公开(公告)号：US20090166063A1

公开(公告)日：2009-07-02

申请号：US12144254

申请日：2008-06-23

Applicant: YUNG-WEI LAI ,  CHENG-WEI KUO ,  SHING-TZA LIOU

Inventor： YUNG-WEI LAI ,  CHENG-WEI KUO ,  SHING-TZA LIOU

IPC: H05K1/03 ,  B32B27/08 ,  C08G73/10

CPC classification number: H05K3/007 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2203/0156 ,  Y10T428/265 ,  Y10T428/31721

Abstract: An exemplary stiffener includes at least one polyimide layer and at least one polyetherimide layer adhered to the at least one polyimide layer. The at least one polyetherimide layer is represented by the following general formula:

Abstract translation: 示例性的加强件包括至少一个聚酰亚胺层和粘附到至少一个聚酰亚胺层的至少一个聚醚酰亚胺层。 所述至少一种聚醚酰亚胺层由以下通式表示：

公开(公告)号：US07511962B2

公开(公告)日：2009-03-31

申请号：US11960656

申请日：2007-12-19

Applicant: Ning Hou ,  Shing-Tza Liou

Inventor： Ning Hou ,  Shing-Tza Liou

IPC: H05K1/00

CPC classification number: H05K1/0281 ,  H05K2201/09263 ,  H05K2201/09781 ,  H05K2201/09909 ,  H05K2201/2009

Abstract: A flexible printed circuit board includes a flexible base, a working trace region, and at least one reinforcement trace. The working trace region and the at least one reinforcement trace are formed on the flexible base. The working trace is formed by a number of working traces. In the flexible base, the at least one reinforcement trace is disposed at a periphery of the working trace region.

Abstract translation: 柔性印刷电路板包括柔性基座，工作迹线区域和至少一个加强迹线。 工作轨迹区域和至少一个加强迹线形成在柔性基座上。 工作痕迹由多条工作痕迹组成。 在柔性基座中，至少一个加强迹线设置在工作轨迹区域的周边。

公开(公告)号：US20090050600A1

公开(公告)日：2009-02-26

申请号：US12110542

申请日：2008-04-28

Applicant: TSO-HUNG YEH ,  HUNG-YI CHANG ,  CHIA-CHENG CHEN

Inventor： TSO-HUNG YEH ,  HUNG-YI CHANG ,  CHIA-CHENG CHEN

IPC: H01B13/00

CPC classification number: H05K3/064 ,  H05K3/382 ,  H05K2203/095

Abstract: An exemplary method for manufacturing printed circuit boards is provided. In the method, a copper clad substrate having a copper layer thereon is provided. A surface of the copper layer is roughened by applying an atmospheric pressure plasma thereto. A photoresist layer is formed on the roughened surface of the copper layer. The photoresist layer is exposed. The photoresist layer is developed to form a patterned photoresist layer, thereby exposing portions of the copper layer. The exposed portions of the copper layer exposed are removed so that the remaining portions of the copper layer form electrical traces. The patterned photoresist layer is removed.

Abstract translation: 提供了制造印刷电路板的示例性方法。 在该方法中，提供了具有铜层的铜包覆基板。 通过向其施加大气压等离子体使铜层的表面变粗糙。 在铜层的粗糙化表面上形成光致抗蚀剂层。 曝光光致抗蚀剂层。 显影光致抗蚀剂层以形成图案化的光致抗蚀剂层，从而暴露铜层的部分。 去除暴露的铜层的暴露部分，使得铜层的其余部分形成电迹线。 去除图案化的光致抗蚀剂层。

公开(公告)号：US20090045151A1

公开(公告)日：2009-02-19

申请号：US12055587

申请日：2008-03-26

Applicant: Yong-Hui Feng ,  I-Hsien Chiang ,  Cheng-Hsien Lin

Inventor： Yong-Hui Feng ,  I-Hsien Chiang ,  Cheng-Hsien Lin

IPC: H05K13/00

CPC classification number: H05K13/0069

Abstract: In one embodiment, a holder for holding printed circuit boards includes a base plate with a plurality of holding unit formed thereon. Each of the holding units includes a spring member, a securing member, and a blocking structure. The spring member includes a first end and a second end. The first end is attached to the base plate. The securing member is slideably mounted on the base plate. The securing member includes a connecting end and a securing end. The connecting end is connected with the second end of the spring member. The blocking structure is located on the base plate. The spring member is configured for pressing the securing member to move toward the blocking structure such that a printed circuit board is retainable between the securing end of the securing member and the blocking structure on the base plate. The holder is capable of holding printed circuit boards in batches.

Abstract translation: 在一个实施例中，用于保持印刷电路板的保持器包括在其上形成有多个保持单元的基板。 每个保持单元包括弹簧构件，固定构件和阻挡结构。 弹簧构件包括第一端和第二端。 第一端连接到基板。 固定构件可滑动地安装在基板上。 固定构件包括连接端和固定端。 连接端与弹簧构件的第二端连接。 阻挡结构位于基板上。 弹簧构件构造成用于按压固定构件朝向阻挡结构移动，使得印刷电路板可保持在固定构件的固定端和基板上的阻挡结构之间。 支架能够分批装载印刷电路板。

公开(公告)号：US20090014204A1

公开(公告)日：2009-01-15

申请号：US12106513

申请日：2008-04-21

Applicant: MING WANG ,  DONG-QING HE ,  XIAO-HONG ZHANG ,  CHENG-HSIEN LIN

Inventor： MING WANG ,  DONG-QING HE ,  XIAO-HONG ZHANG ,  CHENG-HSIEN LIN

IPC: H05K1/00

CPC classification number: H05K1/118 ,  H05K1/0281 ,  H05K3/281 ,  H05K2201/09145

Abstract: A flexible printed circuit board includes a base and a coverlay. The base includes a main portion and a distal portion connecting with the main portion. The distal portion has a first part and a second exposed part. The coverlay is formed on the base and covers the main portion and the first part of the distal portion. The second exposed part of the distal portion is uncovered by the coverlay. The coverlay includes a curved edge serving as an interface between the first part and second part of the distal portion.

Abstract translation: 柔性印刷电路板包括基底和覆盖物。 基部包括与主要部分连接的主要部分和远端部分。 远侧部分具有第一部分和第二暴露部分。 覆盖层形成在基部上并覆盖远端部分的主要部分和第一部分。 远端部分的第二暴露部分被覆盖物覆盖。 覆盖物包括用作远端部分的第一部分和第二部分之间的界面的弯曲边缘。

公开(公告)号：US20080308042A1

公开(公告)日：2008-12-18

申请号：US12024948

申请日：2008-02-01

Applicant: ZE LONG ,  SZU-MIN HUANG ,  CHIH-YI TU

Inventor： ZE LONG ,  SZU-MIN HUANG ,  CHIH-YI TU

IPC: H01L21/687 ,  H01L21/00 ,  C23C16/00

CPC classification number: H05K3/0041 ,  H05K3/26 ,  H05K2203/0165 ,  H05K2203/0169 ,  H05K2203/095

Abstract: The present invention relates to an apparatus for plasma-processing of flexible printed circuit boards (FPCBs). The apparatus includes a plasma-discharging chamber, two electrodes arranged in the chamber for generating plasma in the chamber, a frame, and two elongated holding arms disposed on the frame. The frame includes a number of spaced parallel first bars and a number of spaced parallel second bars. The first bars intersecting with the second bars. The elongated holding arms are substantially parallel with each other. Each of the arms has an inner sidewall. The inner sidewalls of the elongated holding arms are opposite to each other. An elongated recess is defined in each of the inner sidewalls proximate to the frame. The apparatus can ensure uniform plasma-processing and protect FPCBs from being burned.

Abstract translation: 本发明涉及柔性印刷电路板（FPCB）的等离子体处理装置。 该装置包括等离子体放电室，布置在腔室中的用于在腔室中产生等离子体的两个电极，框架和设置在框架上的两个细长的保持臂。 框架包括多个间隔开的平行的第一条和多个间隔开的平行的第二条。 第一个条与第二个条相交。 细长的保持臂基本上彼此平行。 每个臂具有内侧壁。 细长保持臂的内侧壁彼此相对。 在靠近框架的每个内侧壁中限定细长的凹部。 该设备可以确保均匀的等离子体处理和保护FPCB不被烧毁。

公开(公告)号：US20080070429A1

公开(公告)日：2008-03-20

申请号：US11567593

申请日：2006-12-06

Applicant: WEN-CHIN LEE ,  CHENG-HSIEN LIN

Inventor： WEN-CHIN LEE ,  CHENG-HSIEN LIN

IPC: H05K1/00

CPC classification number: H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10636 ,  H05K2201/10727 ,  Y02P70/611 ,  Y02P70/613

Abstract: An exemplary surface mounted electronic component has block body including a bottom soldering surface, a top surface and a peripheral wall having a first peripheral wall portion and a second peripheral wall portion. The bottom soldering surface defines a first soldering area and a second soldering area. The first peripheral wall portion adjoins the first soldering area and has at least a first cutout defined between the first peripheral wall portion and the first soldering area. The second peripheral wall portion adjoins the second soldering area and has at least a second cutout defined between the second peripheral wall portion and the second soldering area. When the surface mounted electronic component is soldered, the melting solder can climb up the cutouts of the sidewall due to capillary effect and ‘chimney effect’, thereby avoiding ‘tombstoning’.

Abstract translation: 示例性的表面安装电子部件具有块体，其包括底部焊接表面，顶表面和具有第一周壁部分和第二周壁部分的周壁。 底部焊接表面限定第一焊接区域和第二焊接区域。 所述第一周壁部分邻接所述第一焊接区域，并且至少具有限定在所述第一周壁部分和所述第一焊接区域之间的第一切口。 所述第二周壁部分邻接所述第二焊接区域，并且在所述第二周壁部分和所述第二焊接区域之间具有至少第二切口。 当表面安装的电子部件被焊接时，由于毛细管效应和“烟囱效应”，熔化焊料可以爬上侧壁的切口，从而避免“墓碑”。

公开(公告)号：US07338299B1

公开(公告)日：2008-03-04

申请号：US11567593

申请日：2006-12-06

Applicant: Wen-Chin Lee ,  Cheng-Hsien Lin

Inventor： Wen-Chin Lee ,  Cheng-Hsien Lin

IPC: H01R12/00

CPC classification number: H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10636 ,  H05K2201/10727 ,  Y02P70/611 ,  Y02P70/613

Abstract: An exemplary surface mounted electronic component has block body including a bottom soldering surface, a top surface and a peripheral wall having a first peripheral wall portion and a second peripheral wall portion. The bottom soldering surface defines a first soldering area and a second soldering area. The first peripheral wall portion adjoins the first soldering area and has at least a first cutout defined between the first peripheral wall portion and the first soldering area. The second peripheral wall portion adjoins the second soldering area and has at least a second cutout defined between the second peripheral wall portion and the second soldering area. When the surface mounted electronic component is soldered, the melting solder can climb up the cutouts of the sidewall due to capillary effect and ‘chimney effect’, thereby avoiding ‘tombstoning’.

Abstract translation: 示例性的表面安装电子部件具有块体，其包括底部焊接表面，顶表面和具有第一周壁部分和第二周壁部分的周壁。 底部焊接表面限定第一焊接区域和第二焊接区域。 所述第一周壁部分邻接所述第一焊接区域，并且至少具有限定在所述第一周壁部分和所述第一焊接区域之间的第一切口。 所述第二周壁部分邻接所述第二焊接区域，并且在所述第二周壁部分和所述第二焊接区域之间具有至少第二切口。 当表面安装的电子部件被焊接时，由于毛细管效应和“烟囱效应”，熔化焊料可以爬上侧壁的切口，从而避免“墓碑”。

公开(公告)号：US20070266559A1

公开(公告)日：2007-11-22

申请号：US11560787

申请日：2006-11-16

Applicant: WEN-CHIN LEE ,  CHENG-HSIEN LIN

Inventor： WEN-CHIN LEE ,  CHENG-HSIEN LIN

IPC: H01K3/10 ,  H05K3/10

CPC classification number: H05K3/4652 ,  H05K3/0035 ,  H05K3/421 ,  H05K3/429 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2203/0554 ,  H05K2203/1476 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: An exemplary method for forming stacked via-holes in a multilayer printed circuit board includes the steps of: providing a base circuit board; attaching a first copper-coated-substrate having a first substrate and a first copper layer thereon and a second copper-coated-substrate having a second substrate and a second copper layer thereon onto the base circuit board in a manner such that; forming at least one first window in the second copper layer, making at least one first hole in the second substrate through the at least one first window, forming at least one second window in the first copper layer through the at least one first hole, and making at least one second hole in the first substrate though the at least one second window, thus forming at least one part-finished stacked via-hole; and plating the at least one part-finished stacked via-hole thereby forming at least one stacked via-hole.

Abstract translation: 在多层印刷电路板中形成堆叠的通孔的示例性方法包括以下步骤：提供基底电路板; 将其上具有第一基板和第一铜层的第一铜涂覆基板和其上具有第二基板和第二铜层的第二铜涂覆基板以如下方式附接到基板电路板上; 在所述第二铜层中形成至少一个第一窗口，通过所述至少一个第一窗口在所述第二基板中形成至少一个第一孔，通过所述至少一个第一孔在所述第一铜层中形成至少一个第二窗口，以及 通过所述至少一个第二窗口在所述第一基板中形成至少一个第二孔，从而形成至少一个部分精加工的堆叠通孔; 以及对所述至少一个部分精加工的堆叠通孔进行电镀，从而形成至少一个堆叠的通孔。

公开(公告)号：US20130092420A1

公开(公告)日：2013-04-18

申请号：US13472490

申请日：2012-05-16

Applicant: MING LI

Inventor： MING LI

IPC: H05K1/02 ,  B29C65/00

CPC classification number: H05K3/4697 ,  H05K1/147 ,  H05K1/186 ,  H05K3/222 ,  H05K2203/061

Abstract: An embedded multilayer printed circuit board includes first, second and third circuit substrates, and a flexible circuit substrate. The first circuit substrate includes a first base layer and a first electrically conductive layer. The second circuit substrate includes a second base layer and a second circuit layer. The second circuit substrate also defines a receiving hole. The third circuit substrate includes a third circuit layer, a third base layer, a fourth circuit layer, and an electronic element mounted on the third circuit layer. The third circuit layer and the fourth circuit layer are formed on the opposite sides of the third base layer. The electronic element is received in the receiving hole.The flexible circuit substrate includes a flexible base layer and a flexible circuit layer. The first circuit layer is electrically connected to the fourth circuit layer by the flexible circuit layer.

Abstract translation: 嵌入式多层印刷电路板包括第一，第二和第三电路基板以及柔性电路基板。 第一电路基板包括第一基底层和第一导电层。 第二电路基板包括第二基极层和第二电路层。 第二电路基板还限定了接收孔。 第三电路基板包括第三电路层，第三基极层，第四电路层和安装在第三电路层上的电子元件。 第三电路层和第四电路层形成在第三基层的相对侧上。 电子元件被容纳在接收孔中。 柔性电路基板包括柔性基极层和柔性电路层。 第一电路层通过柔性电路层与第四电路层电连接。