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    MICRO SENSOR
    121.
    发明申请
    MICRO SENSOR 审中-公开

    公开(公告)号：US20180045663A1

    公开(公告)日：2018-02-15

    申请号：US15674127

    申请日：2017-08-10

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

    IPC: G01N27/12 ,  G01N33/00

    CPC classification number: G01N27/128 ,  G01N33/0016 ,  G01N33/0031

    Abstract: Disclosed is a micro sensor. Particularly, a first sensor electrode is provided on a first side of a substrate, a second sensor electrode is provided on a second side of the substrate, and the substrate is provided with an etching hole penetrating from the first side to the second side of the substrate. A sensing material provided between the first sensor electrode and the second sensor electrode is inserted in the etching hole. When detecting gas, the micro sensor can minimize influence of moisture in air.

    Array substrate for mounting chip and method for manufacturing the same
    122.
    发明授权
    Array substrate for mounting chip and method for manufacturing the same 有权

    公开(公告)号：US09847462B2

    公开(公告)日：2017-12-19

    申请号：US14525478

    申请日：2014-10-28

    Applicant: Point Engineering Co., Ltd.

    Inventor： Ki Myung Nam ,  Seung Ho Park ,  Young Chul Jun

    IPC: H01L33/48 ,  H01L23/00

    CPC classification number: H01L33/486 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2924/12041 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: Provided is an array substrate for mounting a chip. The array substrate includes a plurality of conductive layers unidirectionally stacked with respect to an original chip substrate; a plurality of insulating layers alternately stacked with the plurality of conductive layers, and electrically separate the plurality of conductive layers; and a cavity having a groove of a predetermined depth with respect to a region including the plurality of insulating layers in an upper surface of the original chip substrate. Accordingly, since the optical device array of a single structure is used as a line source of light, an emission angle emitted from the optical device is great, it is not necessary to form an interval for supplying an amount of light, and a display device can be simply constructed. Further, since it is not necessary to perform soldering a plurality of LED packages on a printed circuit board, a thickness of a back light unit can be reduced.

    LED metal substrate package and method of manufacturing same
    123.
    发明授权
    LED metal substrate package and method of manufacturing same 有权

    公开(公告)号：US09768369B2

    公开(公告)日：2017-09-19

    申请号：US15392090

    申请日：2016-12-28

    Applicant: Point Engineering Co., Ltd.

    Inventor： Bum Mo Ahn ,  Seung Ho Park

    IPC: H01L33/48 ,  H01L33/62 ,  H01L33/38

    CPC classification number: H01L33/62 ,  H01L33/38 ,  H01L33/486 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0016 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014

    Abstract: The present invention relates to an LED metal substrate package, and particularly, to an LED metal substrate package having a heat dissipating structure, and a method of manufacturing same. The method comprises at least the steps of: forming at least one cavity having a groove of a predetermined depth in a metal substrate that is electrically separated by at least one vertical insulation layer, the cavity having one vertical insulation layer built in a floor thereof; treating all surfaces, except portions of the top surface of the metal substrate formed in the respective cavities, with shadow masking; removing an oxide film formed on the surface portions that have not been treated with masking; depositing an electrode layer on each of the surface portions of the oxide layer that have been removed; removing the shadow mask; performing Au/Sn soldering on the electrode layer and bonding an optical device chip; and wire bonding one electrode of the optical device, disposed on one side of the metal substrate with respect to each of the vertical insulation layers, through wires to the metal substrate disposed on the other side of each of the vertical insulation layers. The present invention forms solder using Au/Sn material, which has good heat dissipating characteristics and good bonding characteristics, on the electrode layer to bond an optical device chip, so as to have excellent heat dissipating performance compared to existing LED metal packages that use Ag epoxy.

    LED metal substrate package and method of manufacturing same
    128.
    发明授权
    LED metal substrate package and method of manufacturing same 有权
    LED金属基板封装及其制造方法

    公开(公告)号：US09559276B2

    公开(公告)日：2017-01-31

    申请号：US14650672

    申请日：2013-12-06

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park

    IPC: H01L33/62 ,  H01L33/48

    CPC classification number: H01L33/62 ,  H01L33/38 ,  H01L33/486 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2933/0016 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014

    Abstract: The present invention relates to an LED metal substrate package, and particularly, to an LED metal substrate package having a heat dissipating structure, and a method of manufacturing same. The method comprises at least the steps of: forming at least one cavity having a groove of a predetermined depth in a metal substrate that is electrically separated by at least one vertical insulation layer, the cavity having one vertical insulation layer built in a floor thereof; treating all surfaces, except portions of the top surface of the metal substrate formed in the respective cavities, with shadow masking; removing an oxide film formed on the surface portions that have not been treated with masking; depositing an electrode layer on each of the surface portions of the oxide layer that have been removed; removing the shadow mask; performing Au/Sn soldering on the electrode layer and bonding an optical device chip; and wire bonding one electrode of the optical device, disposed on one side of the metal substrate with respect to each of the vertical insulation layers, through wires to the metal substrate disposed on the other side of each of the vertical insulation layers. The present invention forms solder using Au/Sn material, which has good heat dissipating characteristics and good bonding characteristics, on the electrode layer to bond an optical device chip, so as to have excellent heat dissipating performance compared to existing LED metal packages that use Ag epoxy.

    Abstract translation: 本发明涉及一种LED金属基板封装，特别涉及具有散热结构的LED金属基板封装及其制造方法。 该方法至少包括以下步骤：在至少一个垂直绝缘层电隔离的金属基板中形成具有预定深度的凹槽的至少一个空腔，该空腔具有内置在其底板中的一个垂直绝缘层; 除了形成在各个空腔中的金属基板的顶表面的部分之外，用阴影掩模处理所有表面; 去除未被掩蔽处理的表面部分上形成的氧化膜; 在去除的氧化物层的每个表面部分上沉积电极层; 去除荫罩; 在电极层上执行Au / Sn焊接并粘合光学器件芯片; 并且将配置在所述金属基板的与所述垂直绝缘层中的每一个垂直的绝缘层的一侧配置的所述光学元件的一个电极通过布线连接到设置在所述垂直绝缘层的另一侧的所述金属基板。 本发明使用在电极层上具有良好的散热特性和良好的结合特性的Au / Sn材料来形成焊接，以便与光学器件芯片接合，从而与使用Ag的现有LED金属封装相比具有优异的散热性能 环氧树脂。

    CHIP SUBSTRATE COMPRISING A GROOVE PORTION AND CHIP PACKAGE USING THE CHIP SUBSTRATE
    130.
    发明申请
    CHIP SUBSTRATE COMPRISING A GROOVE PORTION AND CHIP PACKAGE USING THE CHIP SUBSTRATE 有权
    使用芯片衬底的包含沟槽部分和芯片封装的芯片衬底

    公开(公告)号：US20160380168A1

    公开(公告)日：2016-12-29

    申请号：US14753915

    申请日：2015-06-29

    Applicant: Point Engineering Co., Ltd.

    Inventor： Sin Seok HAN ,  Soo Young CHOI ,  Ki Myung NAM

    IPC: H01L33/58 ,  H05K1/02 ,  H05K1/03 ,  H01L33/48 ,  H01L33/62

    CPC classification number: H01L33/58 ,  H01L33/44 ,  H01L33/486 ,  H01L33/62

    Abstract: Disclosed is a chip substrate. The chip substrate includes: conductive portions laminated in one direction to constitute the chip substrate; insulation portions alternately laminated with the conductive portions to electrically isolate the conductive portions; a cavity formed at a predetermined depth in a recessed shape in a region including the insulation portions on an upper surface of the chip substrate; and a groove portion disposed outside the cavity in a spaced-apart relationship with the cavity and formed at a predetermined depth in a recessed shape. According to the present invention, an adhesive agent is applied in a groove portion formed in advance. It is therefore possible to prevent the adhesive agent from being exposed to the light emitted from optical elements and to prevent the adhesive agent from being denatured. This makes it possible to enhance the reliability of lens bonding. Furthermore, there is no need to use an expensive resistant adhesive agent. An existing typical adhesive agent may be used as it is. This provides an effect of saving costs. Thus, there is an advantage in that a low-priced existing bonding material may be applied to a high-priced UV-C (deep-UV) package.

    Abstract translation: 公开了一种芯片基板。 芯片基板包括：在一个方向上层叠以构成芯片基板的导电部分; 绝缘部分与导电部分交替地层叠以电绝缘导电部分; 在所述芯片基板的上表面的包含所述绝缘部的区域中形成为凹状的预定深度的空腔; 以及凹槽部分，以与空腔间隔开的关系设置在空腔外部，并以预定的凹陷形状形成。 根据本发明，在预先形成的槽部中涂布粘接剂。 因此，可以防止粘合剂暴露于从光学元件发出的光并防止粘合剂变性。 这使得可以提高透镜粘合的可靠性。 此外，不需要使用昂贵的耐热粘合剂。 可以直接使用现有的典型粘合剂。 这提供了节省成本的效果。 因此，优点在于低价格的现有粘合材料可以应用于高价位UV-C（深UV）封装。

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