公开(公告)号：US20160005936A1

公开(公告)日：2016-01-07

申请号：US14769198

申请日：2014-01-15

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Stefan Illek ,  Hans-Jürgen Lugauer ,  Jürgen Moosburger ,  Thomas Schwarz ,  Tansen Varghese

IPC: H01L33/54 ,  H01L33/62 ,  H01L33/50 ,  H01L33/00

CPC classification number: H01L33/54 ,  H01L33/005 ,  H01L33/0095 ,  H01L33/50 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A method can be used for for producing an optoelectronic component. An optoelectronic semiconductor chip has a front face and a rear face. A sacrificial layer is applied to the rear face. A molded body is formed the optoelectronic semiconductor chip being at least partially embedded in the molded body. The sacrificial layer is removed.

Abstract translation: 一种方法可用于制造光电子元件。 光电子半导体芯片具有正面和背面。 将牺牲层施加到后表面。 模制体形成为至少部分地嵌入模制体中的光电子半导体芯片。 牺牲层被去除。

公开(公告)号：US20150249070A1

公开(公告)日：2015-09-03

申请号：US14430215

申请日：2013-09-06

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Stefan Illek ,  Thomas Schwarz ,  Jürgen Moosburger ,  Walter Wegleiter

IPC: H01L25/075 ,  H01L33/52 ,  H01L33/64 ,  H01L33/50 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L33/505 ,  H01L33/52 ,  H01L33/62 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01L2924/00

Abstract: An optoelectronic semiconductor component and a method for making an optoelectronic semiconductor component are disclosed. In an embodiment the component includes a carrier including at least one conversion-medium body and a potting body, the potting body surrounding the conversion-medium body at least in places, as seen in plan view, electrical contact structures fitted at least indirectly to the carrier and a plurality of optoelectronic semiconductor chips fitted to a main face of the carrier, the optoelectronic semiconductor chips configured to generate radiation, wherein the conversion-medium body is shaped as a plate, wherein the semiconductor chips are directly mechanically connected to the conversion-medium body, and wherein the conversion-medium body is free of cutouts for the electrical contact structures and is not penetrated by the electrical contact structure.

Abstract translation: 公开了一种光电子半导体部件和制造光电半导体部件的方法。 在一个实施例中，部件包括载体，该载体包括至少一个转化介质体和灌封体，灌封体至少在一些地方围绕转化介质体，如平面图所示，电接触结构至少间接地安装在 载体和安装在载体的主面上的多个光电半导体芯片，所述光电子半导体芯片被配置为产生辐射，其中所述转换介质体被成形为板，其中所述半导体芯片直接机械地连接到所述转换 - 中间体，并且其中所述转换介质主体没有用于所述电接触结构的切口并且不被所述电接触结构穿透。

公开(公告)号：US20150228873A1

公开(公告)日：2015-08-13

申请号：US14426072

申请日：2013-08-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Tobias Gebuhr ,  Matthias Knörr ,  Klaus Müller ,  Thomas Schwarz ,  Frank Singer ,  Michael Zitzlsperger

IPC: H01L33/62 ,  H01L21/56 ,  H01L21/48 ,  H01L51/56 ,  H01L51/52

CPC classification number: H01L33/483 ,  H01L21/4828 ,  H01L21/565 ,  H01L23/49861 ,  H01L24/32 ,  H01L25/0753 ,  H01L33/62 ,  H01L51/5237 ,  H01L51/5246 ,  H01L51/5296 ,  H01L51/56 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/92247 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/0066 ,  Y10T29/49121 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A housing for an optical component is provided in various embodiments. The housing has a leadframe section and a mold compound. The leadframe section is formed from an electrically conductive material and has a first side and a second side facing away from the first side. On the first side, the leadframe section has at least one first receiving region for receiving the optical component and/or at least one contact region for electrically contacting the optical component. The leadframe section has at least one trench which is formed in the leadframe section on the first side thereof alongside the receiving region and/or the contact region. The leadframe section is embedded in the mold compound. The mold compound has at least one receiving recess in which the first receiving region and/or the contact region and the trench are arranged.

Abstract translation: 在各种实施例中提供了用于光学部件的壳体。 壳体具有引线框架部分和模具复合体。 引线框架部分由导电材料形成，并且具有背离第一侧的第一侧和第二侧。 在第一侧，引线框架部分具有用于接收光学部件的至少一个第一接收区域和/或用于电接触光学部件的至少一个接触区域。 引线框架部分具有沿着接收区域和/或接触区域在其第一侧上的引线框架部分中形成的至少一个沟槽。 引线框架部分嵌入模具化合物中。 模具化合物具有至少一个容纳凹槽，其中布置有第一接收区域和/或接触区域和沟槽。

公开(公告)号：US20150108531A1

公开(公告)日：2015-04-23

申请号：US14398557

申请日：2013-05-07

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Stefan Grötsch ,  Michael Zitzlsperger

IPC: H01L33/62 ,  H01L33/64 ,  H01L21/48 ,  H01L23/495

CPC classification number: H01L33/62 ,  H01L21/4828 ,  H01L23/49568 ,  H01L33/64 ,  H01L33/644 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2933/0066 ,  H01L2933/0075 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2224/4554

Abstract: A method of producing a component carrier for an electronic component includes a lead frame section including an electrically conductive material, the lead frame section having a first contact section that forms a first electrical contact element, a second contact section that forms a second electrical contact element, and a reception region that receives the electronic component, at least the reception region and the second contact section being electrically conductively connected to one another, a thermally conductive and electrically insulating intermediate element that dissipates heat from the reception region and electrically insulates the reception region formed at least on an opposite side of the lead frame section from the reception region, and a thermal contact that thermally contacts the electronic component formed at least on a side of the intermediate element facing away from the reception region.

Abstract translation: 一种制造电子部件用部件载体的方法包括：引线框架部分，其包括导电材料，所述引线框架部分具有形成第一电接触元件的第一接触部分，形成第二电接触元件的第二接触部分 以及接收电子部件的接收区域，至少所述接收区域和所述第二接触部彼此导电连接，导热和电绝缘的中间元件，其从所述接收区域散热并使所述接收区域电绝缘 至少在引线框架部分的与接收区域相反的一侧上形成热接触部，该热接触部与形成在远离接收区域的中间元件的至少一侧形成的电子部件热接触。

公开(公告)号：US20150055667A1

公开(公告)日：2015-02-26

申请号：US14533292

申请日：2014-11-05

Applicant: OSRAM Opto Semiconductors GmbH ,  OSRAM GmbH

Inventor： Markus Horn ,  Andreas Breidenassel ,  Karsten Auen ,  Bernhard Stojetz ,  Thomas Schwarz

IPC: H01S5/022 ,  H01S5/024 ,  H01S5/40

CPC classification number: H01S5/02208 ,  H01L2924/19107 ,  H01S5/02216 ,  H01S5/02236 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/02296 ,  H01S5/02469 ,  H01S5/02476 ,  H01S5/4018 ,  H01S5/4025 ,  H01S5/4031 ,  H01S5/405

Abstract: A laser component includes a housing in which a first carrier block is arranged. A first laser chip having an emission direction is arranged on a longitudinal side of the first carrier block. The first laser chip electrically conductively connects to a first contact region arranged on the first carrier block and a second contact region arranged on the first carrier block. There is a respective electrically conductive connection between the first contact region and a first contact pin of the housing and between the second contact region and a second contact pin of the housing.

Abstract translation: 激光部件包括其中布置有第一载体块的壳体。 具有发射方向的第一激光芯片布置在第一载体块的纵向侧上。 第一激光芯片导电地连接到布置在第一载体块上的第一接触区域和布置在第一载体块上的第二接触区域。 在第一接触区域和壳体的第一接触销之间以及在第二接触区域和壳体的第二接触销之间存在相应的导电连接。