公开(公告)号：US07872340B2

公开(公告)日：2011-01-18

申请号：US12201896

申请日：2008-08-29

Applicant: DaeSik Choi ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

Inventor： DaeSik Choi ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

IPC: H01L23/02

CPC classification number: H01L24/81 ,  H01L23/552 ,  H01L24/14 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81194 ,  H01L2224/81801 ,  H01L2224/83 ,  H01L2224/8592 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/00

Abstract: A method for manufacturing an integrated circuit package system includes: providing a base package including a first integrated circuit coupled to a base substrate by an electrical interconnect formed on one side; and mounting an offset package over the base package, the offset package electrically coupled to the base substrate via a system interconnect.

Abstract translation: 一种用于制造集成电路封装系统的方法，包括：通过在一侧形成的电互连，提供包括耦合到基底基板的第一集成电路的基底封装; 以及将偏移封装安装在所述基底封装上，所述偏移封装通过系统互连电耦合到所述基底衬底。

公开(公告)号：US07863755B2

公开(公告)日：2011-01-04

申请号：US12051625

申请日：2008-03-19

Applicant: Taewoo Lee ,  Sang-Ho Lee ,  SeungYun Ahn

Inventor： Taewoo Lee ,  Sang-Ho Lee ,  SeungYun Ahn

IPC: H01L23/48

CPC classification number: H01L23/5385 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/5384 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package-on-package system includes: providing an interposer substrate; mounting a base substrate under the interposer substrate and having a first integrated circuit die connected thereto; forming an encapsulant between the interposer substrate and the base substrate, the encapsulant encapsulating the first integrated circuit die; and forming a via z-interconnection extending through the encapsulant and one of the substrates to the other of the substrates.

Abstract translation: 包装封装系统包括：提供插入器衬底; 将基底基板安装在所述插入器基板下方并具有与其连接的第一集成电路管芯; 在所述插入器基板和所述基底基板之间形成密封剂，所述密封剂封装所述第一集成电路管芯; 以及形成通过所述密封剂和所述衬底中的一个延伸到另一个衬底的通孔z-互连。

公开(公告)号：US07812435B2

公开(公告)日：2010-10-12

申请号：US11849087

申请日：2007-08-31

Applicant: Soo-San Park ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha

Inventor： Soo-San Park ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha

IPC: H01L23/02

CPC classification number: H01L23/3128 ,  H01L24/48 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit package-in-package system includes: mounting a first integrated circuit device over a substrate; mounting an integrated circuit package system having an inner encapsulation over the first integrated circuit device with a first offset; mounting a second integrated circuit device over the first integrated circuit device and adjacent to the integrated circuit package system; connecting the integrated circuit package system and the substrate; and forming a package encapsulation as a cover for the first integrated circuit device, the integrated circuit package system, and the second integrated circuit device.

Abstract translation: 集成电路封装包装系统包括：将第一集成电路器件安装在衬底上; 在第一集成电路装置上安装具有第一偏移的内封装的集成电路封装系统; 将第二集成电路装置安装在所述第一集成电路装置上并与所述集成电路封装系统相邻; 连接集成电路封装系统和基板; 以及形成作为第一集成电路器件，集成电路封装系统和第二集成电路器件的封装的封装封装。

公开(公告)号：US20100244218A1

公开(公告)日：2010-09-30

申请号：US12411390

申请日：2009-03-25

Applicant: SeungYong Chai ,  Sang-Ho Lee

Inventor： SeungYong Chai ,  Sang-Ho Lee

IPC: H01L23/538 ,  H01L21/768 ,  H01L21/20 ,  H01L21/50

CPC classification number: H01L21/76898 ,  H01L21/768 ,  H01L23/3128 ,  H01L23/49816 ,  H01L25/0657 ,  H01L25/50 ,  H01L29/66568 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/01019 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/1815

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; depositing a through-conductor on the base substrate; depositing a semiconducting layer on the base substrate and around the through-conductor; forming a metal trace connected to the through-conductor; depositing a dielectric surrounding the metal trace; and removing the base substrate.

Abstract translation: 一种制造集成电路封装系统的方法，包括：提供基底; 在基底基板上沉积贯通导体; 在基底衬底上并围绕贯通导体沉积半导体层; 形成连接到导体的金属迹线; 沉积围绕金属迹线的电介质; 并移除基底。

公开(公告)号：US20100210284A1

公开(公告)日：2010-08-19

申请号：US12676455

申请日：2008-08-25

Applicant: Jee Hyeon Na ,  Sang Ho Lee

Inventor： Jee Hyeon Na ,  Sang Ho Lee

IPC: H04W64/00

CPC classification number: H04W68/02

Abstract: The present invention relates to a method of managing a paging group in a mobile terminal that is in an idle mode. A method of managing a paging group according to an exemplary embodiment of the invention includes: collecting paging group ID information including paging group levels and local IDs; determining, on the basis of the collected paging group ID information, whether or not a location update occurs; and if it is determined that the location update occurs, comparing a location update cycle according to a location update time with a threshold value, selecting a paging group level on the basis of the comparison result, and selecting a paging group corresponding to the selected paging group level.

Abstract translation: 本发明涉及管理处于空闲模式的移动终端中的寻呼组的方法。 根据本发明的示例性实施例的管理寻呼组的方法包括：收集包括寻呼组级别和本地ID的寻呼组ID信息; 基于所收集的寻呼组ID信息确定是否发生位置更新; 并且如果确定位置更新发生，则根据位置更新时间与阈值比较位置更新周期，基于比较结果选择寻呼组级别，并且选择与所选寻呼相对应的寻呼组 组级别。

公开(公告)号：US20100157872A1

公开(公告)日：2010-06-24

申请号：US12580665

申请日：2009-10-16

Applicant: Eun-hee HYUN ,  Ho-choong CHO ,  Jae-ho KIM ,  Sang-ho LEE

Inventor： Eun-hee HYUN ,  Ho-choong CHO ,  Jae-ho KIM ,  Sang-ho LEE

IPC: H04H20/71

CPC classification number: H04L67/16 ,  H04L12/1886 ,  H04L12/189 ,  H04L65/4076 ,  H04L67/18 ,  H04W4/02

Abstract: Provided are a method of obtaining service information to receive a broadcasting service in a user equipment (UE), and service information announcement methods performable in a service center in charge of multimedia broadcast/multicast service (MBMS) control and a server interoperable with the service center. The method of obtaining MBMS information in a UE includes checking whether or not a previously defined event occurs in order to obtain service information, requesting an external server announcing service information to transmit service information according to whether or not the event occurs, and receiving service information transmitted in response to the service information transmission request and outputting the service information through a user interface (UI).

Abstract translation: 提供了一种在用户设备（UE）中获得用于接收广播服务的服务信息的方法，以及在负责多媒体广播/多播服务（MBMS）控制的服务中心中可执行的服务信息通知方法以及可与服务器互操作的服务器 中央。 在UE中获取MBMS信息的方法包括：检查先前定义的事件是否发生以获得服务信息，请求外部服务器根据该事件是否发生服务信息来发送服务信息，以及接收服务信息 响应于服务信息发送请求而发送，并通过用户界面（UI）输出服务信息。

公开(公告)号：US20100117313A1

公开(公告)日：2010-05-13

申请号：US12498826

申请日：2009-07-07

Applicant: Hae Ryong CHOI ,  Seok Joo Lee ,  Sang Ho Lee

Inventor： Hae Ryong CHOI ,  Seok Joo Lee ,  Sang Ho Lee

IPC: B62D17/00

CPC classification number: B60G7/003 ,  B60G2202/413 ,  B60G2204/421 ,  B60G2204/46 ,  B60G2204/62 ,  B60G2206/1116 ,  B60G2800/24

Abstract: An active geometry control suspension may reduce production cost with simple scheme and provide design freedom. An active geometry control suspension of the present invention includes an assist link including a first link of which an end is rotatably connected to a vehicle body and a second link of which an end is connected to the first link and the other end is rotatably connected to a wheel, a clutch assembly selectively connecting a connecting portion of the first link and the second link to the vehicle body and a driving unit operating the clutch assembly.

Abstract translation: 主动几何控制悬架可以通过简单的方案降低生产成本，并提供设计自由度。 本发明的主动几何控制悬架包括辅助连杆，其包括第一连杆，其一端可旋转地连接到车体，第二连杆的一端连接到第一连杆，另一端可旋转地连接到 轮，离合器组件，其选择性地将第一连杆的连接部分和第二连杆部分连接到车身;以及操作离合器组件的驱动单元。

公开(公告)号：US20100112978A1

公开(公告)日：2010-05-06

申请号：US12609069

申请日：2009-10-30

Applicant: Jai-Hyung CHO ,  Hyunsuk ROH ,  Sang-Ho LEE

Inventor： Jai-Hyung CHO ,  Hyunsuk ROH ,  Sang-Ho LEE

IPC: H04W60/00 ,  H04W24/00 ,  H04M3/16

CPC classification number: G08G1/0104 ,  G08G1/096716 ,  G08G1/096741 ,  G08G1/096775 ,  H04W4/06

Abstract: Provided are a method for transmitting and receiving broadcasting service information and a mobile station for a broadcasting service. The method for transmitting broadcasting service information at a base station, includes registering a mobile station in a first cell, wherein the first cell is a cell managed by the base station, receiving vehicle related information from the mobile station mounted on a vehicle, and broadcasting the received vehicle related information to target cells.

Abstract translation: 提供了一种用于发送和接收广播服务信息的方法和用于广播服务的移动台。 在基站发送广播业务信息的方法，包括在第一小区中登记移动台，其中，所述第一小区为由所述基站管理的小区，从安装在车辆上的移动台接收车辆相关信息，并广播 接收的车辆相关信息到目标小区。

公开(公告)号：US07702937B2

公开(公告)日：2010-04-20

申请号：US11589280

申请日：2006-10-30

Applicant: Jang Geun Oh ,  Sang Ho Lee

Inventor： Jang Geun Oh ,  Sang Ho Lee

IPC: G06F1/32

CPC classification number: G06F1/324 ,  G06F1/3203 ,  G06F11/3409 ,  Y02D10/126 ,  Y02D10/34

Abstract: A method, apparatus or stored program for adjusting the clock throttle rate of a central processing unit (CPU) included in a computer, in which the usage of the CPU is measured, so that the clock throttle rate of the CPU can be automatically adjusted on the measured usage of the CPU, thereby reducing the consumption of electric power without any influence on the performance of the computer.

Abstract translation: 一种用于调整包括在计算机中的中央处理单元（CPU）的时钟限幅率的方法，装置或存储程序，其中测量CPU的使用，使得CPU的时钟限幅率可以被自动调整 测量CPU的使用量，从而降低电力消耗，而不影响计算机的性能。

公开(公告)号：US20090303690A1

公开(公告)日：2009-12-10

申请号：US12136037

申请日：2008-06-09

Applicant: Sang-Ho Lee ,  Soo-San Park ,  DaeSik Choi

Inventor： Sang-Ho Lee ,  Soo-San Park ,  DaeSik Choi

IPC: H05K7/06

CPC classification number: H01L23/3128 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/91 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04073 ,  H01L2224/1134 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48475 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/85951 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: An integrated circuit package system includes: providing a package substrate; mounting an interposer chip containing active circuitry over the package substrate; attaching a conductive bump stack having a base bump end and a stud bump end, the base bump end on the interposer chip; connecting a stack connector to the interposer chip and the package substrate; and applying a package encapsulant over the interposer chip, the stack connector, and the conductive bump stack with the stud bump end of the conductive bump stack substantially exposed.

Abstract translation: 集成电路封装系统包括：提供封装衬底; 将包含有源电路的插入器芯片安装在所述封装衬底上; 附接具有基底凸起端和柱形凸起端的导电凸块，所述基座凸起端在所述插入片上; 将堆叠连接器连接到插入器芯片和封装衬底; 以及将封装密封剂施加在所述插入器芯片，所述堆叠连接器以及所述导电凸块堆叠上，其中所述导电凸块的所述凸块的端部基本暴露。