公开(公告)号：US20100264530A1

公开(公告)日：2010-10-21

申请号：US12827133

申请日：2010-06-30

申请人： Geng-Shin SHEN ,  Wu-Chang Tu

发明人： Geng-Shin SHEN ,  Wu-Chang Tu

IPC分类号： H01L25/065 ,  H01L23/538 ,  H01L23/52

CPC分类号： H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： The present invention provides a chip-stacked package structure with leadframe having bus bar, comprising: a leadframe composed of a plurality of inner leads arranged in rows facing each other, a plurality of outer leads, and a die pad, wherein the die pad is provided between the plurality of inner leads and is vertically distant from the plurality of inner leads; a chip-stacked structure formed with a plurality of chips that stacked together and set on the die pad, the plurality of chips and the plurality of inner leads being electrically connected with each other; and an encapsulant covering over the chip-stacked package structure and the leadframe, in which the leadframe comprises at least a bus bar, which is provided between the plurality of inner leads arranged in rows facing each other and the die pad.

公开(公告)号：US07786595B2

公开(公告)日：2010-08-31

申请号：US11826415

申请日：2007-07-16

申请人： Geng-Shin Shen ,  Wu-Chang Tu

发明人： Geng-Shin Shen ,  Wu-Chang Tu

IPC分类号： H01L23/48 ,  H01L23/495

CPC分类号： H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： The present invention provides a chip-stacked package structure with leadframe having bus bar, comprising: a leadframe composed of a plurality of inner leads arranged in rows facing each other, a plurality of outer leads, and a die pad, wherein the die pad is provided between the plurality of inner leads and is vertically distant from the plurality of inner leads; a chip-stacked structure formed with a plurality of chips that stacked together and set on the die pad, the plurality of chips and the plurality of inner leads being electrically connected with each other; and an encapsulant covering over the chip-stacked package structure and the leadframe, in which the leadframe comprises at least a bus bar, which is provided between the plurality of inner leads arranged in rows facing each other and the die pad.

摘要翻译： 本发明提供了具有母线的引线框的芯片堆叠封装结构，包括：引线框架，由相互排列成行的多个内引线，多个外引线和管芯焊盘组成，其中管芯焊盘为 设置在所述多个内部引线之间并且与所述多个内部引线垂直; 芯片堆叠结构，形成有堆叠在一起并设置在芯片焊盘上的多个芯片，多个芯片和多个内部引线彼此电连接; 以及覆盖在所述芯片堆叠的封装结构和所述引线框架上的密封剂，其中所述引线框架至少包括汇流条，所述汇流条设置在彼此面对的所述多个排列成行的内引线和所述管芯焊盘之间。

公开(公告)号：US07767719B2

公开(公告)日：2010-08-03

申请号：US11733041

申请日：2007-04-09

申请人： Du-Shieng Chien ,  Yi-Wen Chu ,  Wu-Chang Chuang ,  Ming-Chung Lee

发明人： Du-Shieng Chien ,  Yi-Wen Chu ,  Wu-Chang Chuang ,  Ming-Chung Lee

IPC分类号： A01N37/00 ,  A01N35/00 ,  A61K31/21 ,  A61K31/12

CPC分类号： A61K31/137 ,  A23L33/105 ,  A61K31/12 ,  A61K31/215 ,  A61K31/22

摘要： This invention relates compositions containing compounds of formula (I) below: Each of R1, R2, R3, R4, R5, R6, R7, and R8 is defined in the specification.

摘要翻译： 本发明涉及含有下式（I）化合物的组合物：R1，R2，R3，R4，R5，R6，R7和R8各自在说明书中定义。

公开(公告)号：US20100128435A1

公开(公告)日：2010-05-27

申请号：US12607957

申请日：2010-01-19

申请人： Hsu Ifeng ,  Pan Jenq-Haur ,  Wu Chang-Yuan

发明人： Hsu Ifeng ,  Pan Jenq-Haur ,  Wu Chang-Yuan

IPC分类号： H05K7/20

CPC分类号： H05K7/20172 ,  F04D25/0606 ,  F04D29/582

摘要： A fan module is disposed in an electrical device. The electrical device has a main board and a casing. The fan module includes a vane module, a fan motor, a circuit board and a fan housing. The vane module has a hub and a plurality of vanes disposed around the edge of the hub. The fan motor is disposed in the hub. The circuit board is used to control the fan motor, so that the vanes rotate related to an axis of the hub for generating an air flow. The fan housing has a main body portion, a protruding portion and a fixing portion, wherein the protruding portion is located in a side of the main body portion, the vane module and the fan motor are disposed in the main body portion and the circuit board is disposed in the protruding portion.

摘要翻译： 风扇模块设置在电气设备中。 电气设备具有主板和壳体。 风扇模块包括叶片模块，风扇马达，电路板和风扇壳体。 叶片模块具有轮毂和围绕轮毂的边缘设置的多个叶片。 风扇马达设置在轮毂中。 电路板用于控制风扇电机，使得叶片相对于毂的轴线旋转以产生空气流。 风扇壳体具有主体部分，突出部分和固定部分，其中突出部分位于主体部分的一侧，叶片模块和风扇电动机设置在主体部分和电路板 设置在突出部分中。

公开(公告)号：US20100006997A1

公开(公告)日：2010-01-14

申请号：US12561476

申请日：2009-09-17

申请人： Geng-Shin SHEN ,  Wu-Chang Tu

发明人： Geng-Shin SHEN ,  Wu-Chang Tu

IPC分类号： H01L23/495 ,  H01L23/52

CPC分类号： H01L23/49575 ,  H01L23/49531 ,  H01L23/49541 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2224/92247 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/48145 ,  H01L2924/00

摘要： The present invention provides a chip-stacked package structure with leadframe having multi-piece bus bar, comprising: a leadframe composed of a plurality of inner leads arranged in rows facing each other, a plurality of outer leads, and a die pad, wherein the die pad is provided between the plurality of inner leads arranged in rows facing each other and is vertically distant from the plurality of inner leads; a chip-stacked structure formed with a plurality of chips stacked together and provided on the die pad, the plurality of chips and the plurality of inner leads arranged in rows facing each other being electrically connected with each other; and an encapsulant provided to cover the chip-stacked structure and the leadframe; wherein the leadframe comprises at least a bus bar provided between the plurality of inner leads arranged in rows facing each other and the die pad, the bus bar being formed by multiple pieces.

摘要翻译： 本发明提供了一种具有多片汇流条的引线框的芯片堆叠封装结构，包括：引线框架，由相互面对排列的多个内引线，多个外引线和管芯焊盘组成，其中， 芯片焊盘设置在彼此相对排列的多个内部引线之间，并且与多个内部引线垂直; 芯片堆叠结构，其形成有堆叠在一起并设置在芯片焊盘上的多个芯片，多个芯片和布置成彼此面对的多个内部引线彼此电连接; 以及提供以覆盖芯片堆叠结构和引线框架的密封剂; 其中，所述引线框架至少包括设置在彼此面对的所述多个内引线之间的汇流条和所述管芯焊盘，所述母线由多个部件形成。

公开(公告)号：US20090243056A1

公开(公告)日：2009-10-01

申请号：US12480105

申请日：2009-06-08

申请人： Wu-Chang Tu ,  Geng-Shin Shen

发明人： Wu-Chang Tu ,  Geng-Shin Shen

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package having asymmetric molding includes a lead frame, a chip, an adhesive layer, bonding wires and a molding compound. The lead frame includes a turbulent plate and a frame body having inner lead portions and outer lead portions. The turbulent plate is bended downwards to form a concave portion. The first end of the turbulent plate is connected to the frame body, and the second end is lower than the inner lead portions. The chip is fixed under the inner lead portions through the adhesive layer. The bonding wires are connected between the chip and the inner lead portions. The molding compound encapsulates the chip, the bonding wires, and the turbulent plate. The ratio between the thickness of the molding compound over and under the concave portion is larger than 1. The thickness of the molding compound under and over the outer lead portions is not equal.

摘要翻译： 具有不对称模制的芯片封装包括引线框架，芯片，粘合剂层，接合线和模塑料。 引线框架包括湍流板和具有内引线部分和外引线部分的框体。 湍流板向下弯曲以形成凹部。 湍流板的第一端连接到框体，第二端低于内引线部。 芯片通过粘合剂层固定在内引线部分的下方。 接合线连接在芯片和内引线部分之间。 模塑料封装芯片，接合线和湍流板。 凹形部分上方和下方的模塑料的厚度之比大于1.外引线部分之下和之上的模塑料的厚度不相等。

公开(公告)号：US07576593B2

公开(公告)日：2009-08-18

申请号：US12222811

申请日：2008-08-18

申请人： Wu-Chang Chang ,  Yin-Chang Chen

发明人： Wu-Chang Chang ,  Yin-Chang Chen

IPC分类号： G05F1/10 ,  G05F3/02

CPC分类号： H02M3/073 ,  H02M2003/078

摘要： A two-phase charge pump circuit without the body effect includes a voltage boost stage, an input stage connected to the voltage boost stage, and a high-voltage generator connected to the input stage. Each of the circuits can consist of NMOS or PMOS transistors. The body of each NMOS transistor is connected to an NMOS switch. The body of each PMOS transistor is connected to a PMOS switch. By providing an appropriate driving signal to each NMOS or PMOS switch, the body of each NMOS transistor can be switched to a lower voltage level and the body of each PMOS transistor is switched to a higher voltage level. This can prevent the body effect from occurring.

摘要翻译： 没有体效应的两相电荷泵电路包括升压级，连接到升压级的输入级和连接到输入级的高压发生器。 每个电路可以由NMOS或PMOS晶体管组成。 每个NMOS晶体管的主体连接到NMOS开关。 每个PMOS晶体管的主体连接到PMOS开关。 通过向每个NMOS或PMOS开关提供适当的驱动信号，每个NMOS晶体管的主体可以被切换到较低的电压电平，并且每个PMOS晶体管的主体被切换到更高的电压电平。 这可以防止身体的影响发生。

公开(公告)号：US07554197B2

公开(公告)日：2009-06-30

申请号：US11400182

申请日：2006-04-10

申请人： Hsiang-Ming Huang ,  An-Hong Liu ,  Yeong-Jyh Lin ,  Yi-Chang Lee ,  Wu-Chang Tu ,  Chun-Hung Lin ,  Shih Feng Chiu

发明人： Hsiang-Ming Huang ,  An-Hong Liu ,  Yeong-Jyh Lin ,  Yi-Chang Lee ,  Wu-Chang Tu ,  Chun-Hung Lin ,  Shih Feng Chiu

IPC分类号： H01L23/48 ,  H01L23/28 ,  H01L23/29

CPC分类号： H01L24/10 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/13 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2224/9202 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A high frequency IC package mainly includes a substrate, a bumped chip, and a plurality of conductive fillers where the substrate has a plurality of bump holes penetrating from the top surface to the bottom surface. The active surface of the chip is attached to the top surface of the substrate in a manner that the bumps are inserted into the bump holes respectively. The conductive fillers are formed in the bump holes to electrically connect the bumps to the circuit layer of the substrate. The high frequency IC package has a shorter electrical path and a thinner package thickness.

摘要翻译： 高频IC封装主要包括衬底，凸起芯片和多个导电填料，其中衬底具有从顶表面到底表面穿透的多个凸起孔。 芯片的有源表面以分别插入到凸块孔中的方式附接到基板的顶表面。 导电填料形成在凸起孔中，以将凸块电连接到基板的电路层。 高频IC封装具有更短的电路径和更薄的封装厚度。

公开(公告)号：US20080263852A1

公开(公告)日：2008-10-30

申请号：US12108040

申请日：2008-04-23

申请人： Shih-ching Chang ,  Kuang-chun Chou ,  Wu-chang Wang

发明人： Shih-ching Chang ,  Kuang-chun Chou ,  Wu-chang Wang

IPC分类号： B23P13/04

CPC分类号： B26F1/02 ,  H01L21/481 ,  H01L23/13 ,  H01L2924/0002 ,  Y10T29/49996 ,  H01L2924/00

摘要： A method for forming a slot on a substrate is disclosed, and provides a two-step process used to firstly form two circular holes on two ends of a predetermined cut area and then form a rectangular hole between the two circular holes by punching. Thus, the friction generated between a punching machine and the substrate during punching can be lowered, so as to prevent glass fiber layers of the substrate from being peeled off, avoid the glass fiber layers from forming burrs, and prevent a metal trace layer of the substrate from being peeled off. Meanwhile, because a portion of the substrate having the metal trace layer is not processed by a milling process, it can prevent the metal trace layer from forming metal burrs.

摘要翻译： 公开了一种在基板上形成槽的方法，并且提供了用于首先在预定切割区域的两端形成两个圆形孔的两步法，然后通过冲压在两个圆孔之间形成矩形孔。 因此，可以降低冲孔时冲孔机与基材之间产生的摩擦，以防止基板的玻璃纤维层被剥离，避免玻璃纤维层形成毛刺，并且防止金属痕迹层 底物被剥离。 同时，由于具有金属迹线层的基板的一部分不通过研磨处理而被处理，所以能够防止金属痕迹层形成金属毛刺。

公开(公告)号：US20080142052A1

公开(公告)日：2008-06-19

申请号：US11611403

申请日：2006-12-15

申请人： Yan Wu Chang ,  Tek Sing Lim

发明人： Yan Wu Chang ,  Tek Sing Lim

IPC分类号： B08B3/08

CPC分类号： H01L21/6708 ,  H01L21/67051

摘要： A method for manufacturing semiconductor substrates. The method includes providing a semiconductor wafer, which has an upper surface, a backside surface, and an edge region around a periphery of the semiconductor wafer. In a preferred embodiment, the upper surface is often for the manufacture of the integrated circuit device elements themselves. The method includes subjecting the semiconductor wafer to one or more process steps to form one or more films of materials on the backside surface. The method mounts the semiconductor wafer to expose the backside surface. The method rotates the semiconductor wafer in a circular manner. In a specific embodiment, the method includes supplying an acid solution containing fluorine bearing species, a nitric acid species, a surfactant species, and an organic acid species, on at least the backside surface as the semiconductor wafer rotates. The method causes removal of one or more contaminants from the backside surface, while a portion of the center region of the backside surface remains exposed as the semiconductor wafer rotates in the circular manner.

摘要翻译： 一种半导体衬底的制造方法。 该方法包括提供半导体晶片，该半导体晶片具有上表面，后表面和围绕半导体晶片周边的边缘区域。 在优选实施例中，上表面通常用于制造集成电路器件元件本身。 该方法包括使半导体晶片经受一个或多个工艺步骤以在背面上形成一个或多个材料膜。 该方法安装半导体晶片以露出背面。 该方法以圆形方式旋转半导体晶片。 在具体实施方案中，该方法包括在半导体晶片旋转时在至少后侧表面上提供含有氟含量的种类的酸溶液，硝酸物质，表面活性剂种类和有机酸物质。 该方法从背面表面去除一种或多种污染物，而当半导体晶片以圆形方式旋转时，背面的中心区域的一部分保持暴露。