公开(公告)号：US09728331B2

公开(公告)日：2017-08-08

申请号：US14565428

申请日：2014-12-10

Applicant: CYNTEC CO., LTD.

Inventor： Lan-Chin Hsieh ,  Roger Hsieh ,  Yu-Ching Kuo ,  Chun-Tiao Liu

IPC: H01F41/04 ,  H01F41/00 ,  H01F3/10 ,  H01F17/04 ,  H01F27/02

CPC classification number: H01F41/005 ,  H01F3/10 ,  H01F17/04 ,  H01F17/045 ,  H01F27/022 ,  H01F2017/048 ,  Y10T29/49073

Abstract: A method to form a choke is disclosed, wherein the method comprises: encapsulating a hollow coil by a molding body; forming a first core, wherein the first core comprises a pillar; and disposing at least one first portion of the pillar inside the encapsulated hollow coil. The method avoids the overflow or vertical flow issue during a molding process for encapsulating a coil that has been wound on a core already.

公开(公告)号：US09704623B2

公开(公告)日：2017-07-11

申请号：US14864821

申请日：2015-09-24

Applicant: CYNTEC CO., LTD.

Inventor： Huang-Chou Chen ,  Ta-Wen Lo ,  Chun-Cheng Yao

IPC: H01C7/06 ,  H01C1/14 ,  H01C1/01

CPC classification number: H01C7/06 ,  H01C1/01 ,  H01C1/14

Abstract: A micro-resistor includes a resistor material layer, an electrode set and a first protective layer. The electrode set includes a first electrode and a second electrode to define an opening which exposes the resistor material layer. A space between the first electrode and the second electrode represents an opening size. The first protective layer covers the opening completely and has a coverage size along a direction parallel with the space. The micro-resistor has a resistance of less than 5 milliohm and the difference of the opening size and the coverage size is less than 3100 micrometer to make the temperature coefficient of electrical resistance of the micro-resistor not greater than 150 ppm/° C.

公开(公告)号：US09655253B2

公开(公告)日：2017-05-16

申请号：US13950335

申请日：2013-07-25

Applicant: Bau-Ru Lu ,  Ming-Chia Wu

Inventor： Bau-Ru Lu ,  Ming-Chia Wu

IPC: H01L21/00 ,  H05K1/18 ,  H01L23/12 ,  H05K3/28 ,  H01L23/538 ,  H01L23/00 ,  H01L21/683 ,  H01L21/56 ,  H05K1/02

CPC classification number: H01L24/24 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/24137 ,  H01L2924/1206 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/284

Abstract: A substrateless device comprises a plurality of first conductive elements and an encapsulant. The encapsulant encapsulates the plurality of first conductive elements, wherein the locations of the plurality of first conductive elements are fixed by the encapsulant; and a plurality of terminals of the plurality of first conductive elements are exposed outside the encapsulant, wherein the plurality of first conductive elements are not supported by a substrate.

公开(公告)号：US09653205B2

公开(公告)日：2017-05-16

申请号：US14698880

申请日：2015-04-29

Applicant: CYNTEC CO., LTD.

Inventor： Chi-Hsun Lee ,  Hsieh-Shen Hsieh ,  Sen-Huei Chen

IPC: H01F27/29 ,  H01F27/02 ,  H01F27/24 ,  H01F27/28 ,  H01F17/04

CPC classification number: H01F27/292 ,  H01F17/04 ,  H01F27/24 ,  H01F27/28 ,  H01F27/2823 ,  H01F27/29

Abstract: An electrical component is disclosed, wherein the electrical component comprises: a body; a conductive element, disposed in the body, wherein at least one portion of a first terminal part of the conductive element is exposed outside of the body; a conductive and adhesive layer, overlaying on the body and covering a first portion of the terminal part of the conductive element, wherein a second portion of the terminal part of the conductive element is not covered by the conductive and adhesive layer; and at least one metal layer, overlaying on the conductive and adhesive layer and covering the second portion of the terminal part of the conductive element, wherein the at least one metal layers is electrically connected to the second portion of the terminal part of the conductive element for electrically connecting with an external circuit.

公开(公告)号：US09576710B2

公开(公告)日：2017-02-21

申请号：US14820558

申请日：2015-08-07

Applicant: Roger Hsieh ,  Cheng-Chang Lee ,  Chun-Tiao Liu ,  Yi-Min Huang ,  Chih-Siang Chuang

Inventor： Roger Hsieh ,  Cheng-Chang Lee ,  Chun-Tiao Liu ,  Yi-Min Huang ,  Chih-Siang Chuang

IPC: H01F7/06 ,  H01F5/00 ,  H01F41/10 ,  H01F41/02 ,  H01F27/00 ,  H01F17/04 ,  H01F27/02 ,  H01F27/29 ,  H05K3/30

CPC classification number: H01F27/29 ,  H01F5/00 ,  H01F5/003 ,  H01F7/06 ,  H01F17/04 ,  H01F27/00 ,  H01F27/022 ,  H01F27/255 ,  H01F27/2828 ,  H01F27/292 ,  H01F41/0206 ,  H01F41/10 ,  H05K3/301 ,  Y10T29/302 ,  Y10T29/49073 ,  Y10T29/49075

Abstract: A magnetic device comprises a lead frame, a first core body and a coil. The lead frame has a first portion and a second portion spaced apart from the first portion. A first core body is disposed on the lead frame, wherein the first core body comprises a first through opening and a second through opening. A coil is disposed on the first core body, wherein the coil has a first terminal and a second terminal, wherein the first portion is electrically connected with the first terminal via the first through opening, and the second portion is electrically connected with the second terminal via the second through opening, respectively.

Abstract translation: 磁性装置包括引线框架，第一芯体和线圈。 引线框架具有与第一部分间隔开的第一部分和第二部分。 第一芯体设置在引线框架上，其中第一芯体包括第一通孔和第二通孔。 线圈设置在第一芯体上，其中线圈具有第一端子和第二端子，其中第一部分经由第一通孔与第一端子电连接，并且第二部分与第二端子电连接 分别通过第二通孔。

公开(公告)号：US09461607B2

公开(公告)日：2016-10-04

申请号：US13861407

申请日：2013-04-12

Applicant: Chen-Chung Liu ,  Ian-Chun Cheng

Inventor： Chen-Chung Liu ,  Ian-Chun Cheng

IPC: H01P5/12 ,  H03H7/01 ,  H03H7/42

CPC classification number: H03H7/0138 ,  H03H7/422

Abstract: The invention discloses a balance filter formed from a combination of a first circuit and a second circuit, wherein both the first circuit and the second circuit have at least one through-hole via inductor. The balance filter is connected to an IC through a first terminal and a second terminal, wherein a power trace is disposed between the first circuit and the second circuit to deliver the power to the IC.

Abstract translation: 本发明公开了一种由第一电路和第二电路的组合形成的平衡滤波器，其中第一电路和第二电路均具有至少一个通孔电感器。 平衡滤波器通过第一端子和第二端子连接到IC，其中功率迹线设置在第一电路和第二电路之间以将功率传递到IC。

公开(公告)号：US09271398B2

公开(公告)日：2016-02-23

申请号：US13481887

申请日：2012-05-28

Applicant: Da-Jung Chen ,  Chun-Tiao Liu

Inventor： Da-Jung Chen ,  Chun-Tiao Liu

IPC: H05K7/18 ,  H05K1/18 ,  H01L23/64 ,  H01L25/16 ,  H01F27/02 ,  H05K3/34

CPC classification number: H05K1/181 ,  H01F27/027 ,  H01L23/645 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  Y10T29/4902 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A power-supply module includes at least one power-supply component, an inductor and a package. The inductor is disposed over the at least one power-supply components, and the at least a power-supply component and the inductor are disposed within the package. Besides, the power-supply module further comprises a printed circuit board, and the at least one power-supply component and the inductor are mounted to the printed circuit board. Moreover, the inductor comprises a plurality of leads that support the inductor over the at least one power-supply component.

Abstract translation: 电源模块包括至少一个电源组件，电感器和封装。 电感器设置在至少一个电源部件上，并且至少一个电源部件和电感器设置在封装内。 此外，电源模块还包括印刷电路板，并且至少一个电源部件和电感器安装到印刷电路板。 此外，电感器包括多个引线，其在至少一个电源部件上支撑电感器。

公开(公告)号：US09257221B2

公开(公告)日：2016-02-09

申请号：US13570267

申请日：2012-08-09

Applicant: Chen-Chung Liu ,  Ian-Chun Cheng

Inventor： Chen-Chung Liu ,  Ian-Chun Cheng

IPC: H03H7/01 ,  H05K1/16 ,  H05K13/00 ,  H01F17/00 ,  H01F19/04

CPC classification number: H01F17/0013 ,  H01F19/04 ,  H01F2017/002 ,  Y10T29/49117

Abstract: The invention discloses a high-frequency device having a through-hole via inductor in a substrate. The through-hole via inductor has an integral body. The inductance of the through-hole via inductor is greater than that of the horizontal inductor. The through-hole via inductor comprises at least two materials, wherein one of said at least two materials is a conductive material. The present invention also discloses a method for manufacturing the structure of the high-frequency device, wherein the method mainly includes via-drilling and via-filling in the substrate, and lithography process on the substrate.

Abstract translation: 本发明公开了一种在衬底中具有通孔通孔电感器的高频器件。 通孔通孔电感器具有整体。 通孔电感的电感大于水平电感的电感。 所述通孔通孔电感器包括至少两种材料，其中所述至少两种材料之一是导电材料。 本发明还公开了一种用于制造高频器件结构的方法，其中该方法主要包括衬底中的通孔钻孔和通孔填充以及衬底上的光刻工艺。

公开(公告)号：US09208937B2

公开(公告)日：2015-12-08

申请号：US13331786

申请日：2011-12-20

Applicant: Tsung-Chan Wu ,  Roger Hsieh ,  Yi-Min Huang ,  Lan-Chin Hsieh ,  Yu-Ching Kuo

Inventor： Tsung-Chan Wu ,  Roger Hsieh ,  Yi-Min Huang ,  Lan-Chin Hsieh ,  Yu-Ching Kuo

IPC: H01F27/02 ,  H01F27/06 ,  H01F27/29 ,  H01F5/00 ,  H01F27/28 ,  H01F27/255 ,  H01F17/04

CPC classification number: H01F27/255 ,  H01F17/045 ,  H01F2017/048

Abstract: A choke includes a single-piece core entirely made of a same material, the single-piece core having two boards and a pillar located between the two boards, a winding space being located among the two boards and the pillar, wherein the pillar has a non-circular and non-rectangular cross section along a direction substantially perpendicular to an axial direction of the pillar, the cross section of the pillar has a first axis and a second axis intersecting with each other at a center of the cross section of the pillar and are substantially perpendicular with each other, the first axis is longer than the second axis, and the cross section of the pillar is substantially symmetrical to both of the first axis and the second axis.

Abstract translation: 扼流圈包括完全由相同材料制成的单片式芯片，单片式芯片具有两块板和位于两块板之间的支柱，一个绕组空间位于两块板和支柱之间，其中支柱具有 沿着与柱的轴向基本垂直的方向的非圆形和非矩形横截面，柱的横截面具有在柱的横截面的中心彼此相交的第一轴和第二轴 并且基本上彼此垂直，所述第一轴线比所述第二轴线长，并且所述支柱的横截面与所述第一轴线和所述第二轴线基本对称。

公开(公告)号：US09009951B2

公开(公告)日：2015-04-21

申请号：US13868993

申请日：2013-04-23

Applicant: Cyntec Co., Ltd.

Inventor： Wei-Chien Chang ,  Chia-Chi Wu ,  Lang-Yi Chiang ,  Tsung-Chan Wu ,  Jih-Hsu Yeh

IPC: H01F7/06 ,  H01F5/00 ,  H01F5/02 ,  H01F27/29 ,  H01F41/04 ,  H01F17/04

CPC classification number: H01F27/2804 ,  H01F5/003 ,  H01F5/02 ,  H01F27/292 ,  H01F41/04 ,  H01F2017/048 ,  H01F2027/2809 ,  Y10T29/49002 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49075

Abstract: An electromagnetic component includes a coil portion with a multi-layer stack structure, a molded body encapsulating the coil portion, and two electrodes respectively coupled to two terminals of the coil portion. The coil portion is fabricated using plating, laminating and/or pressing manufacturing techniques.

Abstract translation: 电磁部件包括具有多层堆叠结构的线圈部分，封装线圈部分的成型体以及分别耦合到线圈部分的两个端子的两个电极。 线圈部分使用电镀，层压和/或压制制造技术制造。