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公开(公告)号：US11069835B2
公开(公告)日：2021-07-20
申请号：US16495803
申请日：2018-03-16
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Adrian Stefan Avramescu , Tansen Varghese , Martin Straßburg , Hans-Jürgen Lugauer , Sönke Fündling , Jana Hartmann , Frederik Steib , Andreas Waag
IPC: H01L33/20 , H01L25/075 , H01L33/00
Abstract: An optoelectronic semiconductor chip and a method for manufacturing a semiconductor chip are disclosed. In an embodiment an optoelectronic semiconductor chip includes a plurality of fins and a current expansion layer for common contacting of at least some of the fins, wherein each fin includes two side surfaces arranged opposite one another and an active region arranged on each of the side surfaces, wherein the plurality of fins include inner fins and outer fins having an adjacent fin only on one side, and wherein the current expansion layer is in direct contact with the inner fins on their outside.
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公开(公告)号：US20200028029A1
公开(公告)日：2020-01-23
申请号：US16495803
申请日：2018-03-16
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Adrian Stefan Avramescu , Tansen Varghese , Martin Straßburg , Hans-Jürgen Lugauer , Sönke Fündling , Jana Hartmann , Frederik Steib , Andreas Waag
IPC: H01L33/20 , H01L33/00 , H01L25/075
Abstract: An optoelectronic semiconductor chip and a method for manufacturing a semiconductor chip are disclosed. In an embodiment an optoelectronic semiconductor chip includes a plurality of fins and a current expansion layer for common contacting of at least some of the fins, wherein each fin includes two side surfaces arranged opposite one another and an active region arranged on each of the side surfaces, wherein the plurality of fins include inner fins and outer fins having an adjacent fin only on one side, and wherein the current expansion layer is in direct contact with the inner fins on their outside.
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公开(公告)号：US09853186B2
公开(公告)日：2017-12-26
申请号：US15144728
申请日：2016-05-02
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Matthias Sabathil , Andreas Plöβl , Hans-Jürgen Lugauer , Alexander Linkov , Patrick Rode
CPC classification number: H01L33/08 , H01L33/0075 , H01L33/0079 , H01L33/06 , H01L33/22 , H01L33/26 , H01L33/32 , H01L33/502 , H01L33/504
Abstract: The invention relates to a light-emitting semiconductor component, comprising—a first semiconductor body (1), which comprises an active zone (11) in which during the operation of the light-emitting semiconductor component electromagnetic radiation is generated, at least some of which leaves the first semiconductor body (1) through a radiation exit surface (1a), and—a second semiconductor body (2), which is suitable for converting the electromagnetic radiation into converted electromagnetic radiation having a longer wavelength, wherein—the first semiconductor body (1) and the second semiconductor body (2) are produced separately from each other,—the second semiconductor body (2) is electrically inactive, and—the second semiconductor body (2) is in direct contact with the radiation exit surface (1a) and is attached there to the first semiconductor body (1) without connecting means.
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公开(公告)号：US09812619B2
公开(公告)日：2017-11-07
申请号：US14769060
申请日：2014-01-15
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Jürgen Moosburger , Thomas Schwarz , Hans-Jürgen Lugauer , Tansen Varghese , Stefan Illek
CPC classification number: H01L33/58 , H01L21/78 , H01L25/0753 , H01L25/50 , H01L33/005 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014
Abstract: The present application relates to a method of producing an optoelectronic component. An optoelectronic is produced by this method. An optoelectronic semiconductor chip has a first surface. A sacrificial layer is deposited on the first surface. The optoelectronic semiconductor chip is at least partially embedded in a mold body and the sacrificial layer is removed.
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Patent Agency Ranking
公开(公告)号：US09786824B2
公开(公告)日：2017-10-10
申请号：US14769198
申请日：2014-01-15
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Stefan Illek , Hans-Jürgen Lugauer , Jürgen Moosburger , Thomas Schwarz , Tansen Varghese
CPC classification number: H01L33/54 , H01L33/005 , H01L33/0095 , H01L33/50 , H01L33/62 , H01L2924/0002 , H01L2933/0041 , H01L2933/005 , H01L2933/0066 , H01L2924/00
Abstract: A method can be used for producing an optoelectronic component. An optoelectronic semiconductor chip has a front face and a rear face. A sacrificial layer is applied to the rear face. A molded body is formed the optoelectronic semiconductor chip being at least partially embedded in the molded body. The sacrificial layer is removed.
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公开(公告)号：US20160013380A1
公开(公告)日：2016-01-14
申请号：US14769060
申请日：2014-01-15
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Jürgen Moosburger , Thomas Schwarz , Hans-Jürgen Lugauer , Tansen Varghese , Stefan Illek
CPC classification number: H01L33/58 , H01L21/78 , H01L25/0753 , H01L25/50 , H01L33/005 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014
Abstract: The present application relates to a method of producing an optoelectronic component. An optoelectronic is produced by this method. An optoelectronic semiconductor chip has a first surface. A sacrificial layer is deposited on the first surface. The optoelectronic semiconductor chip is at least partially embedded in a mold body and the sacrificial layer is removed.
Abstract translation: 本申请涉及一种制造光电子部件的方法。 通过该方法制造光电子。 光电子半导体芯片具有第一表面。 牺牲层沉积在第一表面上。 光电子半导体芯片至少部分地嵌入在模具体中并且牺牲层被去除。
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7.发明申请公开(公告)号：US20150380602A1
公开(公告)日：2015-12-31
申请号：US14767634
申请日：2014-02-06
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Thomas Schwarz , Hans-Jürgen Lugauer , Jürgen Moosburger , Stefan Illek , Tansen Varghese , Matthias Sabathil
CPC classification number: H01L33/0095 , H01L33/483 , H01L33/486 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2924/00
Abstract: A method of producing an optoelectronic component includes providing a carrier having a carrier surface, a first lateral section of the carrier surface being raised relative to a second lateral section of the carrier surface; arranging an optoelectronic semiconductor chip having a first surface and a second surface on the carrier surface, wherein the first surface faces toward the carrier surface; and forming a molded body having an upper side facing toward the carrier surface and a lower side opposite the upper side, the semiconductor chip being at least partially embedded in the molded body.
Abstract translation: 制造光电子部件的方法包括提供具有载体表面的载体，载体表面的第一侧向部分相对于载体表面的第二侧向部分升高; 在载体表面上布置具有第一表面和第二表面的光电子半导体芯片，其中第一表面面向载体表面; 并且形成具有朝向所述载体表面的上侧和与所述上侧相对的下侧的成型体，所述半导体芯片至少部分地嵌入所述模制体中。
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公开(公告)号：US10074769B2
公开(公告)日：2018-09-11
申请号：US14767634
申请日：2014-02-06
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thomas Schwarz , Hans-Jürgen Lugauer , Jürgen Moosburger , Stefan Illek , Tansen Varghese , Matthias Sabathil
CPC classification number: H01L33/0095 , H01L33/483 , H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/04105 , H01L2224/96 , H01L2924/0002 , H01L2933/0033 , H01L2924/00
Abstract: A method of producing an optoelectronic component includes providing a carrier having a carrier surface, a first lateral section of the carrier surface being raised relative to a second lateral section of the carrier surface; arranging an optoelectronic semiconductor chip having a first surface and a second surface on the carrier surface, wherein the first surface faces toward the carrier surface; and forming a molded body having an upper side facing toward the carrier surface and a lower side opposite the upper side, the semiconductor chip being at least partially embedded in the molded body.
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公开(公告)号：US20160005936A1
公开(公告)日：2016-01-07
申请号：US14769198
申请日：2014-01-15
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Stefan Illek , Hans-Jürgen Lugauer , Jürgen Moosburger , Thomas Schwarz , Tansen Varghese
CPC classification number: H01L33/54 , H01L33/005 , H01L33/0095 , H01L33/50 , H01L33/62 , H01L2924/0002 , H01L2933/0041 , H01L2933/005 , H01L2933/0066 , H01L2924/00
Abstract: A method can be used for for producing an optoelectronic component. An optoelectronic semiconductor chip has a front face and a rear face. A sacrificial layer is applied to the rear face. A molded body is formed the optoelectronic semiconductor chip being at least partially embedded in the molded body. The sacrificial layer is removed.
Abstract translation: 一种方法可用于制造光电子元件。 光电子半导体芯片具有正面和背面。 将牺牲层施加到后表面。 模制体形成为至少部分地嵌入模制体中的光电子半导体芯片。 牺牲层被去除。
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