semiconductor substrate to form a semiconductor strut spaced apart from edges of a chip region of the semiconductor substrate.

Abstract translation: 提供制造半导体芯片的方法，通过该方法形成的半导体芯片和具有半导体芯片的芯片堆叠封装。 一个实施例规定了一种方法，其包括图案化半导体衬底的划线区域以形成与半导体衬底的芯片区域的边缘间隔开的半导体支柱。

公开(公告)号：US20080008434A1

公开(公告)日：2008-01-10

申请号：US11727054

申请日：2007-03-23

Applicant: Dong Ho Lee ,  Won Ki Cho ,  Jang Hwan Hwang

Inventor： Dong Ho Lee ,  Won Ki Cho ,  Jang Hwan Hwang

IPC: G02B6/10

CPC classification number: G02B6/0036 ,  G02B6/0038 ,  G02B6/0053

Abstract: A light guide member for guiding light incident thereon from a light source, the light guide member including a plurality of the first grooves extending along a first direction on a first side of the light guide member, a plurality of second grooves extending along a second direction on the first side of the light guide member, the first direction may cross the second direction such that the first grooves and the second grooves may form a matrix pattern on the first side of the light guide member, wherein a polygonal shaped projection is formed between every two adjacent ones of the second grooves and a corresponding two adjacent ones of the first grooves.

Abstract translation: 一种用于引导从光源入射到其上的光的导光构件，所述导光构件包括沿着所述导光构件的第一侧沿着第一方向延伸的多个所述第一凹槽，沿着第二方向延伸的多个第二凹槽 在导光构件的第一侧上，第一方向可以穿过第二方向，使得第一凹槽和第二凹槽可以在导光构件的第一侧上形成矩阵图案，其中多边形突起形成在导光构件的第一侧之间， 每两个相邻的第二槽和相应的两个相邻的第一槽。

公开(公告)号：US20070152349A1

公开(公告)日：2007-07-05

申请号：US11355545

申请日：2006-02-15

Applicant: Hyun-Soo Chung ,  Ho-Jin Lee ,  Dong-Hyun Jang ,  Dong-Ho Lee

Inventor： Hyun-Soo Chung ,  Ho-Jin Lee ,  Dong-Hyun Jang ,  Dong-Ho Lee

IPC: H01L21/00 ,  H01L23/48

CPC classification number: H01L25/0657 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/13025 ,  H01L2224/274 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01079 ,  H01L2924/01087

Abstract: In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.

Abstract translation: 在具有应力消除间隔物的半导体器件封装及其制造方法中，从芯片本体延伸的金属互连指状物提供芯片互连。 金属手指通过应力消除间隔物与芯片的主体隔离。 在一个示例中，这种隔离采取气隙的形式。 在另一个实例中，这种隔离采用弹性体材料的形式。 在这两种情况下，都避免了金属互连指和芯体之间的热膨胀系数的不匹配，从而减轻了与开裂和分层相关的问题，从而提高了器件的产量和器件的可靠性。

公开(公告)号：US20070132108A1

公开(公告)日：2007-06-14

申请号：US11677478

申请日：2007-02-21

Applicant: Jin-Hyuk LEE ,  Gu-Sung KIM ,  Dong-Ho LEE ,  Dong-Hyeon JANG

Inventor： Jin-Hyuk LEE ,  Gu-Sung KIM ,  Dong-Ho LEE ,  Dong-Hyeon JANG

IPC: H01L23/48

CPC classification number: H01L24/12 ,  H01L23/3114 ,  H01L24/02 ,  H01L24/11 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/13099 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433

Abstract: A semiconductor wafer with semiconductor chips having chip pads and a passivation layer is provided. First and second dielectric layers are sequentially formed on the passivation layer. The first and second dielectric layers form a ball pad area that includes an embossed portion, i.e., having a non-planar surface. A metal wiring layer is formed on the resulting structure including the embossed portion. A third dielectric layer is formed on the metal wiring layer. A portion of the third dielectric layer located on the embossed portion is removed to form a ball pad. A solder ball is formed on the embossed ball pad. With the embossed ball pad, the contact area between the solder balls and the metal wiring layer is increased, thereby improving the connection reliability.

Abstract translation: 提供了具有芯片焊盘和钝化层的半导体芯片的半导体晶片。 第一和第二电介质层依次形成在钝化层上。 第一和第二电介质层形成包括压花部分，即具有非平面表面的球垫区域。 在所得到的包括压纹部分的结构上形成金属布线层。 第三电介质层形成在金属布线层上。 位于压花部分上的第三电介质层的一部分被去除以形成球垫。 在浮雕球垫上形成焊球。 利用压纹球垫，焊球和金属布线层之间的接触面积增加，从而提高连接可靠性。

公开(公告)号：US07190061B2

公开(公告)日：2007-03-13

申请号：US10750979

申请日：2004-01-02

Applicant: Dong-Ho Lee

Inventor： Dong-Ho Lee

IPC: H01L23/02

CPC classification number: H01L25/105 ,  H01L2224/4824 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1064 ,  H01L2924/15311

Abstract: A stack package of the present invention is made by stacking at least two area array type chip scale packages. Each chip scale package of an adjacent pair of chip scale packages is attached to the other in a manner that the ball land pads of the upper stacked chip scale package face in the opposite direction to those of the lower stacked chip scale package, and the circuit patterns of the upper stacked chip scale package are electrically connected to the those of the lower stacked chip scale package by, for example, connecting boards. Therefore, it is possible to stack not only fan-out type chip scale packages, but to also efficiently stack ordinary area array type chip scale packages.

Abstract translation: 通过堆叠至少两个区域阵列型芯片级封装件来制造本发明的堆叠封装。 相邻的一对芯片级封装的每个芯片级封装以上堆叠芯片级封装的焊盘焊盘与下堆叠芯片尺寸封装的方向相反的方式附接到另一芯片尺寸封装，并且电路 上堆叠芯片级封装的图案通过例如连接板电连接到下堆叠芯片级封装的图案。 因此，不仅可以堆叠扇出式芯片级封装，而且可以有效地堆叠普通区域阵列型芯片级封装。

公开(公告)号：US20060238689A1

公开(公告)日：2006-10-26

申请号：US11407272

申请日：2006-04-19

Applicant: Soo-Jin Kim ,  Dong-Ho Lee

Inventor： Soo-Jin Kim ,  Dong-Ho Lee

IPC: G02F1/1343

CPC classification number: G02F1/136227 ,  G02F2001/13625 ,  G02F2001/136295

Abstract: An array substrate includes a first line, a second line and a switching element in a pixel region defined by the first and second lines adjacent to each other. The pixel electrode is electrically connected to an electrode of the switching element through a plurality of contact holes through which the electrode of the switching element is partially exposed.

Abstract translation: 阵列基板包括由彼此相邻的第一和第二线限定的像素区域中的第一线，第二线和开关元件。 像素电极通过开关元件的电极部分露出的多个接触孔电连接到开关元件的电极。

公开(公告)号：US20060090884A1

公开(公告)日：2006-05-04

申请号：US11262837

申请日：2005-11-01

Applicant: Sang-wook Park ,  Dong-ho Lee ,  Joong-hyun Baek

Inventor： Sang-wook Park ,  Dong-ho Lee ,  Joong-hyun Baek

IPC: F28D15/00

CPC classification number: F28D15/0275 ,  F28D15/046

Abstract: A heat pipe structure may include a plurality of heat pipes. Each heat pipe may include at least one ring arranged to form a passage through which a gas flows, and at least one globe arranged to form a wick, or capillary structure through which a fluid may flow. The at least one ring and the at least one globe may be arranged in a tube, which may connect a heat source and a heat dissipation part, and the fluid may be a working fluid for transferring heat.

Abstract translation: 热管结构可以包括多个热管。 每个热管可以包括布置成形成气体流过的通道的至少一个环和布置成形成流体可以流过的芯或毛细结构的至少一个球体。 至少一个环和至少一个球体可以布置在管中，管可以连接热源和散热部分，并且流体可以是用于传递热量的工作流体。