公开(公告)号：US20090190320A1

公开(公告)日：2009-07-30

申请号：US12362354

申请日：2009-01-29

Applicant: ICHIO SHIMIZU ,  Kenya Kawano ,  Kisho Ashida ,  Yuichi Machida

Inventor： ICHIO SHIMIZU ,  Kenya Kawano ,  Kisho Ashida ,  Yuichi Machida

IPC: H05K7/04 ,  H01L23/48

CPC classification number: H05K7/04 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49589 ,  H01L24/28 ,  H01L24/29 ,  H01L24/36 ,  H01L24/39 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/40245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2224/83855 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K3/202 ,  H05K3/321 ,  H05K3/3442 ,  H05K2201/0397 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2201/1003 ,  H05K2201/10484 ,  H05K2201/10636 ,  H05K2201/10924 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Coupling reliability of a passive component is improved to increase the reliability of a semiconductor device. A first through hole is formed in a first electrode part of a first plate-like lead, and a second through hole is formed in a second electrode part of a second plate-like lead. As a result, at the first electrode part of the first plate-like lead, one external terminal of the passive component can be coupled to the first electrode parts on both sides of the first through hole while being laid across the first through hole. Also, at the second electrode part of the second plate-like lead, the other external terminal of the passive component can be coupled to the second electrode parts on both sides of the second through hole while being laid across the second through hole. Accordingly, at central portions both in the longitudinal and width directions of the passive component, the passive component is surrounded by sealing members. As a result, thermal stress applied to jointing materials such as solder can be reduced, improving the reliability of the semiconductor device (semiconductor package).

Abstract translation: 改善了无源部件的耦合可靠性，以提高半导体器件的可靠性。 第一通孔形成在第一板状引线的第一电极部分中，第二通孔形成在第二板状引线的第二电极部分中。 结果，在第一板状引线的第一电极部分，无源部件的一个外部端子可以被连接到第一通孔的两侧的第一电极部分，同时跨过第一通孔。 此外，在第二板状引线的第二电极部分，无源部件的另一个外部端子可以在跨过第二通孔而被布置在第二通孔的两侧上的第二电极部件上。 因此，在无源部件的纵向和宽度方向的中心部分处，被动部件被密封部件包围。 结果，可以减少施加到诸如焊料的接合材料的热应力，从而提高半导体器件（半导体封装）的可靠性。

公开(公告)号：US20080087079A1

公开(公告)日：2008-04-17

申请号：US11898203

申请日：2007-09-10

Applicant: Martin Jeitner ,  Thomas Ofenhitzer

Inventor： Martin Jeitner ,  Thomas Ofenhitzer

IPC: G01W1/00

CPC classification number: G01J1/04 ,  G01J1/02 ,  G01J1/0204 ,  G01J1/4228 ,  G01J2001/4266 ,  H05K1/0284 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10484

Abstract: A sensor arrangement is provided in a motor vehicle for determining solar radiation incident on the motor vehicle, having at least one electro-optic component that is fastened to a one-piece or multi-piece support using MID technology.

Abstract translation: 传感器装置设置在机动车辆中，用于确定入射到机动车辆上的太阳辐射，其具有至少一个电光部件，该电光部件使用MID技术固定到单件或多件式支架上。

公开(公告)号：US20080084467A1

公开(公告)日：2008-04-10

申请号：US11822505

申请日：2007-07-06

Applicant: Keiichi Satou ,  Yasuo Yoshida

Inventor： Keiichi Satou ,  Yasuo Yoshida

IPC: B41J2/00 ,  H01R13/642

CPC classification number: H01R33/09 ,  B41J2/473 ,  G02B26/123 ,  H01R12/7082 ,  H01R12/716 ,  H05K3/301 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2201/10484 ,  H05K2201/10651

Abstract: A connection member that connects an electric substrate and a light source that emits a light beam, the connection member comprising: a light source terminal insertion portion into which a light source terminal of the light source is inserted from one end portion side and having another end portion side that penetrates the electric substrate.

Abstract translation: 一种连接电气基板和发射光束的光源的连接构件，所述连接构件包括：光源端子插入部，光源端子从一端部插入该端子侧并具有另一端 部分侧穿透电气基板。

公开(公告)号：US20080052931A1

公开(公告)日：2008-03-06

申请号：US11896908

申请日：2007-09-06

Applicant: Oh Jo Kwon ,  Won Tae Choi ,  Kyoung Soo Kwon

Inventor： Oh Jo Kwon ,  Won Tae Choi ,  Kyoung Soo Kwon

IPC: G01C17/00

CPC classification number: G01C17/28 ,  G01P1/023 ,  G01P15/18 ,  H05K1/18 ,  H05K2201/10151 ,  H05K2201/10484

Abstract: Provided is a hybrid sensor module including first and second sensors that are attached on one surface of a printed circuit board (PCB) so as to detect two-axis signal components parallel to the PCB; a third sensor that is attached on one surface of the PCB such that the axial direction of the third sensor is tilted at a predetermined angle from a vertical direction of the PCB, the third sensor detecting a signal component sensed in the axial direction; and a signal correction unit that is connected to the first to third sensor and corrects signal components, detected from the respective sensors, into signal components of an orthogonal coordinate system.

Abstract translation: 提供了一种混合传感器模块，其包括附接在印刷电路板（PCB）的一个表面上的第一和第二传感器，以便检测平行于PCB的两轴信号分量; 第三传感器，其附接在PCB的一个表面上，使得第三传感器的轴向方向从PCB的垂直方向倾斜预定角度，第三传感器检测沿轴向感测的信号分量; 以及信号校正单元，其连接到第一至第三传感器，并且将从各个传感器检测的信号分量校正为正交坐标系的信号分量。

公开(公告)号：US20080019142A1

公开(公告)日：2008-01-24

申请号：US11477304

申请日：2006-06-29

Applicant: Radu-Cornel Rapeanu ,  Zhi Gang Xing ,  Michel Lambert

Inventor： Radu-Cornel Rapeanu ,  Zhi Gang Xing ,  Michel Lambert

IPC: H01L33/00

CPC classification number: H05K1/18 ,  F21K9/232 ,  F21Y2115/10 ,  G09F9/33 ,  H05K2201/09418 ,  H05K2201/10106 ,  H05K2201/10484

Abstract: A lamp assembly and method for illuminating a backlit sign include at least one circuit board and light emitting diodes mounted on the circuit board. The light emitting diodes are oriented such that a majority of emitted light or a beam from the circuit board is directed to only a portion of the backlit sign. The light emitting diodes are positioned uniformly around a perimeter of the circuit board to ensure uniform illumination around the lamp assembly. The circuit boards are arranged parallel to each other and perpendicular to a longitudinal axis of the lamp assembly. The lamp assembly includes a plurality of resistors mounted on the circuit board such that heat dissipated by the resistors is uniformly distributed over the circuit board. The lamp assembly also includes a Bridge rectifier to provide a DC output voltage from AC or DC input voltages.

Abstract translation: 用于照亮背光标志的灯组件和方法包括安装在电路板上的至少一个电路板和发光二极管。 发光二极管被定向成使得大部分发射光或来自电路板的光束仅被引导到背光符号的一部分。 发光二极管均匀地围绕电路板的周边定位，以确保灯组件周围的均匀照明。 电路板彼此平行并垂直于灯组件的纵向轴线布置。 灯组件包括安装在电路板上的多个电阻器，使得由电阻器散发的热均匀地分布在电路板上。 灯组件还包括桥式整流器，用于从AC或DC输入电压提供直流输出电压。

公开(公告)号：US20060268410A1

公开(公告)日：2006-11-30

申请号：US11457212

申请日：2006-07-13

Applicant: Bradley Busscher ,  Bradley Northman ,  Kenton Ypma ,  Randall Beute ,  John Roberts ,  Wayne Jordan ,  Edward DeNave ,  Daniel Bostwick ,  Randall Braun ,  Gregory Bosch ,  Timothy Bonardi

Inventor： Bradley Busscher ,  Bradley Northman ,  Kenton Ypma ,  Randall Beute ,  John Roberts ,  Wayne Jordan ,  Edward DeNave ,  Daniel Bostwick ,  Randall Braun ,  Gregory Bosch ,  Timothy Bonardi

IPC: G02B5/12

CPC classification number: B60R1/0602 ,  B60Q1/2665 ,  B60R1/07 ,  B60R1/072 ,  B60R1/088 ,  B60R1/1207 ,  B60R2001/1215 ,  G02B5/08 ,  H05K1/02 ,  H05K1/18 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/09072 ,  H05K2201/09081 ,  H05K2201/10106 ,  H05K2201/10484

Abstract: A mirror assembly includes a housing, an angularly adjustable power pack, wires for supplying power and mirror angle control, an electrochromic mirror subassembly including a heater, and a turn signal device. The components include individual connectors that plug into a multi-prong connector on the bundle of wires, or that piggyback into each other. Optionally, the heater incorporates an internal wire with end connectors for communicating power to opposite sides of the heater, and also includes layers of light-transmitting/diffusing material for diffusing light passing from the turn signal device through the diffusing material. A printed circuit board fits into a pocket in the panel-shaped carrier, and an integral retainer releasably secures the printed circuit board. The power pack is attached to the carrier via a ring of resilient fingers, and a continuous hoop flange prevents distortion of the carrier and in turn of the glass elements in the mirror subassembly.

Abstract translation: 反射镜组件包括壳体，角度可调节的电源组，用于供电和镜角控制的电线，包括加热器的电致变色镜子组件和转向信号装置。 这些组件包括插入电线束上的多插头连接器或彼此搭载的单独连接器。 可选地，加热器包括具有端部连接器的内部导线，用于将功率传递到加热器的相对侧，并且还包括用于漫射从转向信号装置通过扩散材料的光的透光/扩散材料层。 印刷电路板装配在面板形载体中的凹槽中，并且整体的保持器可释放地固定印刷电路板。 电源组通过一个弹性手指环连接到载体上，连续的环形凸缘可防止载体和反射镜组件中的玻璃元件的变形。

公开(公告)号：US07142345B2

公开(公告)日：2006-11-28

申请号：US11143233

申请日：2005-06-02

Applicant: Timothy A. Bonardi ,  Randall J. Beute ,  Randall S. Braun ,  Bradley L. Busscher ,  Kenton J. Ypma ,  Gregory A. Bosch ,  Edward L. DeNave ,  Daniel J. Bostwick ,  Wayne M. Jordan ,  John K. Roberts

Inventor： Timothy A. Bonardi ,  Randall J. Beute ,  Randall S. Braun ,  Bradley L. Busscher ,  Kenton J. Ypma ,  Gregory A. Bosch ,  Edward L. DeNave ,  Daniel J. Bostwick ,  Wayne M. Jordan ,  John K. Roberts

IPC: G02F1/15 ,  G02B5/12 ,  B60R1/12 ,  B60Q1/56

CPC classification number: B60R1/0602 ,  B60Q1/2665 ,  B60R1/07 ,  B60R1/072 ,  B60R1/088 ,  B60R1/1207 ,  B60R2001/1215 ,  G02B5/08 ,  H05K1/02 ,  H05K1/18 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/09072 ,  H05K2201/09081 ,  H05K2201/10106 ,  H05K2201/10484

Abstract: A mirror assembly includes a housing, an angularly adjustable power pack, wires for supplying power and mirror angle control, an electrochromic mirror subassembly including a heater, and a turn signal device. The components include individual connectors that plug into a multi-prong connector on the bundle of wires, or that piggyback into each other. Optionally, the heater incorporates an internal wire with end connectors for communicating power to opposite sides of the heater, and also includes layers of light-transmitting/diffusing material for diffusing light passing from the turn signal device through the diffusing material. A printed circuit board fits into a pocket in the panel-shaped carrier, and an integral retainer releasably secures the printed circuit board. The power pack is attached to the carrier via a ring of resilient fingers, and a continuous hoop flange prevents distortion of the carrier and in turn of the glass elements in the mirror subassembly.

公开(公告)号：US07081691B2

公开(公告)日：2006-07-25

申请号：US10396399

申请日：2003-03-26

Applicant: Hiroyuki Kawata

Inventor： Hiroyuki Kawata

IPC: H05K7/20

CPC classification number: H05K1/0203 ,  B62D5/0406 ,  H05K7/1432 ,  H05K2201/10166 ,  H05K2201/10484 ,  H05K2201/1056

Abstract: A switching device for controlling a large amount of current includes a circuit board carrying electronic components thereon, a power-switching element electrically connected to the circuit board, and a housing disposed underneath the circuit board and containing the power-switching element therein. The housing made of a heat-conductive material includes a heat-sink block having a sloped surface on which the power-switching element is mounted. Connecting leads extending from the power-switching element are positioned at an upper portion of the sloped surface which is close to the circuit board. In this manner, the length of connecting leads is shortened and heat and noises generated therein are suppressed.

公开(公告)号：US20060111065A1

公开(公告)日：2006-05-25

申请号：US11052785

申请日：2005-02-09

Applicant: Yasuhide Kuroda

Inventor： Yasuhide Kuroda

IPC: H04B1/46

CPC classification number: H01G4/38 ,  H01L27/016 ,  H05K1/0231 ,  H05K1/0237 ,  H05K2201/0382 ,  H05K2201/1028 ,  H05K2201/10484 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2203/0195 ,  H05K2203/041 ,  Y02P70/611

Abstract: In an electronic circuit capable of eliminating a direct current component while suppressing deterioration of frequency characteristics in a wide frequency band, the electronic circuit includes a first capacitor, which eliminates, when the wide frequency band is divided into a low frequency band and a high frequency band, the direct current component of the low frequency band, and a plurality of second capacitors each disposed to each fine band when the high frequency band is further divided into fine bands to eliminate the direct current components of the fine bands, wherein the first capacitor and the second capacitor are connected in parallel with each other. There is also provided a method of manufacturing the electronic circuit.

Abstract translation: 在能够消除直流成分同时抑制宽频带中的频率特性劣化的电子电路中，电子电路包括第一电容器，其将宽频带分为低频带和高频 频带，低频带的直流分量，以及多个第二电容器，每个第二电容器，当高频带进一步被划分为细小频带，以消除精细频带的直流分量时，每个精细频带都设置在其中，其中第一电容器 并且第二电容器彼此并联连接。 还提供了一种制造电子电路的方法。

公开(公告)号：US07044763B1

公开(公告)日：2006-05-16

申请号：US11166222

申请日：2005-06-27

Applicant: Takashi Inoue ,  Hiroshi Takawa ,  Yasuhiro Teshima ,  Noboru Izuhara

Inventor： Takashi Inoue ,  Hiroshi Takawa ,  Yasuhiro Teshima ,  Noboru Izuhara

IPC: H01R13/62

CPC classification number: H05K3/301 ,  H01R12/7047 ,  H01R12/716 ,  H01R12/83 ,  H01R43/205 ,  H05K9/0058 ,  H05K2201/10189 ,  H05K2201/10484 ,  H05K2201/10606

Abstract: In an SFP module mounting structure where an SFP module connected to a connector mounted on a printed board is held by a holder, the holder has both side faces which hold the SFP module on the both sides, a flap which is provided on an upper edge of the both side faces so as to make the SFP module insertable and extractable in an oblique upper direction as well as to prevent the SFP module from being disengaged upward and a bottom face which supports the both side faces on the printed board. The connector may be provided with an electrode which is connected to the SFP module when the SFP module is inserted into the holder from the oblique upper direction and which has a returning elastic force enabling the SFP module to move pivotally down to a state that is parallel to the printed board.

Abstract translation: 在连接到安装在印刷电路板上的连接器的SFP模块由保持器保持的SFP模块安装结构中，保持器具有将SFP模块保持在两侧的两个侧面，设置在上边缘 以使得SFP模块能够在倾斜的上方向上插入和提取，并且防止SFP模块向上脱离，并且支撑底板上的两个侧面的底面。 连接器可以设置有当SFP模块从倾斜的上部方向插入到保持器中时连接到SFP模块的电极，并且具有使得SFP模块能够枢转地向下移动到平行状态的返回弹力 到印刷板。