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    ARRAY SUBSTRATE FOR MOUNTING CHIP AND METHOD FOR MANUFACTURING THE SAME
    141.
    发明申请
    ARRAY SUBSTRATE FOR MOUNTING CHIP AND METHOD FOR MANUFACTURING THE SAME 有权
    用于安装芯片的阵列基板及其制造方法

    公开(公告)号：US20150115310A1

    公开(公告)日：2015-04-30

    申请号：US14525478

    申请日：2014-10-28

    Applicant: Point Engineering Co., Ltd.

    Inventor： Ki Myung Nam ,  Seung Ho Park ,  Young Chul Jun

    IPC: H01L33/48

    CPC classification number: H01L33/486 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2924/12041 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: Provided is an array substrate for mounting a chip. The array substrate includes a plurality of conductive layers unidirectionally stacked with respect to an original chip substrate; a plurality of insulating layers alternately stacked with the plurality of conductive layers, and electrically separate the plurality of conductive layers; and a cavity having a groove of a predetermined depth with respect to a region including the plurality of insulating layers in an upper surface of the original chip substrate. Accordingly, since the optical device array of a single structure is used as a line source of light, an emission angle emitted from the optical device is great, it is not necessary to form an interval for supplying an amount of light, and a display device can be simply constructed. Further, since it is not necessary to perform soldering a plurality of LED packages on a printed circuit board, a thickness of a back light unit can be reduced.

    Abstract translation: 提供了一种用于安装芯片的阵列基板。 阵列基板包括相对于原始芯片基板单向堆叠的多个导电层; 多个绝缘层，与所述多个导电层交替堆叠，并且电分离所述多个导电层; 以及具有相对于在原始芯片衬底的上表面中包括多个绝缘层的区域具有预定深度的凹槽的空腔。 因此，由于将单一结构的光学元件阵列用作线光源，所以从光学器件发射的发射角大，不需要形成用于提供光量的间隔，并且显示装置 可以简单地构建。 此外，由于不需要在印刷电路板上进行多个LED封装的焊接，所以可以减小背光单元的厚度。

    Method for Manufacturing a Can Package-Type Optical Device, and Optical Device Manufactured Thereby
    143.
    发明申请
    Method for Manufacturing a Can Package-Type Optical Device, and Optical Device Manufactured Thereby 有权
    制造可封装型光学器件的方法和由此制造的光学器件

    公开(公告)号：US20150048408A1

    公开(公告)日：2015-02-19

    申请号：US14349226

    申请日：2012-10-04

    Applicant: Point Engineering Co., Ltd.

    Inventor： Ki Myung Nam ,  Seung Ho Park ,  Tae Hwan Song

    IPC: H01L33/48 ,  H01L33/62

    CPC classification number: H01L33/483 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: The present invention relates to a method for manufacturing an optical device, and to an optical device manufactured thereby, which involve using a substrate itself as a heat-dissipating plate, and adopting a substrate with vertical insulation layers formed thereon, such that electrode terminals do not have to be extruded out from a sealed space, and thus enabling the overall structure and manufacturing process for an optical device to be simplified.According to the present invention, a method for manufacturing a can package-type optical device comprises the steps of: (a) preparing a metal plate and a metal substrate with vertical insulation layers, wherein more than one vertical insulation layer crossing the substrate from the top surface to the bottom surface thereof are formed; (b) bonding the metal plate on the top surface of the metal substrate with vertical insulation layers; (c) forming a cavity on an intermediate product that has undergone step (b) in a form of a cylindrical pit having a predetermined depth reaching the surface of said metal substrate with vertical insulation layers by passing through said metal plate and the adhesive layers formed by said bonding, wherein said cavity contains said vertical insulation layer in the bottom wall thereof; (e) connecting a wire, which electrically connects an optical device and an electrode of the optical device together, to either side of the surface of the bottom wall of the vertical insulation layers of the cavity, respectively; and (g) sealing the cavity by means of a protective plate made from a light-transmitting material; and a can cap, formed as a picture frame whose top central portion and the bottom are open and encompassing the perimeter of the protective plate.

    Abstract translation: 本发明涉及一种光学器件的制造方法及其制造的光学器件，其涉及使用基板本身作为散热板，并且采用其上形成有垂直绝缘层的基板，使得电极端子 不必从密封空间挤出，从而能够简化光学装置的整体结构和制造过程。 根据本发明，一种罐封装型光学器件的制造方法包括以下步骤：（a）制备具有垂直绝缘层的金属板和金属基板，其中多于一个的垂直绝缘层与 形成其底面的顶面; （b）用垂直绝缘层将金属板与金属基板的顶面接合; （c）在具有预定深度的圆柱形凹坑形式的步骤（b）中形成空腔，该预定深度通过穿过所述金属板并形成的粘合剂层到达所述金属基板的具有垂直绝缘层的表面 通过所述接合，其中所述空腔在其底壁中包含所述垂直绝缘层; （e）将将光学装置和光学装置的电极电连接在一起的导线分别连接到腔的垂直绝缘层的底壁的表面的任一侧; 和（g）通过由透光材料制成的保护板密封空腔; 以及罐盖，其形成为其顶部中心部分和底部打开并且包围保护板的周边的相框。

    SUSCEPTOR
    146.
    发明申请
    SUSCEPTOR 有权

    公开(公告)号：US20240417856A1

    公开(公告)日：2024-12-19

    申请号：US18704378

    申请日：2022-10-19

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo AHN ,  Young Heum EOM ,  Jun Young CHOI

    IPC: C23C16/458

    Abstract: The present invention relates to a susceptor which seats a substrate on the upper surface thereof during a deposition process for the substrate, the susceptor comprising: a first plate; a second plate provided under the first plate; and a planar heater provided between the first and second plates, wherein the planar heater is in the form of a plane, and a heating pattern formed to have a large area corresponding to the area of the plane is provided inside the planar heater. Accordingly, the present invention provides a susceptor in which a uniform temperature is formed over the entire area thereof without the risk of disconnection.

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