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公开(公告)号:US20190285801A1
公开(公告)日:2019-09-19
申请号:US16354414
申请日:2019-03-15
申请人: Finisar Sweden AB
IPC分类号: G02B6/136
摘要: A method of manufacturing an integrated semiconductor optical waveguiding device comprising an elongated waveguide, the method comprising: providing a material stack comprising a substrate layer, an anisotropically wet etchable conductive layer, a waveguiding core layer, an etch-guiding layer between the substrate layer and the waveguiding core layer, and InP material between the etch-guiding layer and the waveguiding core layer; etching said material stack down to and including said waveguiding core layer, to form an elongated shape of the elongated waveguide together with an etched area laterally beside the waveguide; providing an etch mask material across the formed waveguide; and wet etching parts of said etched areas that are not protected by the etch mask, to remove material of the etch-guiding layer across a lateral direction of the waveguide, forming a laterally extending through tunnel in the etch-guiding layer and in the conductive layer.
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公开(公告)号:US20190278022A1
公开(公告)日:2019-09-12
申请号:US16462077
申请日:2016-12-30
申请人: Intel Corporation
发明人: Rahul RAMASWAMY , Chia-Hong JAN , Walid HAFEZ , Neville DIAS , Hsu-Yu CHANG , Roman W. OLAC-VAW , Chen-Guan LEE
摘要: Embodiments of the invention include an electromagnetic waveguide and methods of forming electromagnetic waveguides. In an embodiment, the electromagnetic waveguide may include a first semiconductor fin extending up from a substrate and a second semiconductor fin extending up from the substrate. The fins may be bent towards each other so that a centerline of the first semiconductor fin and a centerline of the second semiconductor fin extend from the substrate at a non-orthogonal angle. Accordingly, a cavity may be defined by the first semiconductor fin, the second semiconductor fin, and a top surface of the substrate. Embodiments of the invention may include a metallic layer and a cladding layer lining the surfaces of the cavity. Additional embodiments may include a core formed in the cavity.
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公开(公告)号:US20190267412A1
公开(公告)日:2019-08-29
申请号:US16283191
申请日:2019-02-22
发明人: Hideki Yagi , Naoko Konishi , Koji Ebihara , Takuya Okimoto
IPC分类号: H01L27/144 , H01L31/0352 , H01L31/0232 , H01L31/105 , H01L31/0304 , H01L31/18 , G02B6/136 , G02B6/12 , G02B6/13
摘要: A semiconductor integrated optical device includes: a supporting base including semi-insulating semiconductor; a first photoelectric convertor having first photodiode mesas; a second photoelectric convertor having second photodiode mesas; a first 90° optical hybrid having at least one first multimode waveguide mesa; a second 90° optical hybrid having at least one second multimode waveguide mesa; an optical divider mesa; first and second input waveguide mesas coupling the first and second 90° optical hybrids with the optical divider mesa, respectively; a conductive semiconductor region disposed on the supporting base, the conductive semiconductor region mounting the first photodiode mesas, the second photodiode mesas, the first multimode waveguide mesas, the second multimode waveguide mesas, and the optical divider mesa; a first island semiconductor mesa extending between the first and second multimode waveguide mesas; and a first groove extending through the first island semiconductor mesa and the conductive semiconductor region to the semi-insulating semiconductor.
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公开(公告)号:US10393960B1
公开(公告)日:2019-08-27
申请号:US15905165
申请日:2018-02-26
申请人: GLOBALFOUNDRIES Inc.
摘要: Waveguide structures and methods of fabricating waveguide structures. A first airgap is formed in a bulk semiconductor substrate, and a semiconductor layer is epitaxially grown over the bulk semiconductor substrate and the first airgap. First and second trench isolation regions extend through the semiconductor layer and into the bulk semiconductor substrate, and are spaced to define a waveguide core region including a section of the bulk semiconductor substrate and a section of the semiconductor layer that are arranged between the first and second trench isolation regions. A dielectric layer is formed over the waveguide core region, and a second airgap is formed in the dielectric layer. The first airgap is arranged in the bulk semiconductor substrate between the first trench isolation region and the second trench isolation region and under the waveguide core region. The second airgap in the dielectric layer is arranged over the waveguide core region.
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公开(公告)号:US10388310B1
公开(公告)日:2019-08-20
申请号:US16135251
申请日:2018-09-19
发明人: Christopher Neil Harvey , Aidan Dominic Goggin , Kelly Elizabeth Callan , John Bernard McGurk , Reyad Mehfuz
IPC分类号: G11B11/00 , G11B5/48 , G02B6/122 , G11B11/105 , G11B7/1387 , G02B6/126 , G02B6/132 , G02B6/27 , G02B6/136 , G11B5/00 , G11B5/60
摘要: An apparatus includes an input coupler configured to receive light excited by a light source. A near-field transducer (NFT) is positioned at a media-facing surface of a write head. A layered waveguide is positioned between the input coupler and the NFT and configured to receive the light output from the input coupler in a transverse electric (TE) mode and deliver the light to the NFT in a transverse magnetic (TM) mode. The layered waveguide comprises a first layer extending along a light-propagation direction. The first layer is configured to receive light from the input coupler. The first layer tapers from a first cross track width to a second cross track width where the second cross track width is narrower than the first cross track width. The layered waveguide includes a second layer that is disposed on the first layer. The second layer has a cross sectional area in a plane perpendicular to the light propagation direction that increases along the light propagation direction. The cross sectional area of the second layer is smaller proximate to the input coupler and larger proximate to the NFT. The layered waveguide includes an interface between the first layer and the second layer, the interface comprises a curve.
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公开(公告)号:US20190243066A1
公开(公告)日:2019-08-08
申请号:US16386171
申请日:2019-04-16
申请人: FINISAR CORPORATION
发明人: Daniel Mahgerefteh , Bryan Park , Jianxiao Chen , Xiaojie Xu , Gilles P. Denoyer , Bernd Huebner
CPC分类号: G02B6/1228 , G02B6/1221 , G02B6/1223 , G02B6/124 , G02B6/125 , G02B6/126 , G02B6/136 , G02B6/2726 , G02B6/2773 , G02B6/305 , G02B6/4208 , G02B6/4215 , G02B2006/12038 , G02B2006/12061 , G02B2006/12069 , G02B2006/12097 , G02B2006/12121 , G02B2006/12123 , G02B2006/12147 , G02B2006/12157 , G02B2006/12164
摘要: In an example, a photonic system includes a Si PIC with a Si substrate, a SiO2 box formed on the Si substrate, a first layer, and a second layer. The first layer is formed above the SiO2 box and includes a SiN waveguide with a coupler portion at a first end and a tapered end opposite the first end. The second layer is formed above the SiO2 box and vertically displaced above or below the first layer. The second layer includes a Si waveguide with a tapered end aligned in two orthogonal directions with the coupler portion of the SiN waveguide such that the tapered end of the Si waveguide overlaps in the two orthogonal directions and is parallel to the coupler portion of the SiN waveguide. The tapered end of the SiN waveguide is configured to be adiabatically coupled to a coupler portion of an interposer waveguide.
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公开(公告)号:US10374389B2
公开(公告)日:2019-08-06
申请号:US15474534
申请日:2017-03-30
发明人: Ning Li , Ke Liu , Devendra K. Sadana , Volker J. Sorger
IPC分类号: G02B6/12 , G02B6/43 , H01S5/02 , H01S5/10 , H01S5/34 , G02B6/136 , H01S5/026 , H01S5/042 , H01S5/343
摘要: A plasmonic light source includes a substrate and a square nano-cavity formed on the substrate. The nano-cavity includes a quantum well structure. The quantum well structure includes III-V materials. A plasmonic metal is formed as an electrode on the square nano-cavity and is configured to excite surface plasmons with the quantum well structure to generate light. Complementary metal oxide semiconductor (CMOS) devices are formed on the substrate.
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公开(公告)号:US10373939B2
公开(公告)日:2019-08-06
申请号:US15633343
申请日:2017-06-26
IPC分类号: H01L31/0232 , H01L25/16 , G02B6/12 , G02B6/122 , G02B6/136 , H01L25/075 , H01S5/10 , H01S5/022 , H01L25/00 , H01L33/00 , H01L33/44 , H01L33/48 , H01L33/62 , H01S5/02
摘要: A method of fabricating a composite integrated optical device includes providing a substrate comprising a silicon layer, forming a waveguide in the silicon layer, and forming a layer comprising a metal material coupled to the silicon layer. The method also includes providing an optical detector, forming a metal-assisted bond between the metal material and a first portion of the optical detector, forming a direct semiconductor-semiconductor bond between the waveguide, and a second portion of the optical detector.
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公开(公告)号:US20190235166A1
公开(公告)日:2019-08-01
申请号:US16374214
申请日:2019-04-03
发明人: Charles BAUDOT
CPC分类号: G02B6/125 , G02B6/1228 , G02B6/136 , G02B2006/12061 , G02B2006/12097 , G02B2006/121 , G02B2006/12173 , G02B2006/12176
摘要: A photonic integrated device includes a first waveguide and a second waveguide. The first and second waveguides are mutually coupled at a junction region which includes a bulge region. The bulge region is defined two successive etching operations using two distinct etch masks, where the first etching operation is a partial etch and the second etching operation is a complete etch.
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公开(公告)号:US10353147B2
公开(公告)日:2019-07-16
申请号:US15339446
申请日:2016-10-31
发明人: Wan-Yu Lee , Ying-Hao Kuo , Hai-Ching Chen , Tien-I Bao
IPC分类号: H01L21/30 , H01L21/306 , H01L21/308 , G02B6/136 , C09K13/02 , G02B6/42 , G02B6/122 , G02B6/12
摘要: A system and method for manufacturing semiconductor devices is provided. An embodiment comprises using an etchant to remove a portion of a substrate to form an opening with a 45° angle with a major surface of the substrate. The etchant comprises a base, a surfactant, and an oxidant. The oxidant may be hydrogen peroxide.
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