Abstract:
A stainless putty composition is provided that includes a liquid portion including vegetable oil, and a solids portion. The solids portion includes one or more of a filler and polymeric plasticizer. The stainless putty composition is essentially free of hydrocarbons.
Abstract:
A method of fabricating a three dimensional integrated circuit comprises forming a redistribution layer on a first side of a packaging component, forming a holding chamber in the redistribution layer, attaching an integrated circuit die on the first side of the packaging component, wherein an interconnect bump of the integrated circuit die is inserted into the holding chamber, applying a reflow process to the integrated circuit die and the packaging component and forming an encapsulation layer on the packaging component.
Abstract:
A menu and application utilizing the menu is provided that provides a sub-list of outcomes associated with a list of options directly in the menu to avoid multiple sub-menus and/or navigation through multiple screens. The menu is particularly beneficial with mobile devices where screen area is at a premium and navigation through multiple screens can be confusing. The outcomes may be folders in which an application stored on the mobile device can be moved, and/or a list of applications that can be unhidden. When moving an application into a folder, a moving mode feature is preferably initiated that enables the user to move the application within the selected folder without having to choose such an option.
Abstract:
This invention relates to the new functional norbornanyl ester derivative and/or polymer compositions which are easily obtainable by reacting the Diels-Alder adduct of appropriate dienes and dienophiles with carboxylic acids. In particular, this invention relates to a new process for making cyclic chemical raw materials suitable for production coating, ink, adhesive, plasticizer, thermoplastic or thermosetting plastic and functional polymers.
Abstract:
A heat dissipation module includes a plurality of fins and a heat pipe connected with the fins. The heat pipe includes a body, which forms an enclosed space, and an inner ring. A wick structure is disposed on the inner surface of the body, and the inner ring is disposed in the enclosed space for increasing a structural strength of the heat pipe. The inner ring is pressed against the top and bottom of the body or in contact with the wick structure located at the top and the bottom of the body, respectively. The inner ring includes at least one opening located close to the top of the body for communicating inside and outside of the inner ring.
Abstract:
A brake disk for bicycles has an inner disk, two outer disks and multiple brake units. The brake units, rather than the outer disks, are used to rub with the disk brake pads. As each brake unit is a small lump, the brake units can be easily made of material with high abrasion resistance, high temperature resistance, and low heat conduction, and the brake units still can sustain sufficient strength. With those features of material, the brake disk for bicycles does not deform easily by the heat, and the glue between the outer disks and the inner disk does not melt easily by the heat from the outer disks. Because each brake unit, which is used to rub, is independent from the outer disks, the outer disks can be made of light material, and the whole weight reduces as well.
Abstract:
In one aspect of the invention, a light emitting device includes an epi layer having multiple layers of semiconductors formed on a substrate, a first electrode and a second electrode having opposite polarities with each other, and electrically coupled to corresponding semiconductor layers, respectively, of the epi layer, and a rod structure formed on the epi layer. The rod structure includes a plurality of rods distanced from each other.
Abstract:
A multi-chip wafer level package comprises three stacked semiconductor dies. A first semiconductor die is embedded in a first photo-sensitive material layer. A second semiconductor die is stacked on top of the first semiconductor die wherein the second semiconductor die is face-to-face coupled to the first semiconductor die. A third semiconductor die is back-to-back attached to the second semiconductor die. Both the second semiconductor die and the third semiconductor die are embedded in a second photo-sensitive material layer. The multi-chip wafer level package further comprises a plurality of through assembly vias formed in the first photo-sensitive material layer and the second photo-sensitive material layer.
Abstract:
A photosensitive resin composition includes: a copolymer obtained by subjecting a conjugated diene polymer having a (meth)acryloyl group, a conjugated diene monomer, and a (meth)acrylic acid monomer to copolymerization; a compound having at least one ethylenically unsaturated group; and a photoinitiator. The copolymer contains 60 wt % to 99 wt % of a copolymer fraction having a molecular weight ranging from 30,000 to 900,000, and 1 wt % to 22 wt % of a copolymer fraction having a molecular weight ranging from 1,000 to 10,000 when calculated from an integral molecular weight distribution curve obtained by plotting cumulative weight percentage versus molecular weight falling within a range between 1,000 and 1,000,000 measured by gel permeation chromatography.
Abstract:
A method of preparing a taste-masking oral dosage form is provided. The method includes providing a first solution comprising a pharmaceutically active ingredient and a starch, providing a second solution comprising a hydrophilic polymer and a surfactant, blending the first and second solution to form a plurality of microparticles by a granulating process, wherein the microparticle is a co-crystal structure comprising the pharmaceutically active ingredient and the starch, and performing a compression-molding process to form the tablet.