公开(公告)号：US08034213B2

公开(公告)日：2011-10-11

申请号：US11694083

申请日：2007-03-30

Applicant: Naoki Matsumoto ,  Yoshinobu Hayakawa ,  Hidetoshi Hanaoka ,  Noriaki Kodama ,  Chishio Koshimizu ,  Manabu Iwata ,  Satoshi Tanaka

Inventor： Naoki Matsumoto ,  Yoshinobu Hayakawa ,  Hidetoshi Hanaoka ,  Noriaki Kodama ,  Chishio Koshimizu ,  Manabu Iwata ,  Satoshi Tanaka

IPC: H01L21/00 ,  C23C16/00

CPC classification number: H01J37/32174 ,  H01J37/32091

Abstract: A plasma processing apparatus includes a processing vessel capable of being vacuum evacuated; a first electrode disposed in the processing vessel in a state electrically floating via an insulating member or a space; a second electrode, arranged in the processing vessel to face and be in parallel to the first electrode with a specific interval, supporting a substrate to be processed; a processing gas supply unit for supplying a desired processing gas into a processing space surrounded by the first electrode, the second electrode and a sidewall of the processing vessel; and a first radio frequency power supply unit for applying a first radio frequency power to the second electrode to generate a plasma of the processing gas in the processing space. An electrostatic capacitance between the first electrode and the processing vessel is set such that a desired plasma density distribution is obtained for the generated plasma.

Abstract translation: 一种等离子体处理装置，其特征在于，包括：真空抽真空处理容器; 以处于通过绝缘构件或空间电浮动的状态设置在处理容器中的第一电极; 第二电极，布置在处理容器中以特定间隔面对并平行于第一电极，支撑待处理的基板; 处理气体供给单元，用于将期望的处理气体供给到被处理容器的第一电极，第二电极和侧壁包围的处理空间中; 以及第一射频电源单元，用于向所述第二电极施加第一射频功率以在所述处理空间中产生所述处理气体的等离子体。 第一电极和处理容器之间的静电电容被设定为使得所产生的等离子体获得期望的等离子体密度分布。

公开(公告)号：US20110235675A1

公开(公告)日：2011-09-29

申请号：US13069568

申请日：2011-03-23

Applicant: Tatsuo Matsudo ,  Chishio Koshimizu

Inventor： Tatsuo Matsudo ,  Chishio Koshimizu

IPC: G01J5/08 ,  G01J5/02

CPC classification number: H01L21/67109 ,  H01L21/67248 ,  H01L21/6831 ,  H01L21/68742

Abstract: There is provided a substrate mounting table capable of accurately measuring a temperature of a wafer supported on the substrate mounting table without incurring contamination within a chamber and without forming a hole for measuring a temperature in the substrate mounting table. The substrate mounting table includes a mounting surface 90a configured to mount a wafer W thereon; a substrate lifting unit 80 configured to lift the wafer W by a lift pin 84 from the mounting surface 90a; and a light irradiating/receiving unit 87 configured to irradiate a measurement light beam 88 as a low-coherence light beam to the wafer W through an inside of the lift pin 84 serving as an optical path and receive reflected light beams from a front surface and a rear surface of the wafer W. The light irradiating/receiving unit 87 is fixed to a base plate 86 of the substrate lifting unit 80.

Abstract translation: 提供了一种能够精确地测量支撑在基板安装台上的晶片的温度而不引起室内的污染并且不形成用于测量基板安装台的温度的孔的基板安装台。 基板安装台包括安装表面90a，其安装在其上的晶片W; 基板提升单元80，被配置为通过提升销84从安装表面90a提升晶片W; 以及光照射/接收单元87，被配置为通过用作光路的提升销84的内部将作为低相干光束的测量光束88照射到晶片W，并且从前表面接收反射光束， 晶片W的后表面。光照射/接收单元87固定到基板提升单元80的基板86上。

公开(公告)号：US20110214815A1

公开(公告)日：2011-09-08

申请号：US13113330

申请日：2011-05-23

Applicant: Akira Koshiishi ,  Masaru Sugimoto ,  Kunihiko Hinata ,  Noriyuki Kobayashi ,  Chishio Koshimizu ,  Ryuji Ohtani ,  Kazuo Kibi ,  Masashi Saito ,  Naoki Matsumoto ,  Manabu Iwata ,  Daisuke Yano ,  Yohei Yamazawa ,  Hidetoshi Hanaoka ,  Toshihiro Hayami ,  Hiroki Yamazaki ,  Manabu Sato

Inventor： Akira Koshiishi ,  Masaru Sugimoto ,  Kunihiko Hinata ,  Noriyuki Kobayashi ,  Chishio Koshimizu ,  Ryuji Ohtani ,  Kazuo Kibi ,  Masashi Saito ,  Naoki Matsumoto ,  Manabu Iwata ,  Daisuke Yano ,  Yohei Yamazawa ,  Hidetoshi Hanaoka ,  Toshihiro Hayami ,  Hiroki Yamazaki ,  Manabu Sato

IPC: H01L21/3065

CPC classification number: H01J37/32091 ,  H01J37/32082 ,  H01J37/32174 ,  H01J37/3244 ,  H01J37/32697 ,  H01J37/32706 ,  H01J2237/334 ,  H01L21/3065

Abstract: An apparatus includes an upper electrode and a lower electrode for supporting a wafer disposed opposite each other within a process chamber. A first RF power supply configured to apply a first RF power having a relatively higher frequency, and a second RF power supply configured to apply a second RF power having a relatively lower frequency is connected to the lower electrode. A variable DC power supply is connected to the upper electrode. A process gas is supplied into the process chamber to generate plasma of the process gas so as to perform plasma etching.

Abstract translation: 一种装置包括用于支撑在处理室内相对设置的晶片的上电极和下电极。 被配置为施加具有相对较高频率的第一RF功率的第一RF电源和被配置为施加具有相对较低频率的第二RF功率的第二RF电源连接到下电极。 可变直流电源连接到上电极。 将工艺气体供应到处理室中以产生处理气体的等离子体，以进行等离子体蚀刻。

公开(公告)号：US07988816B2

公开(公告)日：2011-08-02

申请号：US11157061

申请日：2005-06-21

Applicant: Akira Koshiishi ,  Masaru Sugimoto ,  Kunihiko Hinata ,  Noriyuki Kobayashi ,  Chishio Koshimizu ,  Ryuji Ohtani ,  Kazuo Kibi ,  Masashi Saito ,  Naoki Matsumoto ,  Yoshinobu Ooya ,  Manabu Iwata ,  Daisuke Yano ,  Yohei Yamazawa ,  Hidetoshi Hanaoka ,  Toshihiro Hayami ,  Hiroki Yamazaki ,  Manabu Sato

Inventor： Akira Koshiishi ,  Masaru Sugimoto ,  Kunihiko Hinata ,  Noriyuki Kobayashi ,  Chishio Koshimizu ,  Ryuji Ohtani ,  Kazuo Kibi ,  Masashi Saito ,  Naoki Matsumoto ,  Yoshinobu Ooya ,  Manabu Iwata ,  Daisuke Yano ,  Yohei Yamazawa ,  Hidetoshi Hanaoka ,  Toshihiro Hayami ,  Hiroki Yamazaki ,  Manabu Sato

IPC: C23C16/00 ,  C23F1/00 ,  H01L21/306 ,  H05B31/26

CPC classification number: H01J37/32422 ,  H01J37/32018 ,  H01J37/32091 ,  H01J37/3244 ,  H01J37/32522 ,  H01J37/32834 ,  H01J2237/2001 ,  H01J2237/334 ,  H01J2237/3344 ,  H01L21/67069 ,  Y10S156/915

Abstract: A plasma etching apparatus includes an upper electrode and a lower electrode, between which plasma of a process gas is generated to perform plasma etching on a wafer W. The apparatus further comprises a cooling ring disposed around the wafer, a correction ring disposed around the cooling ring, and a variable DC power supply directly connected to the correction ring, the DC voltage being preset to provide the correction ring with a negative bias, relative to ground potential, for attracting ions in the plasma and to increase temperature of the correction ring to compensate for a decrease in temperature of a space near the edge of the target substrate due to the cooling ring.

Abstract translation: 等离子体蚀刻装置包括上电极和下电极，在其间产生处理气体的等离子体以在晶片W上进行等离子体蚀刻。该装置还包括设置在晶片周围的冷却环，设置在冷却周围的校正环 环和直接连接到校正环的可变直流电源，所述直流电压被预设为向校正环提供相对于地电位的负偏压，用于吸引等离子体中的离子并将校正环的温度增加到 补偿由于冷却环导致的目标基板的边缘附近的空间的温度的降低。

公开(公告)号：US20110094997A1

公开(公告)日：2011-04-28

申请号：US12913183

申请日：2010-10-27

Applicant: Yohei Yamazawa ,  Masashi Saito ,  Kazuki Denpoh ,  Chishio Koshimizu ,  Jun Yamawaku

Inventor： Yohei Yamazawa ,  Masashi Saito ,  Kazuki Denpoh ,  Chishio Koshimizu ,  Jun Yamawaku

IPC: C23F1/08 ,  C23C16/505 ,  H05H1/24 ,  C23F1/00

CPC classification number: H01J37/3211 ,  H01J37/321 ,  H01J37/32174 ,  H01J37/3244 ,  H01J2237/334 ,  H01L21/67069 ,  H01L21/6831 ,  H05H1/46

Abstract: A plasma processing apparatus includes: an evacuable processing chamber including a dielectric window; a substrate supporting unit, provided in the processing chamber, for mounting thereon a target substrate; a processing gas supply unit for supplying a desired processing gas to the processing chamber to perform a plasma process on the target substrate; a first RF antenna, provided on the dielectric window, for generating a plasma by an inductive coupling in the processing chamber; and a first RF power supply unit for supplying an RF power to the first RF antenna. The first RF antenna includes a primary coil provided on or above the dielectric window and electrically connected to the first RF power supply unit;and a secondary coil provided such that the coils are coupled with each other by an electromagnetic induction therebetween while being arranged closer to a bottom surface of the dielectric window than the primary coil.

Abstract translation: 一种等离子体处理装置，包括：具有电介质窗的可抽空处理室; 基板支撑单元，设置在处理室中，用于在其上安装目标基板; 处理气体供给单元，用于向所述处理室供给期望的处理气体，以在所述目标基板上进行等离子体处理; 设置在电介质窗口上的第一RF天线，用于通过处理室中的感应耦合产生等离子体; 以及用于向第一RF天线提供RF功率的第一RF电源单元。 第一RF天线包括设置在电介质窗口上或电介质窗上方的电连接到第一RF电源单元的初级线圈; 以及次级线圈，其被设置成使得线圈通过其间的电磁感应彼此耦合，同时布置成比初级线圈更靠近电介质窗口的底表面。

公开(公告)号：US20100304572A1

公开(公告)日：2010-12-02

申请号：US12791095

申请日：2010-06-01

Applicant: Chishio Koshimizu

Inventor： Chishio Koshimizu

IPC: H01L21/3065 ,  C23F1/08 ,  H01L21/306

CPC classification number: H01J37/32623 ,  H01J37/32091 ,  H01J37/32642

Abstract: An optimum application voltage for reducing deposits on a peripheral portion of a substrate as well as improving a process result in balance is effectively found without changing a height of a focus ring. A plasma processing apparatus includes a focus ring which includes a dielectric ring provided so as to surround a substrate mounting portion of a mounting table and a conductive ring provided on the dielectric ring; a voltage sensor configured to detect a floating voltage of the conductive ring; a DC power supply configured to apply a DC voltage to the conductive ring. An optimum voltage to be applied to the conductive ring is obtained based on a floating voltage actually detected from the conductive ring, and the optimum application voltage is adjusted based on a variation in the actually detected floating voltage for each plasma process.

Abstract translation: 在不改变聚焦环的高度的情况下，有效地发现用于减少衬底的周边部分上的沉积物以及改善平衡处理结果的最佳施加电压。 一种等离子体处理装置包括聚焦环，该聚焦环包括设置成围绕安装台的基板安装部分设置的介质环和设置在介质环上的导电环; 电压传感器，被配置为检测所述导电环的浮置电压; DC电源，被配置为向所述导电环施加DC电压。 基于从导电环实际检测到的浮动电压，获得施加到导电环的最佳电压，并且基于每个等离子体处理的实际检测到的浮动电压的变化来调整最佳施加电压。

公开(公告)号：US20100213171A1

公开(公告)日：2010-08-26

申请号：US12700177

申请日：2010-02-04

Applicant: Chishio Koshimizu ,  Jun Yamawaku ,  Tatsuo Matsudo ,  Masashi Saito

Inventor： Chishio Koshimizu ,  Jun Yamawaku ,  Tatsuo Matsudo ,  Masashi Saito

IPC: C23F1/00 ,  C23F1/08

CPC classification number: H05H1/24 ,  H01J37/32091 ,  H01J37/32522 ,  H01J37/32642 ,  H01J2237/334

Abstract: There are provided a method of heating a focus ring and a plasma etching apparatus, capable of simplifying a structure of a heating mechanism without a dummy substrate. The plasma etching apparatus includes a vacuum processing chamber; a lower electrode serving as a mounting table for mounting a substrate thereon; an upper electrode provided to face the lower electrode; a gas supply unit for supplying a processing gas; a high frequency power supply for supplying a high frequency power to the lower electrode to generate a plasma of the processing gas; and a focus ring provided on the lower electrode to surround a periphery of the substrate. In the plasma etching apparatus, the focus ring is heated by irradiating a heating light thereto from a light source provided outside the vacuum processing chamber.

Abstract translation: 提供了一种加热聚焦环和等离子体蚀刻装置的方法，其能够简化没有虚设基板的加热机构的结构。 等离子体蚀刻装置包括真空处理室; 用作安装基板的安装台的下电极; 设置成面向下电极的上电极; 用于提供处理气体的气体供应单元; 用于向下电极提供高频电力以产生处理气体的等离子体的高频电源; 以及设置在下电极上以围绕基板的周边的聚焦环。 在等离子体蚀刻装置中，通过从设置在真空处理室外侧的光源照射加热光来对聚焦环进行加热。

公开(公告)号：US07740737B2

公开(公告)日：2010-06-22

申请号：US11156559

申请日：2005-06-21

Applicant: Akira Koshiishi ,  Masaru Sugimoto ,  Kunihiko Hinata ,  Noriyuki Kobayashi ,  Chishio Koshimizu ,  Ryuji Ohtani ,  Kazuo Kibi ,  Masashi Saito ,  Naoki Matsumoto ,  Manabu Iwata ,  Daisuke Yano ,  Yohei Yamazawa

Inventor： Akira Koshiishi ,  Masaru Sugimoto ,  Kunihiko Hinata ,  Noriyuki Kobayashi ,  Chishio Koshimizu ,  Ryuji Ohtani ,  Kazuo Kibi ,  Masashi Saito ,  Naoki Matsumoto ,  Manabu Iwata ,  Daisuke Yano ,  Yohei Yamazawa

IPC: C23F1/00 ,  H01L21/306

CPC classification number: H01J37/32091 ,  H01J37/32082 ,  H01J37/32174 ,  H01J37/32348 ,  H01J37/3244 ,  H01J37/32541 ,  H01J37/32568 ,  H01J37/32642 ,  H01J37/32706 ,  H01J37/32834 ,  H01J2237/3344 ,  H01L21/02126 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/31116 ,  H01L21/31138 ,  H01L21/31144 ,  H01L21/67069

Abstract: An apparatus includes an upper electrode and a lower electrode for supporting a wafer disposed opposite each other within a process chamber. A first RF power supply configured to apply a first RF power having a relatively higher frequency is connected to the upper electrode. A second RF power supply configured to apply a second RF power having a relatively lower frequency is connected to the lower electrode. A variable DC power supply is connected to the upper electrode. A process gas is supplied into the process chamber while any one of application voltage, application current, and application power from the variable DC power supply to the upper electrode is controlled, to generate plasma of the process gas so as to perform plasma etching.

Abstract translation: 一种装置包括用于支撑在处理室内相对设置的晶片的上电极和下电极。 被配置为施加具有相对较高频率的第一RF功率的第一RF电源连接到上电极。 配置为施加具有相对较低频率的第二RF功率的第二RF电源连接到下电极。 可变直流电源连接到上电极。 将处理气体供给到处理室中，同时控制来自可变直流电源到上部电极的施加电压，施加电流和施加电力中的任何一个，以产生处理气体的等离子体，以进行等离子体蚀刻。

公开(公告)号：US20090255800A1

公开(公告)日：2009-10-15

申请号：US12415466

申请日：2009-03-31

Applicant: Chishio Koshimizu

Inventor： Chishio Koshimizu

IPC: H05H1/24 ,  H01L21/3065 ,  C23C16/513

CPC classification number: H01J37/32165 ,  H01J37/32091

Abstract: A plasma processing apparatus includes a vacuum evacuable processing chamber; a first electrode for supporting a substrate to be processed in the processing chamber; a processing gas supply unit for supplying a processing gas into a processing space; a plasma excitation unit for generating a plasma by exciting the processing gas in the processing chamber; a first radio frequency power supply unit for supplying a first radio frequency power to the first electrode to attract ions in the plasma to the substrate; and a first radio frequency power amplitude modulation unit for modulating an amplitude of the first radio frequency power at a predetermined interval. The plasma processing apparatus further includes a first radio frequency power frequency modulation unit for modulating a frequency of the first radio frequency power in substantially synchronously with the amplitude modulation of the first radio frequency power.

Abstract translation: 等离子体处理装置包括真空排气处理室; 用于在所述处理室中支撑待处理的基板的第一电极; 处理气体供应单元，用于将处理气体供应到处理空间中; 等离子体激发单元，用于通过激励处理室中的处理气体来产生等离子体; 第一射频电源单元，用于向第一电极提供第一射频功率以将等离子体中的离子吸引到衬底; 以及用于以预定间隔调制第一射频功率的幅度的第一射频功率幅度调制单元。 等离子体处理装置还包括第一射频功率频率调制单元，用于与第一射频功率的幅度调制基本同步地调制第一射频功率的频率。

公开(公告)号：US20090051924A1

公开(公告)日：2009-02-26

申请号：US12185888

申请日：2008-08-05

Applicant: Masafumi ITO ,  Yasuyuki Okamura ,  Tatsuo Shiina ,  Nobuo Ishii ,  Tomohiro Suzuki ,  Chishio Koshimizu

Inventor： Masafumi ITO ,  Yasuyuki Okamura ,  Tatsuo Shiina ,  Nobuo Ishii ,  Tomohiro Suzuki ,  Chishio Koshimizu

IPC: G01B11/06

CPC classification number: G01J5/0003 ,  G01K11/12

Abstract: An apparatus for measuring thickness is provided. A light source irradiates a front surface or a rear surface of a substrate with a light. A splitter splits the light into a reference light and a measurement light. The reference light is reflected by a reference light reflecting device. An optical path changing device changes an optical path length of light reflected from the reference light reflecting device. A light receiving device measures an interference of the reflected light from the substrate and the reference light from the reference light reflecting device. A thickness of at least one of the front surface, rear surface or inside of the substrate is measured based on a measurement of the interference.

Abstract translation: 提供了一种测量厚度的装置。 光源用光照射基板的前表面或后表面。 分流器将光分成参考光和测量光。 参考光被参考光反射装置反射。 光路改变装置改变从参考光反射装置反射的光的光路长度。 光接收装置测量来自基板的反射光和来自参考光反射装置的基准光的干涉。 基于干涉的测量来测量衬底的前表面，后表面或内部中的至少一个的厚度。