公开(公告)号：US20080032063A1

公开(公告)日：2008-02-07

申请号：US11644861

申请日：2006-12-21

Applicant: Chia-Chiang Chang ,  Chin-Jyi Wu ,  Shin-Chih Liaw ,  Chun-Hung Lin

Inventor： Chia-Chiang Chang ,  Chin-Jyi Wu ,  Shin-Chih Liaw ,  Chun-Hung Lin

IPC: C23C16/00 ,  H05H1/24

CPC classification number: C23C16/402 ,  C23C16/345 ,  C23C16/45563 ,  C23C16/45595 ,  C23C16/513

Abstract: A plasma deposition apparatus is provided. The plasma deposition apparatus comprises a chamber. A pedestal is placed in the chamber. A plasma generator is placed in the chamber and over the pedestal. The plasma generator comprises a plasma jet for plasma thin film deposition having a discharge direction angle θ1 of 0° to 90° between a normal direction of the pedestal and the discharge direction of the plasma jet. A gas-extracting apparatus is placed in the chamber and over the pedestal. The gas-extracting apparatus comprises a gas-extracting pipe providing a pumping path for particles and side-products having a pumping direction angle θ2 of 0° to 90° between the normal direction of the pedestal and the pumping direction of the gas-extracting pipe.

Abstract translation: 提供了一种等离子体沉积装置。 等离子体沉积设备包括一个室。 底座放置在腔室中。 等离子体发生器放置在腔室中并在基座上方。 等离子体发生器包括用于等离子体薄膜沉积的等离子体射流，其具有在基座的法线方向和等离子体射流的排出方向之间的0°至90°之间的放电方向角θ1。 气体提取装置放置在腔室中并且在基座上方。 气体提取装置包括气体提取管，其提供用于颗粒的泵送路径和在基座的法线方向上具有0°至90°的泵送方向角θ2> 2°的副产物， 抽气管的泵送方向。

公开(公告)号：US20080021193A1

公开(公告)日：2008-01-24

申请号：US11819617

申请日：2007-06-28

Applicant: Ching-Hsuan Lin ,  Chun-Hung Lin

Inventor： Ching-Hsuan Lin ,  Chun-Hung Lin

IPC: C07D521/00 ,  C08G63/44

CPC classification number: C08G73/1067 ,  C07F9/657172 ,  H05K1/0346 ,  H05K2201/012 ,  H05K2201/0154

Abstract: A method of manufacturing new materials for a printed circuit board and Low-Earth Orbit (LEO) spacecraft is provided. The present invention includes dinitro, diamine, various phosphorous-containing polyimides and polyamides, and synthesizing methods thereof. The polymers of the embodiment of present invention exhibit good flame retardancy, high glass transition temperature, good mechanical properties and superior oxygen resistance, so they are good materials for Low-Earth Orbit applications. Besides, these polymers can also be used as matrix for halogen-free flexible printed circuit board.

Abstract translation: 提供了制造印刷电路板和低地轨道（LEO）航天器新材料的方法。 本发明包括二硝基二胺，各种含磷聚酰亚胺和聚酰胺及其合成方法。 本发明实施方案的聚合物显示出良好的阻燃性，高玻璃化转变温度，良好的机械性能和优异的耐氧性，因此它们是用于低地球轨道应用的良好材料。 此外，这些聚合物也可以用作无卤柔性印刷电路板的基质。

公开(公告)号：US20070262052A1

公开(公告)日：2007-11-15

申请号：US11527443

申请日：2006-09-27

Applicant: Chia-Chiang Chang ,  Chin-Jyi Wu ,  Chen-Der Tsai ,  Chun-Hung Lin

Inventor： Chia-Chiang Chang ,  Chin-Jyi Wu ,  Chen-Der Tsai ,  Chun-Hung Lin

IPC: H05H1/00 ,  C23F1/00 ,  H01L21/306

CPC classification number: H01J37/32825 ,  G02F1/1303 ,  G02F2001/1316 ,  G03F7/427 ,  H01J37/32366 ,  H01J37/32623 ,  H05H2001/3463

Abstract: A film removal method and apparatus for removing a film from a substrate are disclosed. The method comprises the steps of disposing a plasma generator and a sucking apparatus over the substrate, projecting a plasma beam from the plasma generator onto the film obliquely, disposing the sucking apparatus on a reflection path of plasma projected by the plasma generator, and sucking a by-product of an incomplete plasma reaction occurring to the film so as to keep a surface of the substrate clean, with a view to overcoming the drawbacks of deposition of the by-product which results from using the plasma as a surface cleansing means under atmospheric conditions.

Abstract translation: 公开了一种从基板上去除膜的膜去除方法和装置。 该方法包括以下步骤：将等离子体发生器和吸附装置设置在衬底上，将等离子体发生器的等离子体束倾斜地投射到膜上，将吸引装置设置在由等离子体发生器投射的等离子体的反射路径上， 为了克服在大气压下使用等离子体作为表面清洁装置产生的副产物沉积的缺点，膜的发生不完全等离子体反应的副产物是保持基板的表面清洁的副产物 条件。

公开(公告)号：US20070104729A1

公开(公告)日：2007-05-10

申请号：US11553402

申请日：2006-10-26

Applicant: Yuan-Yuan Wang ,  Kay-Hooi Khoo ,  Shui-Tein Chen ,  Chun-Cheng Lin ,  Chi-Huey Wong ,  Chun-Hung Lin ,  Hong-Sen Chen ,  Yow-Fu Tsai

Inventor： Yuan-Yuan Wang ,  Kay-Hooi Khoo ,  Shui-Tein Chen ,  Chun-Cheng Lin ,  Chi-Huey Wong ,  Chun-Hung Lin ,  Hong-Sen Chen ,  Yow-Fu Tsai

IPC: A61K36/06 ,  A61K36/09

CPC classification number: A61K36/074 ,  A23L33/105

Abstract: The present invention provides medicinally active extracts and fractions, and a method for preparing the same by extracting and fractioning constituents from the tissue of components of Ganoderma lucidum. These active extracts and fractions are useful for inhibiting tumor growth, modulating immune response, and increasing hematopoietic activity.

Abstract translation: 本发明提供药物活性提取物和级分，以及通过从灵芝组分的组织提取和分馏成分的方法制备该提取物和级分。 这些活性提取物和级分可用于抑制肿瘤生长，调节免疫应答和增加造血活性。

公开(公告)号：US20070080435A1

公开(公告)日：2007-04-12

申请号：US11246403

申请日：2005-10-06

Applicant: Chun-Hung Lin

Inventor： Chun-Hung Lin

IPC: H01L23/495

CPC classification number: H01L23/3128 ,  H01L21/561 ,  H01L23/13 ,  H01L23/49816 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/85 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/07025 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor packaging process comprising following steps is provided. First, a wiring substrate with a first surface and a second surface is provided. Next, a non-solvent type two-stage thermosetting compound is formed on the first surface of the wiring substrate. The non-solvent type two-stage thermosetting compound is then partially-cured such that a non-solvent type B-stage adhesive layer is formed on the first surface of the wiring substrate to provide a carrier for semiconductor packages. Thereafter, a chip is attached on the first surface of the wiring substrate via the B-stage adhesive layer. Ultimately, the chip is electrically connected to the wiring substrate and an encapsulating material is then formed to seal the chip. A carrier for semiconductor packages used the above mentioned packaging process is also provided.

Abstract translation: 提供包括以下步骤的半导体封装工艺。 首先，提供具有第一表面和第二表面的布线基板。 接着，在配线基板的第一面上形成非溶剂型的两级热固性化合物。 然后将非溶剂型两级热固性化合物部分固化，使得在布线基板的第一表面上形成非溶剂型B阶粘合剂层，以提供用于半导体封装的载体。 此后，通过B级粘合剂层将芯片附着在布线基板的第一表面上。 最终，芯片电连接到布线基板，然后形成封装材料以密封芯片。 还提供了使用上述包装处理的半导体封装的载体。

公开(公告)号：US20070045835A1

公开(公告)日：2007-03-01

申请号：US11217978

申请日：2005-08-31

Applicant: Chun-Hung Lin ,  Geng-Shin Shen

Inventor： Chun-Hung Lin ,  Geng-Shin Shen

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L23/3114 ,  H01L23/13 ,  H01L23/36 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A chip package structure includes a substrate, a chip, a first B-stage adhesive, bonding wires, a heat sink and a molding compound. The substrate comprises a first surface, a second surface and a through hole. The chip is arranged on the first surface of the substrate and electrically connected thereto while the through hole of the substrate exposes a portion of the chip. The first B-stage adhesive is arranged between the chip and the first surface of the substrate, and the chip is attached to the substrate through the first B-stage adhesive. The bonding wires are connected between the chip exposed by the through hole and second surface of the substrate. The heat sink is arranged on the first surface of the substrate, covering the chip. The molding compound is arranged on the second surface of the substrate, covering a portion of the substrate and bonding wires.

Abstract translation: 芯片封装结构包括基板，芯片，第一B阶粘合剂，接合线，散热片和模塑料。 基板包括第一表面，第二表面和通孔。 芯片布置在基板的第一表面上并与之电连接，同时基板的通孔暴露芯片的一部分。 第一B级粘合剂布置在芯片和基板的第一表面之间，并且芯片通过第一B级粘合剂附接到基板。 接合线连接在由通孔暴露的芯片和基板的第二表面之间。 散热器布置在基板的第一表面上，覆盖芯片。 模塑料配置在基板的第二表面上，覆盖基板的一部分和接合线。

公开(公告)号：US20060261343A1

公开(公告)日：2006-11-23

申请号：US11295504

申请日：2005-12-07

Applicant: Chia-Hung Hung ,  Chia-Chiang Chang ,  Chun-Hung Lin

Inventor： Chia-Hung Hung ,  Chia-Chiang Chang ,  Chun-Hung Lin

IPC: H01L29/04 ,  H01L21/84

CPC classification number: G09F9/30 ,  G09F9/33

Abstract: A solid-state light emitting display and a fabrication method thereof are proposed. The light emitting display includes a metallic board formed with conductive circuits, and a plurality of luminous microcrystals disposed on a surface of the metallic board and electrically connected to the conductive circuits. The metallic board provides the features of lightness and thinness, and flexibility, and the luminous microcrystals are in the form of light emitting components, so as to improve the luminous efficiency of display and attain the effect of environmental protection and energy saving, thereby providing display technology with performance satisfactory for various display requirements.

Abstract translation: 提出了一种固态发光显示器及其制造方法。 发光显示器包括形成有导电电路的金属板和设置在金属板的表面上并电连接到导电电路的多个发光微晶。 金属板提供了轻薄，柔软的特征，发光微晶是发光元件的形式，以提高显示的发光效率，达到环保节能的效果，从而提供显示 技术性能满足各种显示要求。

公开(公告)号：US20060188018A1

公开(公告)日：2006-08-24

申请号：US11206137

申请日：2005-08-18

Applicant: Chun-Hung Lin

Inventor： Chun-Hung Lin

IPC: H04N11/02 ,  H04N11/04 ,  H04N7/12 ,  H04B1/66

CPC classification number: H04N19/198 ,  H04N19/102 ,  H04N19/176 ,  H04N19/186 ,  H04N19/196 ,  H04N19/51

Abstract: A method and system for motion estimation using chrominance information, which is based on each block of a current frame to find a corresponding block from a previous frame within a search area and accordingly determines a motion vector and includes first separately computing luminance differences and chrominance differences between luminance and chrominance of a target block in a current frame and luminance and chrominance of candidate blocks in a search range of a previous frame, next adjusting the luminance differences based on the first chrominance differences and the second chrominance differences and outputting adjusted luminance differences; and finally finding a minimum one among the adjusted luminance differences and accordingly determining the motion vector.

Abstract translation: 一种使用色度信息的运动估计的方法和系统，其基于当前帧的每个块以从搜索区域内的先前帧中找到相应的块，并因此确定运动矢量，并且包括首先分别计算亮度差和色度差 在当前帧中的目标块的亮度和色度之间以及前一帧的搜索范围内的候选块的亮度和色度，接着基于第一色差和第二色度差来调整亮度差并输出调整的亮度差; 最后在调整后的亮度差中找到最小的亮度差，从而确定运动矢量。

公开(公告)号：US20060094237A1

公开(公告)日：2006-05-04

申请号：US10976376

申请日：2004-10-29

Applicant: Chun-Hung Lin ,  Huang-Yi Huang ,  Yuh-Da Fan

Inventor： Chun-Hung Lin ,  Huang-Yi Huang ,  Yuh-Da Fan

IPC: H01L21/44

CPC classification number: H01L21/76843 ,  H01L21/76861 ,  H01L21/76862 ,  H01L21/76864 ,  H01L21/76865 ,  H01L21/76873

Abstract: A method for the improved electroplating of copper on to a copper seed layer provides treating the surface of a copper seed layer with nitrogen or another anaerobic gas. In another aspect, a burnishing treatment is used to enhance the platability of the copper seed layer. According to another aspect, the seed layer is annealed either at an elevated temperature or for an extended time at room temperature. According to another aspect, the seed layer surface is exposed to a chemical solution that includes a surfactant, chemicals that dissolve contaminants, or both. In another aspect, the deposition of the copper seed layer may be tailored to produce a surface morphology more suited to electroplating. Following the treatment of the seed layer, the copper layer that is electroplated onto the seed layer exhibits improved quality.

Abstract translation: 用于改进铜对铜籽晶层的电镀的方法提供用氮或另一种厌氧气体处理铜籽晶层的表面。 另一方面，使用抛光处理来提高铜种子层的可镀性。 根据另一方面，种子层在升高的温度下或在室温下延长时间退火。 根据另一方面，种子层表面暴露于包含表面活性剂，溶解污染物的化学品或两者的化学溶液。 在另一方面，可以调整铜籽晶层的沉积以产生更适合于电镀的表面形态。 在种子层的处理之后，电镀在籽晶层上的铜层表现出提高的质量。

公开(公告)号：US20050288004A1

公开(公告)日：2005-12-29

申请号：US11156499

申请日：2005-06-17

Applicant: Chun-Hung Lin

Inventor： Chun-Hung Lin

IPC: H04M3/00 ,  H04W88/02

CPC classification number: H04W88/02

Abstract: A wireless telecommunications method for transmitting and receiving data through a wireless telecommunications network that provides at least one of first and second data transmission services includes the steps of configuring a mobile device to determine whether the wireless telecommunications network provides both the first and second data transmission services; and when it is determined that the wireless telecommunications network provides both the first and second data transmission services, enabling operation of the mobile device for selecting one of the first and second data transmission services based on a pre-defined condition, and setting the selected one of the first and second data transmission services as a default data transmission service. A mobile device for realizing the method is also disclosed.

Abstract translation: 一种用于通过提供第一和第二数据传输服务中的至少一个的无线电信网络发送和接收数据的无线电信方法包括以下步骤：配置移动设备以确定无线电信网络是否提供第一和第二数据传输服务 ; 并且当确定所述无线电信网络同时提供所述第一和第二数据传输服务时，使得所述移动设备能够基于预定义条件来选择所述第一和第二数据传输服务之一的操作，并且将所选择的一个 作为默认数据传输服务的第一和第二数据传输服务。 还公开了一种用于实现该方法的移动设备。