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    Photodetection unit, photodetector, and x-ray computed tomography apparatus
    101.
    发明授权
    Photodetection unit, photodetector, and x-ray computed tomography apparatus 有权
    光检测单元，光电检测器和X射线计算机断层摄影装置

    公开(公告)号：US07783000B2

    公开(公告)日：2010-08-24

    申请号：US11918895

    申请日：2006-04-21

    Applicant: Yoshihisa Kotooka

    Inventor： Yoshihisa Kotooka

    IPC: H05G1/60 ,  H05G1/64

    CPC classification number: H01L27/14618 ,  A61B6/032 ,  A61B6/4283 ,  G01J1/0271 ,  G01T1/2018 ,  H01L27/14658 ,  H01L27/14676 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2924/00014

    Abstract: A photodetecting unit having a favorable attaching operability is provided.In a photodetecting unit 1, two structures for attachment 30 are fixed to the rear face of a supporting substrate 20 formed by a sintered body of a ceramic. In the process of manufacturing the photodetecting unit 1, a laminate of green sheets is fired, so as to form a sintered body of a ceramic, and then each structure for attachment 30 is bonded to the rear face of the supporting substrate 20. This allows the structures for attachment 30 to be arranged accurately on the rear face of the supporting substrate 20, thereby ameliorating the attaching operability of the photodetecting unit 1.

    Abstract translation: 提供具有良好的附着可操作性的光检测单元。 在光检测单元1中，将两个附着结构30固定在由陶瓷烧结体形成的支撑基板20的背面。 在光检测单元1的制造过程中，烧成生坯层叠体，形成陶瓷的烧结体，然后将各个附着结构体30接合到支撑基板20的背面。这允许 安装结构30精确地设置在支撑基板20的背面，从而改善了受光单元1的安装操作性。

    Integrated optical device including an optoelectronic element and a sealing substrate with an optical element having optical power thereon
    103.
    发明授权
    Integrated optical device including an optoelectronic element and a sealing substrate with an optical element having optical power thereon 失效
    集成光学装置，其包括光电子元件和具有在其上具有光焦度的光学元件的密封基板

    公开(公告)号：US07750289B2

    公开(公告)日：2010-07-06

    申请号：US12379279

    申请日：2009-02-18

    Applicant: Michael R. Feldman ,  James E. Morris

    Inventor： Michael R. Feldman ,  James E. Morris

    IPC: H01J40/14 ,  G02B6/12

    CPC classification number: G01J1/02 ,  G01J1/0204 ,  G01J1/0271 ,  G01J1/0403 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4292

    Abstract: An optical transceiver includes at least one light source and at least one detector mounted on the same surface of the same substrate. The detector is to receive light from other than a light source on the surface. At least one of the light source and the detector is mounted on the surface. An optics block having optical elements for each light source and detectors is attached via a vertical spacer to the substrate. Electrical interconnections for the light source and the detector are accessible from the same surface of the substrate with the optics block attached thereto. One of the light source and the detector may be monolithically integrated into the substrate.

    Abstract translation: 光收发器包括至少一个光源和安装在相同基板的相同表面上的至少一个检测器。 检测器是从表面上的光源以外的光线接收光。 光源和检测器中的至少一个安装在表面上。 具有用于每个光源和检测器的光学元件的光学块通过垂直间隔件连接到基板。 用于光源和检测器的电互连可从衬底的相同表面接近，光学块连接到其上。 光源和检测器中的一个可以单片地集成到衬底中。

    Method for Measuring Luminance of Light-Emitting Object and Device Therefor
    104.
    发明申请
    Method for Measuring Luminance of Light-Emitting Object and Device Therefor 审中-公开
    用于测量发光体的亮度的方法及其装置

    公开(公告)号：US20090231575A1

    公开(公告)日：2009-09-17

    申请号：US11920918

    申请日：2006-05-23

    Applicant: Kenichiro Saito ,  Mieko Sakai

    Inventor： Kenichiro Saito ,  Mieko Sakai

    IPC: G01J1/42

    CPC classification number: G01J1/42 ,  G01J1/02 ,  G01J1/0271

    Abstract: A method for measuring the luminance of a light-emitting object having a surface which has a definite area and which emits a low-intensity light and a device therefore, wherein a light-receiving surface of an optical sensor is brought into direct contact with the surface of the light-emitting object to measure the luminance thereof. As the optical sensor, a semiconductor sensor panel or, a solar panel is preferably used. The luminance of a light-emitting object which emits a low-intensity light can be measured simply, easily and properly without a darkroom and without a means such as a light condensing lens system which is complicated and difficult to use.

    Abstract translation: 一种用于测量具有确定区域并发射低强度光的表面的发光物体的亮度的方法及其装置，其中光学传感器的光接收表面与 发光物体的表面以测量其亮度。 作为光学传感器，优选使用半导体传感器面板或太阳能面板。 发出低强度光的发光物体的亮度可以简单，容易且适当地测量而没有暗室，并且没有诸如复杂且难以使用的聚光透镜系统的装置。

    INFRARED SENSOR
    105.
    发明申请
    INFRARED SENSOR 有权
    红外传感器

    公开(公告)号：US20090212218A1

    公开(公告)日：2009-08-27

    申请号：US12424565

    申请日：2009-04-16

    Applicant: Koji HAYASHI ,  Takeshi TAKEDA

    Inventor： Koji HAYASHI ,  Takeshi TAKEDA

    IPC: G01J5/00

    CPC classification number: G01J1/04 ,  G01J1/0271 ,  G01J1/0407 ,  G01J2001/0276

    Abstract: A small infrared sensor has a wide infrared light-receiving area (viewing angle), high electromagnetic shielding characteristics, and excellent electromagnetic-wave resistance characteristics. In the infrared sensor, supporting portions are disposed at four corners of a substantially rectangular opening in a package. The supporting portions support an optical filter, disposed so as to cover the opening, at positions that are lower than an upper end of an inner peripheral wall defining the opening. While the optical filter is supported by the supporting portions as a result of inserting a portion of a surface side of the optical filter facing the supporting portions into the opening, the optical filter is secured to the package. The optical filter and the package are joined and secured, and electrically connected to each other through a conductive adhesive.

    Abstract translation: 小型红外线传感器具有宽的红外光接收面积（视角），高电磁屏蔽特性和优异的电磁波电阻特性。 在红外传感器中，支撑部分设置在包装件中的大致矩形开口的四个角处。 所述支撑部支撑设置成覆盖所述开口的光学过滤器，所述光学过滤器位于比限定所述开口的内周壁的上端低的位置处。 当由于将滤光器的面对支撑部分的表面侧的一部分插入到开口中而由支撑部分支撑滤光器时，滤光器固定在封装上。 光学滤波器和封装被接合并固定，并通过导电粘合剂彼此电连接。

    IMAGE SENSOR MODULE HAVING ELECTRIC COMPONENT AND FABRICATION METHOD THEREOF
    106.
    发明申请
    IMAGE SENSOR MODULE HAVING ELECTRIC COMPONENT AND FABRICATION METHOD THEREOF 有权
    具有电气元件的图像传感器模块及其制造方法

    公开(公告)号：US20090166511A1

    公开(公告)日：2009-07-02

    申请号：US12185910

    申请日：2008-08-05

    Applicant: Jong-oh KWON ,  Yoon-chul Son ,  Kyu-dong Jung ,  Woon-bae Kim

    Inventor： Jong-oh KWON ,  Yoon-chul Son ,  Kyu-dong Jung ,  Woon-bae Kim

    IPC: G01J1/44

    CPC classification number: G01J1/02 ,  G01J1/0204 ,  G01J1/0219 ,  G01J1/0271 ,  G01J1/04 ,  G01J1/0411 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2924/0002 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2924/00

    Abstract: An image sensor module capable of facilitating an electrical and mechanical connection of an electric component and a fabrication thereof are disclosed. The image sensor module includes a sensor chip; at least one lens disposed above the sensor chip; at least one electric component disposed with respect to the at least one lens to adjust optical characteristics of the at least one lens; a housing accommodating and closing up the sensor chip, the at least one lens and the at least one electric component, and having an opening to expose the at least one lens to an outside thereof; and a wiring part longitudinally disposed on an inner surface of the housing, and including at least one conducting wire having a first connecting terminal exposed to the outside of the housing to allow the at least one conducting wire to electrically connect a terminal pad of the at least one electric component with an external electronic device and a second connecting terminal connected to the terminal pad of the at least one electric component.

    Abstract translation: 公开了能够促进电气部件的电气和机械连接及其制造的图像传感器模块。 图像传感器模块包括传感器芯片; 设置在所述传感器芯片上方的至少一个透镜; 相对于所述至少一个透镜布置的至少一个电气部件，以调节所述至少一个透镜的光学特性; 容纳和封闭传感器芯片的壳体，所述至少一个透镜和所述至少一个电气部件，并且具有用于将所述至少一个透镜暴露于其外部的开口; 以及纵向设置在所述壳体的内表面上的布线部分，并且包括至少一个导线，其具有暴露于所述壳体的外部的第一连接端子，以允许所述至少一根导线电连接所述壳体的端子垫 至少一个具有外部电子设备的电气部件和连接到所述至少一个电气部件的端子焊盘的第二连接端子。

    SYSTEMS AND METHODS FOR A TILTED OPTICAL RECEIVER ASSEMBLY
    110.
    发明申请
    SYSTEMS AND METHODS FOR A TILTED OPTICAL RECEIVER ASSEMBLY 失效
    倾斜光接收机组件的系统和方法

    公开(公告)号：US20090065678A1

    公开(公告)日：2009-03-12

    申请号：US11852506

    申请日：2007-09-10

    Applicant: Mark Vandermeulen ,  Robert E. Hawke ,  David Roy ,  William F. Hill

    Inventor： Mark Vandermeulen ,  Robert E. Hawke ,  David Roy ,  William F. Hill

    IPC: G01J1/44 ,  B23K35/14 ,  G01J1/20 ,  H01J40/14

    CPC classification number: G01J1/02 ,  G01J1/0271 ,  G01J1/04 ,  G01J1/0403 ,  H05K3/3436 ,  H05K2201/094 ,  H05K2201/10121 ,  H05K2201/10484 ,  Y02P70/613

    Abstract: Systems and methods are provided for depositing solder in a first pattern over a first bonding pad on the substrate; depositing solder in a second pattern over a second bonding pad on the substrate, wherein the second pattern defines a larger area than the first pattern; placing the electronic device on the substrate such that pads on the electronic device are aligned with the first and second bonding pads; and reflowing the solder between the pads on the electronic device and the first and second bonding pads, causing the solder deposited on the first bonding pad to form a first solder joint and the solder deposited on the second bonding pad to form a second solder joint. The second solder joint is larger than the first solder joint causing the electronic device to be attached at an angle relative to the substrate.

    Abstract translation: 提供了用于在衬底上的第一焊盘上以第一图案沉积焊料的系统和方法; 在衬底上的第二接合焊盘上以第二图案沉积焊料，其中所述第二图案限定比所述第一图案更大的面积; 将所述电子设备放置在所述基板上，使得所述电子设备上的焊盘与所述第一和第二焊盘对准; 以及在所述电子设备上的所述焊盘与所述第一和第二接合焊盘之间回流焊料，使得沉积在所述第一接合焊盘上的所述焊料形成第一焊接接头，并且所述焊料沉积在所述第二接合焊盘上以形成第二焊接接头。 第二焊点比第一焊点大，导致电子器件相对于衬底以一定角度附着。

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