Abstract:
The semiconductor chip package may include a substrate having circuit patterns and substrate pads connected with the circuit patterns. At least one semiconductor chip is mounted on the substrate, and a thermoelectric cooler having a P-type material plate and an N-type material plate is mounted on the semiconductor chip. Portions of the P-type and N-type material plates may be attached on the semiconductor chip. The P-type and N-type material plates may be electrically connected to the circuit patterns of the substrate to be provided with DC power.
Abstract:
Disclosed herein is a secondary battery constructed in a structure in which an electrode assembly having a cathode/separator/anode arrangement is mounted in a battery case made of a laminate sheet including a resin layer and a metal layer, electrode taps of the electrode assembly are coupled to corresponding electrode leads, and the electrode assembly is sealed in the battery case while electrode leads are exposed to the outside of the battery case, wherein a protective film is attached to coupling regions between the electrode taps and the electrode leads for sealing the coupling regions between the electrode taps and the electrode leads. The secondary battery according to the present invention is constructed in a structure in which the coupling regions are sealed by the protective film, unlike a conventional secondary battery constructed in a structure in which the coupling regions between the electrode taps and the electrode leads are exposed in the battery case. As a result, the electrode leads are protected from external impacts, such as falling of the battery. Consequently, no internal short circuit occurs, and therefore, the safety of the battery is increased.
Abstract:
A stack-type nonvolatile semiconductor device comprises a memory device formed on a substrate including a semiconductor body elongated in one direction, having a cross section perpendicular to a main surface, having a predetermined curvature, a channel region on the semiconductor body along the circumference, a tunneling insulating layer on the channel region, a floating gate on the tunneling insulating layer, insulated from the channel region, a high dielectric constant material layer on the floating gate, a metallic control gate on the high dielectric constant material layer, insulated from the floating gate, and source and drain regions adjacent to the metallic control gate on the semiconductor body, an inter-insulating layer on the memory device, and a conductive layer on the inter-insulating layer, and a memory device formed on the conductive layer including, a semiconductor body elongated in one direction having a cross section perpendicular to a main surface, having a predetermined curvature, a channel region along the circumference of the semiconductor body, a tunneling insulating layer on the channel region, a floating gate on the tunneling insulating layer, electrically insulated from the channel region, a high dielectric constant material layer on the floating gate, a metallic control gate on the high dielectric constant material layer, insulated from the floating gate, and source and drain regions adjacent to the metallic control gate.
Abstract:
Disclosed herein is an electrowetting system using the electrowetting phenomenon. The electrowetting system comprises an electrolyte solution consisting of 30 to 89% by weight of water, 0.01 to 30% by weight of a salt and 10 to 60% by weight of a polar solvent having a dipole moment. According to the electrowetting system, the polar solvent added to increase the viscosity of the electrolyte solution stabilizes the movement of the electrolyte solution when a voltage is applied to operate the electrowetting system. In addition, high- or low-temperature reliability of the electrowetting system can be ensured by the use of the polar solvent.
Abstract:
A braking system for a vehicle, which can prevent an alteration in brake pedal toe force when a brake hydraulic pressure is increased or decreased based on a regenerative braking force obtained by a drive motor in an electric vehicle or hybrid vehicle, and a braking method thereof. To prevent an alteration in brake pedal toe force, the vehicle braking system includes a brake reservoir to receive brake oil therein, a normal close type valve to connect the brake reservoir to an inlet of a pump generating a hydraulic pressure in a brake line, a drive motor serving as a generator, the drive motor being adapted to convert a kinetic energy of the vehicle into electric energy to brake the vehicle by regenerative braking, and a control unit to recognize the amount of regenerative braking obtained by the drive motor and the amount of braking desired by a vehicle operator and to control the normal close type valve, so as to compensate for a brake hydraulic pressure corresponding to a difference between the regenerative braking amount and the desired braking amount by use of the brake oil in the reservoir.
Abstract:
A torque sensor including a first step formed on an inner peripheral surface of a sensor housing, a second step formed on an outer peripheral surface of a detection coil assembly, the first and second steps axially supporting each other, and a groove formed on the outer peripheral surface of the detection coil assembly at a position adjacent to the second step such that the groove faces an inner surface portion of the first step, so that the first step penetrates the groove while being plastically deformed when the detection coil assembly is pressed toward the first step, thereby causing the detection coil assembly to be fixed to the inner peripheral surface of the sensor housing. Since the detection coil assembly is fixed in the sensor housing through the structural modification of the sensor housing and detection coil assembly, without using a separate fixing member, it is possible to effectively achieve the fixing of the detection coil assembly, and thus, to reduce the number of elements in the torque sensor.
Abstract:
Disclosed herein is a solenoid valve having a valve seat assembly manufactured as a single body such that the valve seat assembly is simply fitted in a valve housing. The valve seat assembly comprises a valve seat, a filter, and a sealing plate. The valve seat assembly is disposed at one end of a housing. The valve seat comprises a first orifice formed such that the first orifice is opened and closed as a plunger is moved forward and backward, and a second orifice formed such that the second orifice is arranged in parallel with the first orifice. The sealing plate is provided at the center thereof with a through-hole, which communicates with the first orifice of the valve seat. The sealing plate is disposed in the valve seat such that the sealing plate is not separated from the valve seat by means of the filter. The sealing plate is moved toward the first orifice by the pressure of a fluid close the second orifice. In this way, the sealing plate serves as a check valve.
Abstract:
A multi-chip package having a heat dissipating path. The multi-chip package includes a stack of integrated circuit (IC) chips, a heat sink part interposed between the IC chips so that one end portion of the heat sink part can be exposed from a side of the stack of integrated circuit chips, a substrate on which the stack of integrated circuit chips is mounted, and solder or solder ball-shaped thermally connecting parts to thermally connect the exposed end portion of the heat sink part to the substrate to dissipate heat collected in the heat sink part through the substrate.
Abstract:
A differential phase detection device receives first through fourth detection signals from a photodetector and detects a differential phase signal therefrom, the differential phase detection device includes a slicer slicing and digitizing each of the detection signals with respect to a reference level. A synthesizer synthesizes the digitized detection signals and generates therefrom synthesis signals. A phase difference detector compares phases of the synthesis signals and outputs a first phase difference signal and a second phase difference signal. A matrix circuit processes the first and second phase difference signals to output the differential phase signal.
Abstract:
In a memory module, a gap filler for eliminating an air gap may be formed on an end of a PCB where a tab may be formed. The gap filler may be formed on a surface of a socket receiving the memory module. A grease may be coated on the tab to provide a heat conduction path away from the memory module.