公开(公告)号：US07709936B2

公开(公告)日：2010-05-04

申请号：US11613897

申请日：2006-12-20

申请人： Michael Bauer ,  Stephan Stoeckl

发明人： Michael Bauer ,  Stephan Stoeckl

IPC分类号： H01L21/00

CPC分类号： H01L23/60 ,  H01L23/495 ,  H01L23/49503 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： The invention relates to a module comprising a carrier element having a lower stiffness or a different structure in a first region than in a second region, and also comprising a component applied to the carrier element. The component and the first region are connected to one another by a wire connection covered by a material.

摘要翻译： 本发明涉及一种模块，其包括在第一区域中具有比在第二区域中更低刚度或不同结构的载体元件，并且还包括施加到载体元件的部件。 部件和第一区域通过被材料覆盖的电线连接而彼此连接。

公开(公告)号：US07602614B2

公开(公告)日：2009-10-13

申请号：US10562252

申请日：2004-06-04

申请人： Michael Bauer ,  Wolfram Eurskens ,  Rudolf Kerler ,  Heinz Pape ,  Peter Strobel ,  Stephan Stoeckl

发明人： Michael Bauer ,  Wolfram Eurskens ,  Rudolf Kerler ,  Heinz Pape ,  Peter Strobel ,  Stephan Stoeckl

IPC分类号： H05K7/00

CPC分类号： H05K1/184 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/0284 ,  H05K3/105 ,  H05K3/46 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/0919 ,  H05K2201/10446 ,  H05K2203/102 ,  H05K2203/108 ,  H05K2203/1131 ,  H05K2203/1136

摘要： An electronic module and a method for the production thereof is disclosed. In one embodiment, the electronic module has a plurality of components arranged on a wiring block. The wiring block has a plurality of outer sides and has in its volume lines interconnecting contact pads on the outer sides. The contact pads are electrically connected to component connections of the components.

摘要翻译： 公开了电子模块及其制造方法。 在一个实施例中，电子模块具有布置在接线块上的多个部件。 布线块具有多个外侧，并且其体积线将外侧的接触焊盘互连。 接触垫电连接到部件的部件连接。

公开(公告)号：US20080112141A1

公开(公告)日：2008-05-15

申请号：US11613897

申请日：2006-12-20

申请人： Michael Bauer ,  Stephan Stoeckl

发明人： Michael Bauer ,  Stephan Stoeckl

IPC分类号： H05K7/00

CPC分类号： H01L23/60 ,  H01L23/495 ,  H01L23/49503 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： The invention relates to a module comprising a carrier element having a lower stiffness or a different structure in a first region than in a second region, and also comprising a component applied to the carrier element. The component and the first region are connected to one another by a wire connection covered by a material.

摘要翻译： 本发明涉及一种模块，其包括在第一区域中具有比在第二区域中更低刚度或不同结构的载体元件，并且还包括施加到载体元件的部件。 部件和第一区域通过被材料覆盖的电线连接而彼此连接。

公开(公告)号：US20060088954A1

公开(公告)日：2006-04-27

申请号：US10515517

申请日：2003-10-20

申请人： Michael Bauer ,  Christian Birzer ,  Gerald Ofner ,  Stephan Stoeckl

发明人： Michael Bauer ,  Christian Birzer ,  Gerald Ofner ,  Stephan Stoeckl

IPC分类号： H01L21/48 ,  H01L21/50

CPC分类号： H01L21/563 ,  H01L23/3128 ,  H01L2224/0401 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2224/16225 ,  H01L2924/00

摘要： An electronic component and a method for fabricating it is disclosed, where the component comprises a semiconductor chips which has flip-chip contacts. These contacts are fixed on a rewiring substrate, the interspace between the rewiring substrate and the semiconductor chip being filled with a thermoplastic. The glass transition temperature of the thermoplastic is above the highest operating test temperature of the component and below the melting temperature of the solder material for external contacts.

摘要翻译： 公开了一种电子部件及其制造方法，其中该部件包括具有倒装芯片触点的半导体芯片。 这些触点固定在再布线基板上，重新布线基板和半导体芯片之间的间隙被热塑性塑料填充。 热塑性塑料的玻璃化转变温度高于组件的最高工作试验温度，低于用于外部接触的焊料材料的熔化温度。

公开(公告)号：US20060250781A1

公开(公告)日：2006-11-09

申请号：US10562252

申请日：2004-06-04

申请人： Michael Bauer ,  Wolfram Eurskens ,  Rudolf Kerter ,  Heinz Pape ,  Peter Strobe ,  Stephan Stoeckl

发明人： Michael Bauer ,  Wolfram Eurskens ,  Rudolf Kerter ,  Heinz Pape ,  Peter Strobe ,  Stephan Stoeckl

IPC分类号： H05K1/09

CPC分类号： H05K1/184 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/0284 ,  H05K3/105 ,  H05K3/46 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/0919 ,  H05K2201/10446 ,  H05K2203/102 ,  H05K2203/108 ,  H05K2203/1131 ,  H05K2203/1136

摘要： An electronic module and a method for the production thereof is disclosed. In one embodiment, the electronic module has a plurality of components arranged on a wiring block. The wiring block has a plurality of outer sides and has in its volume lines interconnecting contact pads on the outer sides. The contact pads are electrically connected to component connections of the components.

公开(公告)号：US06940156B2

公开(公告)日：2005-09-06

申请号：US10673968

申请日：2003-09-29

申请人： Michael Bauer ,  Christian Birzer ,  Gerald Ofner ,  Stephan Stoeckl

发明人： Michael Bauer ,  Christian Birzer ,  Gerald Ofner ,  Stephan Stoeckl

IPC分类号： H01L23/485 ,  H01L23/02

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An electronic module contains a semiconductor chip that has flexible chip contacts. The flexible chip contacts are disposed on an uppermost metallization layer and have a dimensionally stable contact plate which is connected to contact surfaces on the uppermost metallization layer via electrically conductive components in an elastomeric embedding compound.

摘要翻译： 电子模块包含具有柔性芯片触点的半导体芯片。 柔性芯片触点设置在最上面的金属化层上并且具有尺寸稳定的接触板，其通过弹性体嵌入化合物中的导电部件连接到最上面的金属化层上的接触表面。

公开(公告)号：US20190103347A1

公开(公告)日：2019-04-04

申请号：US15720606

申请日：2017-09-29

申请人： Georg Seidemann ,  Andreas Wolter ,  Stephan Stoeckl ,  Thomas Wagner

发明人： Georg Seidemann ,  Andreas Wolter ,  Stephan Stoeckl ,  Thomas Wagner

IPC分类号： H01L23/498 ,  H01L23/538 ,  H01L23/13 ,  H01L25/065 ,  H05K3/32 ,  H05K3/00

摘要： A system and method for aligning components is disclosed. A system arranges a plurality of components in a first component alignment. The system places two L-shaped fine placement tools in a position surrounding the plurality of components, wherein the L-shaped fine placement tools include a plurality of pins. The system applies a force to the pins included in the two L-shaped fine placement tools to shift the plurality of components from the first component alignment to a second component alignment, wherein the second component alignment has less unused space than the first component alignment. The system removes the two L-shaped fine placement tools. The system attaches the plurality of components to a carrier arranged in the second component alignment.

公开(公告)号：US20180277512A1

公开(公告)日：2018-09-27

申请号：US15464920

申请日：2017-03-21

申请人： Bernd Waidhas ,  Georg Seidemann ,  Andreas Wolter ,  Thomas Wagner ,  Stephan Stoeckl ,  Laurent Millou

发明人： Bernd Waidhas ,  Georg Seidemann ,  Andreas Wolter ,  Thomas Wagner ,  Stephan Stoeckl ,  Laurent Millou

IPC分类号： H01L25/065 ,  H01L23/538 ,  H01L23/498 ,  H01L23/00 ,  H01L21/56 ,  H01L25/00

摘要： An embedded-bridge substrate connector apparatus includes a patterned reference layer to which a first module and a subsequent module are aligned and the two modules are mated at the patterned reference layer. At least one module includes a silicon bridge connector that bridges to two devices, through the patterned reference layer, to the mated module.

公开(公告)号：US20180190589A1

公开(公告)日：2018-07-05

申请号：US15394388

申请日：2016-12-29

申请人： Bernd Waidhas ,  Stephan Stoeckl ,  Andreas Wolter ,  Reinhard Mahnkopf ,  Georg Seidemann ,  Thomas Wagner ,  Laurent Millou

发明人： Bernd Waidhas ,  Stephan Stoeckl ,  Andreas Wolter ,  Reinhard Mahnkopf ,  Georg Seidemann ,  Thomas Wagner ,  Laurent Millou

IPC分类号： H01L23/538 ,  H01L25/065 ,  H01L23/00 ,  H01L21/48 ,  H01L23/053

CPC分类号： H01L23/5386 ,  H01L21/4846 ,  H01L23/053 ,  H01L23/5387 ,  H01L24/14 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/13024 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/15738 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/13099

摘要： A bent-bridge semiconductive apparatus includes a silicon bridge that is integral to a semiconductive device and the silicon bridge is deflected out of planarity. The silicon bridge may couple two semiconductive devices, all of which are from an integral processed die.

公开(公告)号：US20150333022A1

公开(公告)日：2015-11-19

申请号：US14280110

申请日：2014-05-16

申请人： Sven Albers ,  Georg Seidemann ,  Sonja Koller ,  Stephan Stoeckl ,  Shubhada H. Sahasrabudhe ,  Sandeep B. Sane

发明人： Sven Albers ,  Georg Seidemann ,  Sonja Koller ,  Stephan Stoeckl ,  Shubhada H. Sahasrabudhe ,  Sandeep B. Sane

IPC分类号： H01L23/00 ,  H01L23/498

CPC分类号： H01L24/05 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/141 ,  H01L2224/16238 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/0373

摘要： Disclosed herein are contact pads for use with integrated circuit (IC) packages. In some embodiments, a contact pad disclosed herein may be disposed on a substrate of an IC package, and may include a metal projection portion and a metal recess portion. Each of the metal projection portion and the metal recess portion may have a solder contact surface. The solder contact surface of the metal recess portion may be spaced away from the solder contact surface of the metal projection portion. Related devices and techniques are also disclosed herein, and other embodiments may be claimed.

摘要翻译： 这里公开了与集成电路（IC）封装一起使用的接触焊盘。 在一些实施例中，本文公开的接触垫可以设置在IC封装的基板上，并且可以包括金属突出部分和金属凹部。 金属突出部和金属凹部中的每一个可以具有焊料接触表面。 金属凹部的焊接接触表面可以与金属突出部的焊接接触表面间隔开。 本文还公开了相关的设备和技术，并且可以要求保护其他实施例。