Abstract:
Disclosed is a cellulose acylate film containing a compound having at least one connecting group selected from a group consisting of a bivalent connecting group denoted by —NH—(C═O)—O— and a bivalent connecting group denoted by —NH—(C═O)—NR— in which R represents a hydrogen atom or a substituent group, and at least one polar group which is a residue of a compound having a C log P value of less than or equal to 0.85 (however, an aromatic hetero ring-containing group which is a residue of a compound having a C log P value of less than or equal to 0.85 is excluded from the polar group), in which an equivalent weight U obtained as a value which is obtained by dividing a molecular weight by the number of connecting groups included in one molecule is less than or equal to 515.
Abstract:
A polyimide seamless belt for an image forming apparatus, which contains: polyimide containing a segment derived from aromatic diamine, and a segment derived from aromatic tetracarboxylic acid; and two types of carbon black, which are high-structure carbon black capable of imparting high conductivity, and acidic carbon black, where the two types of the carbon black are dispersed in the polyimide seamless belt, wherein the polyimide seamless belt has surface resistivity of 108Ω/□ or less.
Abstract:
The invention concerns a polymer, chosen from polyamide, polyimide and polyamideimide, obtained through polymerisation of at least one or several alkyl-BHT diamine chosen from methyl-bis hexamethylene triamine, ethyl-bis hexamethylene triamine, n-propyl-bis hexamethylene triamine and/or i-propyl-bis hexamethylene triamine, and one or several polycarboxylic acid, chosen from aliphatic polycarboxylic acids, aryl polycarboxylic acids, alkylaryl polycarboxylic acids and arylalkyi polycarboxylic acids, said polymer comprising a minimum amount of alkyl-BHT diamine of 1 mol % relative to the total mole amount of diamine monomers comprised in the polymer, a composition comprising such a polyamide, a shaped article comprising such a composition or such a polyamide, a powder comprising particles comprising such a polyamide and a method of obtaining a shaped article comprising such a polyamide.
Abstract:
A polyetherimide composition comprising a polyetherimide manufactured by reaction of an alkali metal salt of a dihydroxy aromatic compound with a bis(halophthalimide) composition comprising, based on the weight of the bis(halophthalimide) composition, at least 15 wt. % of a 3,3′-bis(halophthalimide) of the formula from more than 17 wt. % to less than 85 wt. % of a 4,3′-bis(halophthalimide) of the formula and from more than 0 to less than 27 wt. % of a 4,4′-bis(halophthalimide) of the formula
Abstract:
A liquid crystal display includes: a first insulation substrate; a second insulation substrate facing the first insulation substrate; a pixel electrode provided on the first insulation substrate; a common electrode provided on the first insulation substrate or the second insulation substrate; an alignment layer member including a first alignment layer and a second alignment layer provided on the first insulation substrate and the second insulation substrate, respectively; and a liquid crystal layer provided between the first insulation substrate and the second insulation substrate, wherein at least one of the first alignment layer and the second alignment layer includes a main chain and a plurality of side chains connected to the main chain, and the side chain includes a reactive mesogen (RM) including a functional group for increasing rigidity of the alignment layer.
Abstract:
Polyimides containing a backbone with at least one nanoparticle component and made from oligomers having endcaps that are difunctional or a mix of di- and monofunctionality are provided. The endcaps may be nadic or phenylethynyl. The backbone may be wholly inorganic or made from a mixture of inorganic and organic groups. The oligomers may be created in-situ using standard polymerization of monomeric reactants chemistry using a solvent or may be provided as a pre-imidized compound that may be either a solid or liquid. It is believed that the nanoparticle component of the polymer backbone provides superior thermo-oxidative stability verses unmodified organic backbones. It is further believed that providing difunctional or a mixture of di- and monofunctional endcaps allows for increased crosslinking to provide improved strength and stiffness verses wholly monofunctional endcapped oligomers for polyimides. The nanoparticle is part of the backbone of the polymer and not solely a pendant group.
Abstract:
A composition for preparing a polyimide-inorganic particle composite, including a tetracarboxylic acid dianhydride represented by Chemical Formula 1, a diamine represented by Chemical Formula 2, and an inorganic particle having an amino group on its surface: wherein the definitions of groups R1 and R2 in Chemical Formula 1 and Chemical Formula 2 are the same as described in the detailed description.
Abstract:
A photosensitive polyimide composition; the composition comprises a base agent and a curing agent comprising a photoinitiator. By applying an aliphatic diamine monomer, which has a long carbon chain, and a grafting monomer, which has a main carbon chain having a double bond and an epoxy group at two ends respectively, to a method of making the base agent, a mixture of the base agent and the curing agent can be screen printed to form a photosensitive polyimide film on a copper foil. Also, the photosensitive polyimide film can be exposed under low exposure energy, and can be developed to a solder-resistant polyimide thin film by a weak alkaline developer after exposed. In addition, the solder-resistant polyimide thin film has low dielectric constant, low dielectric loss, good flame resistance, good solder resistance, and good pencil hardness. Accordingly, the photosensitive polyimide composition is applicable to high density flexible printed circuit boards.
Abstract:
To provide a covering material for a heat resistant electric wire, which can cover a core wire without breakage from a weld line and which is excellent in the stress crack resistance at high temperature.A covering material for a heat resistant electric wire, which comprises a fluorinated copolymer composition containing a melt-moldable fluorinated copolymer (A) and a non-fluorinated thermoplastic resin (B1) in a volume ratio of (A)/(B1)=99/1 to 60/40, wherein the non-fluorinated thermoplastic resin (B1) is contained in the fluorinated copolymer composition in the form of fine particles having an average dispersed particle size of at most 8 μm, and the fluorinated copolymer composition has a storage elastic modulus of at least 90 MPa by dynamic viscoelasticity measurement at 200° C. Instead of the non-fluorinated thermoplastic resin (B1), a non-fluorinated resin (B2) having no melting point at 450° C. or below may be contained in the form of fine particles having an average dispersed particle size of at most 8 μm.