Semiconductor device and process for producing the same
    103.
    发明申请
    Semiconductor device and process for producing the same 审中-公开
    半导体装置及其制造方法

    公开(公告)号:US20060214224A1

    公开(公告)日:2006-09-28

    申请号:US10553416

    申请日:2004-04-13

    IPC分类号: H01L27/12

    CPC分类号: H01L21/049

    摘要: A semiconductor device comprising a substrate of SiC provided with an insulating film through plasma treatment. Rare gas is incorporated in the insulating film. Preferably, at least one of krypton (Kr), argon (Ar) and xenon (Xe) is used as the rare gas. A combination of oxygen gas and krypton (Kr) is especially preferred.

    摘要翻译: 一种半导体器件,包括通过等离子体处理设置有绝缘膜的SiC的衬底。 稀有气体被并入绝缘膜中。 优选地,使用氪(Kr),氩(Ar)和氙(Xe)中的至少一种作为稀有气体。 氧气和氪(Kr)的组合是特别优选的。

    Plasma processing apparatus
    106.
    发明授权
    Plasma processing apparatus 有权
    等离子体处理装置

    公开(公告)号:US09105450B2

    公开(公告)日:2015-08-11

    申请号:US13145398

    申请日:2009-11-02

    摘要: A microwave plasma processing apparatus includes: a processing container wherein a gas is excited by microwaves and a substrate is plasma-processed; a microwave source which outputs microwaves; a transmission line through which the microwaves output from the microwave source are transmitted; a plurality of dielectric plates which are arranged on an inner surface of the processing container and emit the microwaves into the processing container; a plurality of first coaxial waveguides which are adjacent to the dielectric plates and through which the microwaves are transmitted to the dielectric plates; and a coaxial waveguide distributor which distributes and transmits the microwaves transmitted through the transmission line to the first coaxial waveguides. The coaxial waveguide distributor includes a second coaxial waveguide which has an input portion and 2 types of branched structures which are connected to the first coaxial waveguides and have different configurations.

    摘要翻译: 微波等离子体处理装置包括:处理容器,其中气体被微波激发,基板被等离子体处理; 输出微波的微波源; 传输微波从微波源输出的微波的传输线; 多个电介质板,其布置在处理容器的内表面上,并将微波放射到处理容器中; 多个第一同轴波导,与所述电介质板相邻并且所述微波通过所述多个第一同轴波导传输到所述电介质板; 以及将通过传输线传输的微波分配并传输到第一同轴波导的同轴波导分配器。 同轴波导分配器包括第二同轴波导,其具有连接到第一同轴波导并具有不同配置的输入部分和两种类型的分支结构。

    ROTATION MECHANISM FOR GAS EXHAUST PUMP, MANUFACTURING METHOD OF THE SAME, GAS EXHAUST PUMP HAVING ROTATION MECHANISM, AND MANUFACTURING METHOD OF THE SAME
    107.
    发明申请
    ROTATION MECHANISM FOR GAS EXHAUST PUMP, MANUFACTURING METHOD OF THE SAME, GAS EXHAUST PUMP HAVING ROTATION MECHANISM, AND MANUFACTURING METHOD OF THE SAME 审中-公开
    用于排气泵的旋转机构,其制造方法,具有旋转机构的气体排气泵及其制造方法

    公开(公告)号:US20140186162A1

    公开(公告)日:2014-07-03

    申请号:US14131299

    申请日:2012-06-27

    IPC分类号: F01D5/02

    摘要: In a gas exhaust pump, there is provided a rotation mechanism that can ensure safe rotation and can greatly reduce the usage of a seal gas. A rotation mechanism of the present invention is formed of a rotating shaft and a seal housing. Between the rotating shaft and the seal housing, there is provided a predetermined gap. On at least one of an outer surface of the rotating shaft and an inner surface of the seal housing, there is provided a PFA film. As to a PFA film on a surface of at least one of the rotating shaft and the seal housing, after coating with PFA the wall surface of the rotation mechanism member defining at least the gap, followed by melting and remelting processes, the PFA film is formed to have a high smoothness on its free surface.

    摘要翻译: 在排气泵中,设置有能够确保安全旋转的旋转机构,能够大幅度减少密封气体的使用。 本发明的旋转机构由旋转轴和密封壳构成。 在旋转轴和密封壳体之间,提供预定间隙。 在旋转轴的外表面和密封壳体的内表面中的至少一个上,设置有PFA膜。 对于至少一个旋转轴和密封壳体的表面上的PFA膜,在用PFA涂覆之后,旋转机构构件的壁表面至少限定间隙,然后熔融和重熔过程,PFA膜是 形成在其自由表面上具有高平滑度。

    Semiconductor integrated circuit switch matrix
    109.
    发明授权
    Semiconductor integrated circuit switch matrix 有权
    半导体集成电路开关矩阵

    公开(公告)号:US08551830B2

    公开(公告)日:2013-10-08

    申请号:US12110800

    申请日:2008-04-28

    IPC分类号: H01L21/336 H01L21/8234

    摘要: There is provided a small-type semiconductor integrated circuit whose circuit area is small and whose wiring length is short. The semiconductor integrated circuit is constructed in a multi-layer structure and is provided with a first semiconductor layer, a first semiconductor layer transistor formed in the first semiconductor layer, a wiring layer which is deposited on the first semiconductor layer and in which metal wires are formed, a second semiconductor layer deposited on the wiring layer and a second semiconductor layer transistor formed in the second semiconductor layer. It is noted that insulation of a gate insulating film of the first semiconductor layer transistor is almost equal with that of a gate insulating film of the second semiconductor layer transistor and the gate insulating film of the second semiconductor layer transistor is formed by means of radical oxidation or radical nitridation.

    摘要翻译: 提供电路面积小,布线长度短的小型半导体集成电路。 半导体集成电路构造为多层结构,并且设置有第一半导体层,形成在第一半导体层中的第一半导体层晶体管,布置在第一半导体层上并且其中金属线为 形成,沉积在布线层上的第二半导体层和形成在第二半导体层中的第二半导体层晶体管。 注意,第一半导体层晶体管的栅极绝缘膜的绝缘几乎等于第二半导体层晶体管的栅极绝缘膜的绝缘,并且通过自由基氧化形成第二半导体层晶体管的栅极绝缘膜 或自由基氮化。

    METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
    110.
    发明申请
    METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE 审中-公开
    制造半导体器件和半导体器件的方法

    公开(公告)号:US20130140700A1

    公开(公告)日:2013-06-06

    申请号:US13814950

    申请日:2011-08-04

    申请人: Tadahiro Ohmi

    发明人: Tadahiro Ohmi

    IPC分类号: H01L23/48 H01L21/768

    摘要: Provided is a method of manufacturing a TSV structure, which prevents a substrate from warping even if it is made thin. A method of manufacturing a semiconductor device comprises integrating semiconductor elements on a surface of a semiconductor substrate to form at least a part of a circuit, forming holes from the surface of the semiconductor substrate, forming an insulating film and a barrier film on an inner surface of each hole, forming a conductive metal on a surface of the barrier film to fill each hole, processing a back surface of the semiconductor substrate to reduce the thickness thereof to thereby protrude the conductive metal, and providing a SiCN film on the back surface of the semiconductor substrate.

    摘要翻译: 提供一种制造TSV结构的方法,即使其变薄,也可防止基板翘曲。 一种制造半导体器件的方法包括:在半导体衬底的表面上集成半导体元件以形成电路的至少一部分,从半导体衬底的表面形成空穴,在内表面上形成绝缘膜和阻挡膜 的每个孔,在阻挡膜的表面上形成导电金属以填充每个孔,处理半导体衬底的背面以减小其厚度,从而突出导电金属,并在导电金属的背面提供SiCN膜 半导体衬底。