摘要:
A circuit and method for concurrently addressing at least two rows of memory cells of a memory array of a memory device. By concurrently addressing at least two rows of memory cells during testing of the memory device during a burn-in period, the memory device can be tested in a reduced time period.
摘要:
A p-type high concentration doped region is formed in a p-type semiconductor substrate between a n-type doped region as part of an input protection circuit and another n-type doped region as part of internal circuitry. A plate is divided into two over the high concentration doped region. The high concentration doped region suppresses generation of a parasitic MOS transistor with the plate for a gate, one of the n-type doped regions for a source, and the other for a drain.
摘要:
To electrically isolate a MOSFET formed on a substrate from an electrical device, a field shield electrode is buried in a substrate between the MOSFET and the electrical device so that the bottom surface of the field shield electrode is at a level deeper than each of depth levels of diffusion layers of the MOSFET and the electric device. To provide such an electrode, a trench is formed in a substrate at a level deeper than the depth levels of the diffusion layers of both the MOSFET and the electric device. After insulating an entire inner surface of the trench, an field shield electrode is buried and exposed surface of the electrode is covered with an insulating film.
摘要:
A stress mode circuit is provided to generate a voltage that is either equal to a reference voltage or is a proportion of an external voltage (VCCEXT). The circuit includes two voltage divider circuits to provide the proportion voltage. Two differential amplifiers are provided to generate outputs corresponding to a comparison to the proportion voltage and the reference voltage. The outputs operate switches that couple the reference voltage or the proportion voltage to an output terminal.
摘要:
A substrate bias generator avoids using a free-running oscillator and thereby saves power in the standby mode. A clock enable signal from a regulator sets a latch in a self-timed clock circuit. The latch setting initiates a first group of clock signals (that are used by a pump circuit for pumping), at the end of which the latch is reset but concomitantly an input circuit to the latch is disabled from recognizing a new pump signal. Resetting the latch causes the clock circuit to generate a second group of clock signals used in the charge pump to prepare fully for the next demand for pumping. At the end of the second group of clock signals, a full cycle of clocks has been completed in a self-timed manner, and the input circuit to the latch is reenabled to recognize a subsequent pump signal.
摘要:
A negative charge pump circuit for low voltage and wide voltage range applications. The charge pump includes two single-stage p-type pumps. One of the pumps is used to charge a circuit node down to a threshold voltage .vertline.Vt.sub.p .vertline. less than a desired voltage. When used in such a way, the other pump will charge a substrate to a full -VCC.
摘要:
A method of making a semiconductor memory device is discussed, which has a long refresh time and offers high reliability by minimizing junction leakage current, resulting in increased charge retention time. This is achieved by optimizing the diffusion layer junction depth formed in a deeper region of the semiconductor substrate which is in electrical contact with the impurity diffusion layer. Typically, junction depth is in excess of 0.1 .mu.m. Two methods for achieving such a structure are also provided. In one method, implantation voltage in excess of 80 KeV is used to implant P ions to form a high carrier concentration profile at a junction depth of greater than 0.1 .mu.m. In another method, implantation process are carried out in two steps so as to force the previously implanted ions deeper into the storage node electrode, and a subsequent heat treatment is carried out to further distribute the dopant ions into the substrate of the semiconductor substrate so as to disperse crystal defects into the substrate. The resulting structure is essentially free of crystal defects which cause current leakage from the boundary region between the dopant diffusion layer and the substrate in the conventional memory cell structure.
摘要:
A constant current source is used to provide a constant current to set a delay which defines the period of the output of the oscillator. The delay is preferably set by charging a capacitor with the constant current. Because the current is independent of variations in V.sub.CC and temperature, the capacitor will charge for a given period. Therefore, the frequency or period of oscillation will also be fixed and independent of variation in V.sub.CC or temperature. A current limiting circuit and latch are provided to generate an output which will be transmitted through one or a series of inverters. In an alternate embodiment, a differential amplifier is provided between the delay circuit and the current limiting circuit. This differential amplifier is typically needed in a case where VCC is not well-controlled to provide an output signal which has an appropriate voltage. A method of generating an oscillating output for refreshing a DRAM and a method for refreshing a DRAM are also disclosed.
摘要:
An on-chip voltage regulator for controlling a gate of a regulator transistor having a first terminal coupled to receive an external power supply voltage and a second terminal coupled to provide a regulated voltage level to an internal circuit formed on a chip on which the on-chip voltage regulator is formed. The on-chip voltage regulator includes circuitry for detecting when a high current load to which the second terminal of the regulator transistor is coupled is activated. A control transistor is provided having a first terminal coupled to receive the external power supply voltage, a second terminal coupled to the gate of the regulator transistor, and a gate responsive to the means for detecting. In operation, a control voltage with an overshoot portion having preselected duration is generated on the gate of the regulator transistor in response to the activation of the high current load.
摘要:
The present invention has the object of offering a semiconductor production method which simplifies the fabrication of gate electrodes for MOS-type semiconductor elements and allows a high yield to be maintained. For this purpose, it has steps of forming a field-shield gate insulation film on a semiconductor substrate, forming polycrystalline silicon films having an etching rate which is greater at an upper side than a lower side thereon, and etching the polycrystalline silicon films under conditions which allow for side etching with the silicon oxide film as a mask, so as to make gradually tapered inclines on side walls of field-shield gate electrode.