公开(公告)号：US20080303172A1

公开(公告)日：2008-12-11

申请号：US11760949

申请日：2007-06-11

申请人： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler

发明人： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L25/0657 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/16147 ,  H01L2224/16237 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/83141 ,  H01L2224/83191 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2225/06513 ,  H01L2225/06555 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/0401

摘要： Apparatus for packaging two chips includes, in some embodiments, a first chip having at least one elevation and at least one cutout on a bottom thereof. It also includes a second chip having at least one elevation and at least one cutout on a top thereof. In some embodiments disclosed, the elevations and cutouts of the first chip and the second chip are configured to allow the elevations to be intermeshed with the cutouts when the chips are stacked with the bottom of the first chip engaging the top of the second chip.

摘要翻译： 在一些实施例中，用于包装两个芯片的装置包括具有至少一个高度的第一芯片和其底部上的至少一个切口。 它还包括在其顶部具有至少一个仰角和至少一个切口的第二芯片。 在公开的一些实施例中，第一芯片和第二芯片的高度和切口被配置为当芯片堆叠时第一芯片的底部与第二芯片的顶部接合时允许高度与切口相互啮合。

公开(公告)号：US07462940B2

公开(公告)日：2008-12-09

申请号：US11620784

申请日：2007-01-08

申请人： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

发明人： Michael Bauer ,  Alfred Haimerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC分类号： H01L23/50 ,  H01L23/48 ,  H01L23/498 ,  H01L21/00

CPC分类号： H01L23/3192 ,  H01L21/563 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13561 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/3511 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor component includes flip-chip contacts arranged on a wiring structure of a semiconductor chip. The wiring structure includes at least one metallization layer and at least one dielectric insulation layer made of a low-k material with a relative permittivity εr lower than the relative permittivity of a silicon dioxide. The flip-chip contacts are arranged on contact areas of an upper metallization layer and have a polymer core surrounded by a lead-free solder sheath.

摘要翻译： 半导体元件包括布置在半导体芯片的布线结构上的倒装芯片触点。 所述布线结构包括至少一个金属化层和至少一个介电绝缘层，所述介电绝缘层由相对介电常数ε低于二氧化硅的相对介电常数ε的低k材料制成。 倒装芯片触点布置在上金属化层的接触区域上，并且具有由无铅焊接护套包围的聚合物芯。

公开(公告)号：US20080122075A1

公开(公告)日：2008-05-29

申请号：US11612758

申请日：2006-12-19

申请人： Michael Bauer ,  Angela Kessler ,  Wolfgang Schober ,  Alfred Haimerl ,  Joachim Mahler

发明人： Michael Bauer ,  Angela Kessler ,  Wolfgang Schober ,  Alfred Haimerl ,  Joachim Mahler

IPC分类号： H01L21/00 ,  H01L23/34

CPC分类号： H01L23/5385 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/162 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor module includes a module package including a first substrate having a first semiconductor device and a second substrate having a second semiconductor device. A first outer conductor extends from the module package and is connected to the first substrate and a second outer conductor extends from the module package and is connected to the second substrate. A method for producing the semiconductor module includes attaching first outer conductors of a leadframe to a first substrate, where the first substrate includes a first semiconductor device that is attached to the first substrate either before or after attaching the first outer conductors, A second substrate is provided including a signal processing circuit and the second substrate is fastening to second outer conductors of the leadframe.

摘要翻译： 半导体模块包括：模块封装，包括具有第一半导体器件的第一衬底和具有第二半导体器件的第二衬底。 第一外导体从模块封装延伸并连接到第一基板，第二外导体从模块封装延伸并连接到第二基板。 一种半导体模块的制造方法，其特征在于，将引线框架的第一外导体附接到第一基板，第一基板包括在安装第一外导体之前或之后附接到第一基板的第一半导体装置，第二基板 提供包括信号处理电路，并且第二基板紧固到引线框架的第二外导体。

公开(公告)号：US20080112141A1

公开(公告)日：2008-05-15

申请号：US11613897

申请日：2006-12-20

申请人： Michael Bauer ,  Stephan Stoeckl

发明人： Michael Bauer ,  Stephan Stoeckl

IPC分类号： H05K7/00

CPC分类号： H01L23/60 ,  H01L23/495 ,  H01L23/49503 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： The invention relates to a module comprising a carrier element having a lower stiffness or a different structure in a first region than in a second region, and also comprising a component applied to the carrier element. The component and the first region are connected to one another by a wire connection covered by a material.

摘要翻译： 本发明涉及一种模块，其包括在第一区域中具有比在第二区域中更低刚度或不同结构的载体元件，并且还包括施加到载体元件的部件。 部件和第一区域通过被材料覆盖的电线连接而彼此连接。

公开(公告)号：US20080054451A1

公开(公告)日：2008-03-06

申请号：US11470511

申请日：2006-09-06

申请人： Michael Bauer ,  Christian Stuempfl ,  Ludwig Heitzer

发明人： Michael Bauer ,  Christian Stuempfl ,  Ludwig Heitzer

IPC分类号： H01L23/34

CPC分类号： H01L25/0657 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

摘要： Chip arrangement and method for producing a chip arrangementA chip arrangement comprises a first chip with an electrically operable structure on an active surface of the first chip. The first chip is applied on a carrier area in order to make electrical contact with the electrically operable structure via the carrier area. A second chip has a cutout and is arranged on the carrier area, the first chip being arranged in a cavity formed by the cutout and the carrier area.

摘要翻译： 用于制造芯片布置的芯片布置和方法芯片布置包括在第一芯片的有源表面上具有电可操作结构的第一芯片。 第一芯片被施加在载体区域上，以便经由载体区域与电可操作结构电接触。 第二芯片具有切口并布置在载体区域上，第一芯片布置在由切口和载体区域形成的空腔中。

公开(公告)号：US20080029865A1

公开(公告)日：2008-02-07

申请号：US11760819

申请日：2007-06-11

申请人： Michael Bauer ,  Christian Stuempfl ,  Ludwig Heitzer

发明人： Michael Bauer ,  Christian Stuempfl ,  Ludwig Heitzer

IPC分类号： H01L21/98 ,  H01L23/02

CPC分类号： H01L23/3107 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/85001 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic device is produced by providing a carrier wafer formed from at least a semiconductor material, apply a wiring structure with conductor tracks and contact pads to a top side of the carrier wafer so as to form a plurality of semiconductor device positions arranged in rows and columns along the carrier wafer. Integrated circuit chips are applied in the semiconductor device positions and embedded into a plastic housing composition, thereby forming a composite plate including the integrated circuit chips and the plastic housing composition. After curing the plastic housing composition, the carrier wafer is removed.

摘要翻译： 通过提供由至少半导体材料形成的载体晶片来制造电子器件，将具有导体迹线和接触焊盘的布线结构施加到载体晶片的顶侧，以形成排列成行的多个半导体器件位置， 列沿着载体晶片。 将集成电路芯片应用于半导体器件位置并嵌入到塑料外壳组合物中，从而形成包括集成电路芯片和塑料外壳组合物的复合板。 固化塑料外壳组合物后，移除载体晶片。

公开(公告)号：US20070206836A1

公开(公告)日：2007-09-06

申请号：US11713699

申请日：2007-03-05

申请人： Jason Yoon ,  Stefan Weidhaas ,  Michael Bauer

发明人： Jason Yoon ,  Stefan Weidhaas ,  Michael Bauer

IPC分类号： G06K9/00

CPC分类号： B60R21/01538 ,  B60R21/01556 ,  G06K9/00362 ,  G06T7/586 ,  G06T2207/30268

摘要： A device for the detection of an object on a vehicle seat, including a camera and a processing unit for the generation of a two-dimensional representation of the object is provided. The device also includes at least two illumination sources, which are positioned in such a manner that the object can be illuminated from different directions, and the processing unit is suitable to generate a three-dimensional representation of the object from two dimensional representations, each generated under different illumination conditions.

摘要翻译： 提供了一种用于检测车辆座椅上的物体的装置，包括相机和用于产生物体的二维表示的处理单元。 该装置还包括至少两个照明源，其以使得物体可以从不同方向被照射的方式定位，并且处理单元适于从二维表示生成物体的三维表示，每个表示生成 在不同的照明条件下。

公开(公告)号：US20070205518A1

公开(公告)日：2007-09-06

申请号：US11692322

申请日：2007-03-28

申请人： Michael Bauer ,  Alfred Haimerl ,  Khalil Hosseini ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

发明人： Michael Bauer ,  Alfred Haimerl ,  Khalil Hosseini ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC分类号： H01L23/52

CPC分类号： H01L23/3142 ,  B82Y10/00 ,  H01L23/49586 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  Y10S977/742 ,  Y10S977/785 ,  Y10S977/831 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A layer improves adhesion between interfaces of different components in semiconductor devices. The interface of a first component includes surfaces of a circuit carrier and the interface of a second component includes contact surfaces of a plastic package molding compound. The adhesion-improving layer includes a mixture of polymeric chain molecules and carbon nanotubes.

摘要翻译： 一层改善了半导体器件中不同部件的界面之间的粘附。 第一部件的界面包括电路载体的表面，第二部件的界面包括塑料封装模塑料的接触表面。 粘附改善层包括聚合链分子和碳纳米管的混合物。

公开(公告)号：US20070162416A1

公开(公告)日：2007-07-12

申请号：US11323377

申请日：2005-12-29

申请人： Andreas Morsch ,  Horst Schaude ,  Ingo Bruss ,  Michael Bauer

发明人： Andreas Morsch ,  Horst Schaude ,  Ingo Bruss ,  Michael Bauer

IPC分类号： G06F17/30

CPC分类号： G06Q10/00

摘要： In an embodiment of a computer-based system, a database and attributes to access that database are provided. The computer-based system is configured for one or more process controls, each of the one or more process controls comprising a subset of the plurality of attributes. The computer-based system is further configured to enable access to the database using the one or more process controls.

摘要翻译： 在基于计算机的系统的实施例中，提供数据库和访问该数据库的属性。 基于计算机的系统被配置用于一个或多个过程控制，所述一个或多个过程控制中的每一个包括多个属性的子集。 基于计算机的系统还被配置为使得能够使用一个或多个过程控制来访问数据库。

公开(公告)号：US07226235B2

公开(公告)日：2007-06-05

申请号：US10898815

申请日：2004-07-26

申请人： Terry Conway ,  Michael Bauer ,  James Finseth ,  Joel Matheson

发明人： Terry Conway ,  Michael Bauer ,  James Finseth ,  Joel Matheson

IPC分类号： B25G3/20 ,  F16B7/00

CPC分类号： F16B7/0406 ,  Y10T403/551 ,  Y10T403/7058

摘要： A joint, usable as a component of a golf club, including an outer sleeve having a proximal end, a distal end, an outer surface and an inner surface; an inner sleeve having a proximal end, an outer surface in circumscribing contact with the inner surface of the outer sleeve, a slit, and a projection ring having an inner diameter; and an inner projection having a proximal end sized to be in circumscribing contact with the inner surface of the inner sleeve, a distal end, a key sized to be slidably fit in the slit of the inner sleeve, a proximal taper, a distal taper and a maximum diameter, the maximum diameter being larger than the inner diameter of the projection ring, the maximum diameter being selectively passable through the projection ring.

摘要翻译： 一种可用作高尔夫球杆的部件的接头，包括具有近端，远端，外表面和内表面的外套筒; 内套筒，其具有近端，外表面与外套筒的内表面限定接触，狭缝和具有内径的突出环; 以及具有近端尺寸以与内套筒的内表面接触的近端的内突起，远端，尺寸适于可滑动地配合在内套筒狭缝中的钥匙，近端锥形件，远端锥形件和 最大直径，最大直径大于突出环的内径，最大直径可选择性地通过突出环。