公开(公告)号：US10694950B2

公开(公告)日：2020-06-30

申请号：US15293261

申请日：2016-10-13

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Emily R. Kinser ,  John U. Knickerbocker ,  Roy R. Yu

IPC: A61B5/00

Abstract: Surface enhanced Raman spectroscopy is employed to obtain chemical data with respect to body tissue and cells. The chemical environments of stimulation implants and drug-delivery catheters are spectroscopically monitored in real time using an implantable probe. The probe includes a surface enhancer that facilitates surface enhanced Raman spectroscopy in opposing relation to an array of optical fibers. Light emitted by the optical fibers can be employed for chemical detection and/or tissue stimulation. Wavelength and optical power are selected based on whether the probe is employed for such detection or stimulation.

公开(公告)号：US10651134B2

公开(公告)日：2020-05-12

申请号：US16289800

申请日：2019-03-01

Applicant: International Business Machines Corporation

Inventor： Jeffrey Gelorme ,  Li-Wen Hung ,  John U. Knickerbocker

IPC: H01L23/00 ,  H01L25/065 ,  H01L21/768 ,  H01L25/00

Abstract: A method of manufacturing a multi-layer wafer is provided. At least one stress compensating polymer layer is applied to at least one of two heterogeneous wafers. The stress compensating polymer layer is low temperature bonded to the other of the two heterogeneous wafers to form a multi-layer wafer pair. Channels are created between die on at least one of the two heterogeneous wafers. The channels are back filled with one of oxide or polymer to create a channel oxide deposition.

公开(公告)号：US10531797B2

公开(公告)日：2020-01-14

申请号：US15269040

申请日：2016-09-19

Applicant: International Business Machines Corporation

Inventor： John U. Knickerbocker ,  Hyung-Min Lee ,  Kang-Wook Lee

IPC: A61B5/021 ,  A61B5/00 ,  A61B5/02 ,  A61B5/024 ,  A61B5/0402 ,  A61B5/1455

Abstract: An apparatus includes one or more memories storing computer readable code and processor(s). The processor(s), in response to loading and executing the computer readable code, cause the apparatus to perform operations including receiving electrocardiogram data from an electrocardiogram sensor. The electrocardiogram data includes data from an electrocardiogram from a person. The operations also include receiving pulse wave data from one or more pulse wave pressure sensors. The pulse wave data includes data from one or more pulse waves from the person. The operations further include determining blood pressure using the electrocardiogram data or the pulse wave data from the chest and the pulse wave data from the wrist or finger, and outputting an indication of the blood pressure. Another apparatus uses pulse wave data from two pulse wave sensors (e.g., pulse wave pressure sensor(s) and/or PPG sensor(s)) and blood pressure determinations are made using these pulse wave data.

公开(公告)号：US10483215B2

公开(公告)日：2019-11-19

申请号：US15272838

申请日：2016-09-22

Applicant: International Business Machines Corporation

Inventor： Jeffrey Gelorme ,  Li-Wen Hung ,  John U. Knickerbocker

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/58

Abstract: A multi-layer wafer and method of manufacturing such wafer are provided. The method includes applying at least one stress compensating polymer layer to at least one of two heterogeneous wafers and low temperature bonding the two heterogeneous wafers to bond the stress compensating polymer layer to the other of the two heterogeneous wafers to form a multi-layer wafer pair. The multi-layer wafer comprises two heterogeneous wafers, at least one of the heterogeneous wafers having a stress compensating polymer layer. The two heterogeneous wafers are low temperature bonded together to bond the stress compensating polymer layer to the other of the two heterogeneous wafers.

公开(公告)号：US20190229095A1

公开(公告)日：2019-07-25

申请号：US16369390

申请日：2019-03-29

Applicant: International Business Machines Corporation

Inventor： Philip G. Emma ,  Hillery C. Hunter ,  John U. Knickerbocker

IPC: H01L25/065 ,  H01L25/00 ,  G11C29/00 ,  G11C29/56 ,  H01L23/498 ,  H01L23/367 ,  H01L23/544 ,  G02B6/122 ,  H01L25/18 ,  H01L21/78

Abstract: Examples of techniques for an integrated wafer-level processing system are disclosed. In one example implementation according to aspects of the present disclosure, an integrated wafer-level processing system includes a memory wafer and a processing element connected to the memory wafer via a data connection.

公开(公告)号：US20190194506A1

公开(公告)日：2019-06-27

申请号：US15852540

申请日：2017-12-22

Applicant: International Business Machines Corporation

Inventor： Jeffrey D. Gelorme ,  Li-Wen Hung ,  John U. Knickerbocker

IPC: C09J133/12 ,  C09J171/08 ,  C08F2/18 ,  C08K3/04 ,  C09J11/04 ,  C08L33/12

CPC classification number: C09J133/12 ,  C08F2/18 ,  C08K3/04 ,  C08L33/12 ,  C08L2203/20 ,  C09J11/04 ,  C09J171/08 ,  C09J2203/326 ,  C09J2400/10

Abstract: A device wafer is bonded to a handle by a low temperature adhesive bond material that includes a suspended polymer with glass transition temperature greater than room temperature and a diluent polymer that is curable to provide a thermoset polymer upon exposure to ultraviolet radiation, x-ray radiation and/or thermal treatments at low temperature. The suspended polymer and the diluent polymer are mixed to a consistency such that before curing of the diluent polymer the low temperature adhesive bond material exhibits adhesion strength less than 10 Newtons per square centimeter (N/cm2), and after curing of the diluent polymer the low temperature adhesive bond material exhibits adhesion strength not less than about 40 N/cm2.

公开(公告)号：US10314970B2

公开(公告)日：2019-06-11

申请号：US15859344

申请日：2017-12-30

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Joana S. B. T. Maria ,  Bucknell C. Webb ,  Steven L. Wright

IPC: A61M5/168 ,  A61M5/142 ,  A61M5/44 ,  A61M5/172

Abstract: A digital biomedical device includes a substrate forming a reservoir, a membrane comprising a first layer and a second layer having a strain therebetween, the membrane sealing the reservoir, and a controller configured to activate the membrane and release at least a portion of the strain causing the membrane curl and open the reservoir.

公开(公告)号：US10258142B2

公开(公告)日：2019-04-16

申请号：US14942522

申请日：2015-11-16

Applicant: International Business Machines Corporation

Inventor： John U. Knickerbocker ,  Minhua Lu ,  Sufi Zafar

IPC: A61B5/00 ,  A46B15/00 ,  A46B17/08 ,  A46B9/04 ,  A46B11/00 ,  G09G5/00

Abstract: Smart toothbrush designs are provided. In one aspect, a toothbrush is provided which includes: a handle portion; and a head portion attached to the handle portion, wherein the head portion has bristles, a sample testing chamber containing at least one electronic sensor, a removable tip for drawing saliva samples into the sample testing chamber, and a calibration solution reservoir connected to the sample testing chamber. In another aspect, the head portion of the toothbrush has at least one optical sensor. A method for acquiring user data using the present smart toothbrush designs is also provided.

公开(公告)号：US20190090791A1

公开(公告)日：2019-03-28

申请号：US15715558

申请日：2017-09-26

Applicant: International Business Machines Corporation

Inventor： Vince Siu ,  Minhua Lu ,  Evan Colgan ,  Russell Budd ,  John U. Knickerbocker

IPC: A61B5/145 ,  G01N21/64

Abstract: A submersible sensor device configured as a small pellet for testing biological and other liquid samples is provided. In one aspect, a sensing device includes: a housing; and one or more sensors contained within the housing, wherein the housing hermetically seals the sensors such that the sensing device is fully submersible in a liquid analyte. A method and system for analysis of a liquid sample using the present sensing device are also provided.

公开(公告)号：US20180344245A1

公开(公告)日：2018-12-06

申请号：US16054366

申请日：2018-08-03

Applicant: International Business Machines Corporation

Inventor： John U. Knickerbocker ,  Shriya Kumar ,  Jae-Woong Nah

IPC: A61B5/00 ,  H05K3/40 ,  A61M5/00 ,  B23K3/06 ,  H01L21/48 ,  H01L21/768 ,  H01L23/15 ,  H01L23/498 ,  H01L23/532 ,  H05K1/03 ,  H01L23/00 ,  H01L23/66 ,  H01L23/538 ,  B23K101/36

CPC classification number: A61B5/68 ,  A61B2562/12 ,  A61M5/00 ,  A61M2207/00 ,  B23K3/0638 ,  B23K2101/36 ,  H01L21/486 ,  H01L21/76816 ,  H01L21/76852 ,  H01L21/76883 ,  H01L21/76898 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/53228 ,  H01L23/53233 ,  H01L23/53238 ,  H01L23/53242 ,  H01L23/53252 ,  H01L23/53266 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/19 ,  H01L24/20 ,  H01L24/27 ,  H01L24/32 ,  H01L24/64 ,  H01L24/69 ,  H01L24/83 ,  H01L24/89 ,  H01L2223/6677 ,  H01L2224/27312 ,  H01L2224/32111 ,  H01L2224/32235 ,  H01L2224/325 ,  H01L2224/64 ,  H01L2224/69 ,  H01L2224/83801 ,  H01L2224/89 ,  H01L2224/96 ,  H01L2924/014 ,  H01L2924/1434 ,  H01L2924/15332 ,  H05K1/0306 ,  H05K3/4038 ,  H05K2201/0305

Abstract: An apparatus includes a substrate having one or more vias formed therein. At least one of the vias has at least one liner disposed on at least one sidewall thereof. The apparatus also includes at least one interconnect formed through the at least one via. The one or more interconnects comprise a solder material filled using injection molded soldering.