公开(公告)号：US07334922B2

公开(公告)日：2008-02-26

申请号：US10702281

申请日：2003-11-06

Applicant: Timothy A. Bonardi ,  Randall J. Beute ,  Randall S. Braun

Inventor： Timothy A. Bonardi ,  Randall J. Beute ,  Randall S. Braun

IPC: B60Q1/26 ,  B60R1/12

CPC classification number: H05K1/189 ,  B60Q1/2665 ,  B60R1/07 ,  B60R1/088 ,  B60R1/1207 ,  H05K1/02 ,  H05K1/18 ,  H05K3/0058 ,  H05K2201/09072 ,  H05K2201/09081 ,  H05K2201/10106 ,  H05K2201/10484

Abstract: A rearview mirror assembly of the present invention includes a circuit board disposed behind the mirror. The circuit board may be a flexible circuit board and may include an LED mounted to project light through a transparent window in the flexible circuit board and through the mirror. The flexible circuit board may function as a mirror heater and may include conductive paths for connection to the LED and/or electrodes of an electrochromic mirror. The LED may include an LED chip mounted directly on the circuit board and encapsulated thereon by an encapsulant.

Abstract translation: 本发明的后视镜组件包括设置在反射镜后面的电路板。 电路板可以是柔性电路板，并且可以包括安装成将光投射穿过柔性电路板中的透明窗口并通过反射镜的LED​​。 柔性电路板可以用作镜面加热器，并且可以包括用于连接到电致变色镜的LED​​和/或电极的导电路径。 LED可以包括直接安装在电路板上并通过密封剂封装在其上的LED芯片。

公开(公告)号：US07334918B2

公开(公告)日：2008-02-26

申请号：US10730600

申请日：2003-12-08

Applicant: James Newton ,  Bijan Bayat

Inventor： James Newton ,  Bijan Bayat

IPC: F21V1/00

CPC classification number: H05K3/301 ,  F21K9/00 ,  F21L14/023 ,  F21V14/02 ,  F21Y2107/50 ,  F21Y2115/10 ,  H05K1/148 ,  H05K1/18 ,  H05K2201/10106 ,  H05K2201/10484 ,  H05K2201/2027

Abstract: An LED lighting array is disclosed wherein a plurality of light emitting devices disposed in at least first and second columns are mounted on a planar mounting surface to form an emission plane. The emission axes of all the LEDs in a first column are parallel with each other and lie in a first plane. The emission axes of the LEDs in an adjacent, second column are also parallel, but a second plane containing the emission axes of the second column is disposed at a predetermined, non-zero angle with respect to the first plane. The non-zero angle is a function of the LED beam width and the distance to a lighting target. This configuration of the LEDs provides an optimum balance at a predetermined target distance between the size of the area illuminated and the brightness of the illumination of the target. In one aspect of the invention the LED lighting array includes at least first, second and third columns of LEDs. In another aspect of the invention an LED task light includes a transparent tube and an LED lighting array disposed within the tube. An electrical drive circuit associated with the mounting substrate within the tube provides pulsed direct current for driving the LED's.

Abstract translation: 公开了一种LED照明阵列，其中设置在至少第一和第二列中的多个发光器件安装在平面安装表面上以形成发射平面。 第一列中的所有LED的发射轴彼此平行并且位于第一平面中。 相邻的第二列中的LED的发射轴也是平行的，但是包含第二列的发射轴的第二平面相对于第一平面设置在预定的非零角度。 非零角度是LED光束宽度和到照明目标的距离的函数。 LED的这种配置在照明区域的尺寸和目标照明的亮度之间的预定目标距离处提供最佳平衡。 在本发明的一个方面，LED照明阵列至少包括第一，第二和第三列的LED。 在本发明的另一方面，LED任务灯包括透明管和设置在管内的LED照明阵列。 与管内的安装基板相关联的电驱动电路提供用于驱动LED的脉冲直流电。

公开(公告)号：US07233025B2

公开(公告)日：2007-06-19

申请号：US11270504

申请日：2005-11-10

Applicant: Pavan Davuluri ,  Mario R. Cristancho ,  Krishna Darbha

Inventor： Pavan Davuluri ,  Mario R. Cristancho ,  Krishna Darbha

IPC: H01L27/15 ,  H01L29/267 ,  H01L31/12 ,  H01L33/00

CPC classification number: H05K1/181 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  H01S5/02252 ,  H01S5/02276 ,  H01S5/183 ,  H05K2201/10121 ,  H05K2201/10484 ,  H05K2201/10636 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00014

Abstract: A VCSEL die is packaged so that its optical axis is at a predetermined non-perpendicular and nonparallel angle relative to the plane of a PCB to which the packaged die will be mounted. The die is packaged to form an emitting component which is shaped to orient the VCSEL optical axis at the predetermined angle when the component is placed onto a PCB. The component can be used in combination with a flip-chip sensor IC located on an opposite side of a PCB from the emitting component. The component can also be used in combination with a CSP sensor IC on the same side of a PCB. A VCSEL die and sensor IC can be contained in a single package. The optical axis of the VCSEL die packaged with a sensor IC may or may not be perpendicular to a plane of an array in the sensor IC.

Abstract translation: VCSEL管芯被封装成使得其光轴相对于将被安装封装的管芯的PCB的平面处于预定的非垂直和非平行的角度。 芯片被封装以形成发射部件，该部件被成形为当将部件放置在PCB上时将VCSEL光轴定向成预定角度。 该组件可以与位于PCB与发光部件相反的一侧的倒装芯片传感器IC组合使用。 该组件还可以与PCB的同一侧的CSP传感器IC组合使用。 VCSEL裸片和传感器IC可以包含在一个封装中。 与传感器IC封装的VCSEL裸片的光轴可以垂直于传感器IC中的阵列的平面也可以不垂直。

公开(公告)号：US20070102777A1

公开(公告)日：2007-05-10

申请号：US11270504

申请日：2005-11-10

Applicant: Pavan Davuluri ,  Mario Cristancho ,  Krishna Darbha

Inventor： Pavan Davuluri ,  Mario Cristancho ,  Krishna Darbha

IPC: H01L31/0232

CPC classification number: H05K1/181 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  H01S5/02252 ,  H01S5/02276 ,  H01S5/183 ,  H05K2201/10121 ,  H05K2201/10484 ,  H05K2201/10636 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00014

Abstract: A VCSEL die is packaged so that its optical axis is at a predetermined non-perpendicular and nonparallel angle relative to the plane of a PCB to which the packaged die will be mounted. The die is packaged to form an emitting component which is shaped to orient the VCSEL optical axis at the predetermined angle when the component is placed onto a PCB. The component can be used in combination with a flip-chip sensor IC located on an opposite side of a PCB from the emitting component. The component can also be used in combination with a CSP sensor IC on the same side of a PCB. A VCSEL die and sensor IC can be contained in a single package. The optical axis of the VCSEL die packaged with a sensor IC may or may not be perpendicular to a plane of an array in the sensor IC.

公开(公告)号：US20060160382A1

公开(公告)日：2006-07-20

申请号：US11327509

申请日：2006-01-09

Applicant: Kazufumi Nishida ,  Shin'ichi Aoyama

Inventor： Kazufumi Nishida ,  Shin'ichi Aoyama

IPC: H05K1/00

CPC classification number: H05K1/18 ,  H01R12/712 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10484

Abstract: On connection of a control board and an external apparatus, an externally connecting cable which is drawn out from a rear surface of the casing can be drawn out without interfering with other components. A connector terminal 32 which connects the external apparatus is mounted to be inclined with respect to a control board 30 mounted substantially vertically in a cabinet 5, and is mounted along an inclined surface 13A formed in a downward direction in a stepped recessed part 13 of a back cabinet 5B. Thereby, a cable 31 which is connected to the connector terminal 32 does not interfere with a cover portion 13C of the stepped recessed part 13, which covers a support column part 17 of a stand 15.

Abstract translation: 在控制板和外部设备的连接中，可以在不干扰其他部件的情况下抽出从外壳的后表面引出的外部连接电缆。 安装外部装置的连接器端子32相对于基本垂直安装在机壳5中的控制板30而被安装，并且沿着向下方向形成的倾斜面13A安装在台阶式凹部13 因此，连接到连接器端子32的电缆31不会与覆盖支架15的支撑柱部分17的阶梯状凹部13的盖部分13C相干涉。

公开(公告)号：US20050275090A1

公开(公告)日：2005-12-15

申请号：US11147158

申请日：2005-06-08

Applicant: Taibo Nakazawa

Inventor： Taibo Nakazawa

IPC: H01L21/60 ,  H01L23/48 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32

CPC classification number: H05K1/111 ,  H01L2924/0002 ,  H05K3/321 ,  H05K2201/09745 ,  H05K2201/10484 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

Abstract: A chip-component-mounted device comprises a print wiring board or lead frame, an electrically conductive adhesive and a chip component, said chip component being mounted on said print wiring board or lead frame through said electrically conductive adhesive, said chip component having a corner part, a ridgeline of said corner part facing a connected part side of said print wiring board or lead frame, an angle made by a face adjacent to said ridgeline and a face of said connected part being acute.

Abstract translation: 芯片部件安装的装置包括印刷线路板或引线框架，导电粘合剂和芯片部件，所述芯片部件通过所述导电粘合剂安装在所述印刷线路板或引线框架上，所述芯片部件具有角部 所述角部的脊线面对所述印刷布线板或引线框架的连接部分侧，由与所述棱线相邻的面形成的角度和所述连接部分的表面是锐角的。

公开(公告)号：US20050269693A1

公开(公告)日：2005-12-08

申请号：US11143201

申请日：2005-06-02

Applicant: Ronald Green ,  Sridhar Krishnan ,  Stuart Wilson ,  James Shook ,  Ming Tsai ,  Andy Stavros

Inventor： Ronald Green ,  Sridhar Krishnan ,  Stuart Wilson ,  James Shook ,  Ming Tsai ,  Andy Stavros

IPC: H01L23/34 ,  H05K1/14 ,  H05K3/00 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40

CPC classification number: H05K3/368 ,  H05K1/145 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/366 ,  H05K3/403 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09181 ,  H05K2201/09845 ,  H05K2201/0999 ,  H05K2201/10484

Abstract: An assembly is provided which includes a first circuit panel having a top surface, a first dielectric element and first conductive traces disposed on the first dielectric element. In addition, a second circuit panel has a bottom surface, a second dielectric element and second conductive traces disposed on the second dielectric element, where at least a portion of the second circuit panel overlies at least a portion of the first circuit panel. The assembly further includes an interconnect circuit panel having a third dielectric element which has a front surface, a rear surface opposite the front surface, a top end extending between the front and rear surfaces, a bottom end extending between the front and rear surfaces, and a plurality of interconnect traces disposed on the dielectric element. The bottom end of the interconnect element abuts the top surface of the first circuit panel and the top end abuts the bottom surface of the second circuit panel, where at least some of the first conductive traces are in conductive communication with the second conductive traces through the interconnect traces.

Abstract translation: 提供了一种组件，其包括具有顶表面的第一电路板，设置在第一介电元件上的第一介电元件和第一导电迹线。 此外，第二电路板具有底表面，第二介电元件和设置在第二电介质元件上的第二导电迹线，其中第二电路板的至少一部分覆盖在第一电路板的至少一部分上。 该组件还包括具有第三电介质元件的互连电路板，第三电介质元件具有前表面，与前表面相对的后表面，在前表面和后表面之间延伸的顶端，在前表面和后表面之间延伸的底端，以及 布置在电介质元件上的多个互连迹线。 互连元件的底端邻接第一电路板的顶表面，并且顶端邻接第二电路板的底表面，其中至少一些第一导电迹线通过第二导电迹线与第二导电迹线导通连通 互连线。

公开(公告)号：US06904236B2

公开(公告)日：2005-06-07

申请号：US10448335

申请日：2003-05-29

Applicant: Hiroshi Terada ,  Naohiro Tsuchida ,  Yutaka Maeda ,  Kazuyuki Iwasa ,  Tatsuo Takanashi

Inventor： Hiroshi Terada ,  Naohiro Tsuchida ,  Yutaka Maeda ,  Kazuyuki Iwasa ,  Tatsuo Takanashi

IPC: G03B17/00 ,  H05K1/14 ,  H05K3/36 ,  G03B17/02

CPC classification number: G03B17/00 ,  H05K1/148 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/10484 ,  H05K2201/10568 ,  H05K2201/10598

Abstract: In a camera according to the present invention, an edge portion of a lens barrel unit is projected and arranged from a front cover. The lens barrel unit is covered with a front cover cylindrical member connected to the front cover, and a front exposed portion of the front cover cylindrical member is covered with an exterior cylindrical member as a detachable (before-attaching) metal cylindrical member. The exterior cylindrical member is positioned and is fixed by an stop claw on the front-cover side. A C-shaped stop portion cover having flexibility is made flexible and is attached around the stop claw portion, and is fixed by a screw. The restriction on design is reduced on the appearance for covering the lens barrel unit of the camera, and a camera exterior portion can be made of metal.

Abstract translation: 在根据本发明的照相机中，透镜筒单元的边缘部分从前盖突出并布置。 透镜筒单元被连接到前盖的前盖圆柱形构件覆盖，并且前盖圆柱形构件的前部暴露部分被外部圆柱形构件覆盖为可拆卸（安装前）金属圆柱形构件。 外圆柱形部件通过前盖侧的止动爪定位并固定。 具有柔性的C形止挡部分盖被制成柔性并且被安装在止动爪部分周围，并由螺钉固定。 相机的镜筒单元的外观上的设计限制减少，摄像机外部部分可以由金属制成。

公开(公告)号：US20050055172A1

公开(公告)日：2005-03-10

申请号：US10656431

申请日：2003-09-05

Applicant: Richard Flaherty

Inventor： Richard Flaherty

IPC: G01J1/02 ,  H05B37/02 ,  H05K1/18 ,  G06F19/00

CPC classification number: H05B37/0218 ,  G01J1/02 ,  G01J1/0242 ,  H05K1/18 ,  H05K2201/10121 ,  H05K2201/10484 ,  H05K2203/171 ,  Y02B20/46

Abstract: Methods for calibrating a photocontrol device having at least one flexible mounting leg mounting the photosensor to a circuit board and being electrically coupled to activate a switching device and calibrated photocontrol devices are provided. A photocontrol device is positioned proximate a light source. An aperture is positioned between the photosensor and the light source and an angle between the at least one flexible mounting leg and the circuit board is adjusted to calibrate a sensitivity of the photocontrol device to light from the light source passing through the aperture.

Abstract translation: 提供了一种用于校准具有至少一个柔性安装腿的光控制装置的方法，所述至少一个柔性安装腿将光电传感器安装到电路板上并被电耦合以激活开关装置和校准的光控制装置。 光控制装置位于光源附近。 孔被定位在光传感器和光源之间，并且调整至少一个柔性安装腿和电路板之间的角度，以校准光控制装置对来自穿过孔的光源的光的灵敏度。

公开(公告)号：US06783258B2

公开(公告)日：2004-08-31

申请号：US10188911

申请日：2002-07-02

Applicant: Patrick Henry Ryan, Jr.

Inventor： Patrick Henry Ryan, Jr.

IPC: F21V1900

CPC classification number: G09F9/33 ,  H05K1/18 ,  H05K2201/10106 ,  H05K2201/10484 ,  Y10S362/80

Abstract: A portable message sign having a housing and a front surface angled with respect to a rear surface and an array of light emitting devices (such as LEDs) being angled so that the LEDs are parallel to the horizon. The LEDs are mounted at an angle to a printed circuit board (PCB), which is mounted between the front and rear surfaces. In one embodiment, the pins of the LEDs are of different lengths so that when mounted to the PCB the lens of the LED directs light at an angle with respect to the PCB. In another embodiment, a strip of hard material is laid down next to the holes in the PCB that through mount LEDs are inserted, which cause the LED to mount at an angle.