公开(公告)号：US12062369B2

公开(公告)日：2024-08-13

申请号：US17033605

申请日：2020-09-25

申请人： Intel Corporation

发明人： Adam Kupryjanow ,  Tomasz Noczynski ,  Lukasz Pindor ,  Sebastian Rosenkiewicz

IPC分类号： G10L15/20 ,  G10L15/16

CPC分类号： G10L15/20 ,  G10L15/16

摘要： A system, method and computer readable medium for dynamic noise reduction in a voice call. The system includes an encoder having a short-time Fourier transform module to determine a magnitude spectrum and a phase spectrum of an input audio signal, including speech and dynamic noise. A separator coupled to the encoder comprises a temporal convolution network (TCN) used to develop a separation mask using the magnitude spectrum as input. The TCN is trained using a frequency SNR function used to calculate loss during training. A mixer is coupled to the separator to multiply the separation mask with the magnitude spectrum to separate the speech from the dynamic noise to obtain a denoise magnitude spectrum. A decoder coupled to the mixer and the encoder includes an inverse short-time Fourier transform module to reconstruct the input audio signal without the dynamic noise using the denoise magnitude spectrum and the phase spectrum.

公开(公告)号：US12058847B2

公开(公告)日：2024-08-06

申请号：US16888910

申请日：2020-06-01

申请人： Intel Corporation

发明人： Prashant Majhi ,  Abhishek A. Sharma ,  Charles Kuo ,  Brian S. Doyle ,  Urusa Shahriar Alaan ,  Van H Le ,  Elijah V. Karpov ,  Kaan Oguz ,  Arnab Sen Gupta

IPC分类号： H10B12/00 ,  H01L25/065

CPC分类号： H10B12/30 ,  H01L25/0657

摘要： Embodiments may relate to a microelectronic package that includes a first plurality of memory cells of a first type coupled with a substrate. The microelectronic package may further include a second plurality of memory cells of a second type communicatively coupled with the substrate such that the first plurality of memory cells is between the substrate and the second plurality of memory cells. Other embodiments may be described or claimed.

公开(公告)号：US12057402B2

公开(公告)日：2024-08-06

申请号：US17025166

申请日：2020-09-18

申请人： Intel Corporation

发明人： Aleksandar Aleksov ,  Adel A. Elsherbini ,  Shawna M. Liff ,  Johanna M. Swan ,  Feras Eid ,  Randy B. Osborne ,  Van H. Le

IPC分类号： H01L23/538 ,  H01L23/49 ,  H01L25/065

CPC分类号： H01L23/5384 ,  H01L23/49 ,  H01L23/5385 ,  H01L23/5386 ,  H01L25/0657

摘要： Disclosed herein are microelectronic assemblies including microelectronic components that are coupled together by direct bonding, as well as related structures and techniques. For example, in some embodiments, a microelectronic assembly may include an interposer, including an organic dielectric material, and a microelectronic component coupled to the interposer by direct bonding.

公开(公告)号：US12050966B2

公开(公告)日：2024-07-30

申请号：US17555717

申请日：2021-12-20

申请人： Intel Corporation

发明人： Florian Luethi ,  Hubert C. George ,  Felix Frederic Leonhard Borjans ,  Simon Schaal ,  Lester Lampert ,  Thomas Francis Watson ,  Jeanette M. Roberts ,  Jong Seok Park ,  Sushil Subramanian ,  Stefano Pellerano

IPC分类号： G06N10/00 ,  H01L29/12

CPC分类号： G06N10/00 ,  H01L29/12

摘要： An array of quantum dot qubits (e.g., an array of spin qubits) relies on a gradient magnetic field to ensure that the qubits are separated in frequency in order to be individually addressable. Furthermore, a strong magnetic field gradient is required to electrically drive the electric dipole spin resonance (EDSR) of the qubits. Quantum dot devices disclosed herein use microcoil arrangements for providing a gradient magnetic field, the microcoil arrangements integrated on the same chip (e.g., on the same die or wafer) as quantum dot qubits themselves. Unlike previous approaches to quantum dot formation and manipulation, various embodiments of the quantum dot devices disclosed herein may enable improved control over magnetic fields and their gradients to realize better frequency targeting of individual qubits, help minimize adverse effects of charge noise on qubit decoherence and provide good scalability in the number of quantum dots included in the device.

公开(公告)号：US12043398B2

公开(公告)日：2024-07-23

申请号：US17338236

申请日：2021-06-03

申请人： Bell Textron Inc.

发明人： Kip Gregory Campbell ,  Kristen Stuart ,  Steven G. Hagerott

IPC分类号： B64D31/00 ,  B64C27/635 ,  B64C27/68 ,  B64C39/02 ,  B64D27/24 ,  B64U30/20 ,  B64U50/19

CPC分类号： B64D31/00 ,  B64C27/635 ,  B64C27/68 ,  B64C39/024 ,  B64D27/24 ,  B64U30/20 ,  B64U50/19 ,  B64U2201/00

摘要： A system can include a flight controller for an aircraft that includes an electric motor that drives blades with a variable pitch, where the flight controller receives a command to change a flight characteristic of the aircraft and creates a torque command and a revolutions per minute (RPM) command. The system can also include a propulsion assembly, where the propulsion assembly creates a current command based at least in part on the torque command and the RPM command, creates a blade pitch command based at least in part on the torque command and the RPM command, communicates the current command to the electric motor to change a mechanical output of the electric motor, and communicates the blade pitch command to blade actuators to control the pitch of the blades. The current command and the blade pitch command cause the blades of the aircraft to rotate at a predetermined RPM.

公开(公告)号：US12043375B2

公开(公告)日：2024-07-23

申请号：US17547578

申请日：2021-12-10

申请人： Bell Textron Inc.

发明人： Colton Gilliland ,  Russell Mueller

IPC分类号： F16C35/063 ,  B64C27/12 ,  B64C27/32

CPC分类号： B64C27/32 ,  B64C27/12

摘要： A bearing restraint, for use on a rotorcraft with a rotor mast and bearing assembly. The bearing restraint interfacing with a mast groove along the rotor mast to longitudinally restrain the bearing assembly. The bearing restraint includes a pilot ring, groove collar, and retaining ring.

公开(公告)号：US12015446B2

公开(公告)日：2024-06-18

申请号：US16984437

申请日：2020-08-04

申请人： Intel Corporation

发明人： Saeed Fathololoumi ,  Ling Liao ,  Quan Tran

IPC分类号： H04B10/00 ,  H04B10/50 ,  H04B10/508 ,  H04J14/00

CPC分类号： H04B10/5053 ,  H04B10/506 ,  H04B10/508

摘要： Disclosed herein are optical transceivers with multi-laser modules, as well as related optoelectronic assemblies and methods. In some embodiments, an optical transceiver may include: a first laser and a second laser; an optical output path, wherein an output of the first laser is coupled to the optical output path; and switching circuitry to decouple the output of the first laser from the optical output path and to couple an output of the second laser to the optical output path.

公开(公告)号：US12007170B2

公开(公告)日：2024-06-11

申请号：US16533235

申请日：2019-08-06

申请人： Intel Corporation

发明人： Feras Eid ,  Telesphor Kamgaing ,  Georgios Dogiamis ,  Aleksandar Aleksov ,  Johanna M. Swan

IPC分类号： F28D15/04 ,  H01L23/367 ,  H01L23/38 ,  H01L23/427

CPC分类号： F28D15/046 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/38 ,  H01L23/427

摘要： Disclosed herein are structures and assemblies that may be used for thermal management in integrated circuit (IC) packages.

公开(公告)号：US11990709B2

公开(公告)日：2024-05-21

申请号：US16902832

申请日：2020-06-16

申请人： Intel Corporation

发明人： Raul Enriquez Shibayama ,  Carlos Alberto Lizalde Moreno ,  Gaudencio Hernandez Sosa ,  Kai Xiao

IPC分类号： H01R13/00 ,  H01R12/71 ,  H01R13/6469 ,  H01R13/6471 ,  H05K7/14

CPC分类号： H01R13/6469 ,  H01R12/718 ,  H01R13/6471 ,  H05K7/1452

摘要： Microelectronic assemblies, as well as related structures, devices, and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a microelectronic device having a hexagonal node configuration, wherein the hexagonal node configuration may include a differential signal node pair; a power node; and a plurality of ground nodes; and wherein the differential signal node pair, the power node, and the plurality of ground nodes are arranged in a hexagonal parallelogon pattern, wherein the differential signal node pair includes a first differential signal node adjacent to a second differential signal node, and wherein the power node is adjacent and symmetric to the differential signal node pair; and a microelectronic substrate electrically coupled to the microelectronic device.

公开(公告)号：US11984487B2

公开(公告)日：2024-05-14

申请号：US16892447

申请日：2020-06-04

申请人： Intel Corporation

发明人： Sean T. Ma ,  Guillaume Bouche

IPC分类号： H01L29/423 ,  H01L21/8234 ,  H01L27/088 ,  H01L27/092 ,  H01L29/06 ,  H01L29/10 ,  H01L29/51 ,  H01L29/66 ,  H01L29/775 ,  H01L29/78 ,  H01L29/786 ,  B82Y10/00

CPC分类号： H01L29/4238 ,  H01L21/823431 ,  H01L27/0886 ,  H01L27/092 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/1037 ,  H01L29/42376 ,  H01L29/42392 ,  H01L29/516 ,  H01L29/66439 ,  H01L29/66469 ,  H01L29/775 ,  H01L29/785 ,  H01L29/78696 ,  B82Y10/00

摘要： Disclosed herein are non-planar transistor (e.g., nanoribbon) arrangements having asymmetric gate enclosures on at least one side. An example transistor arrangement includes a channel material shaped as a nanoribbon, and a gate stack wrapping around at least a portion of a first face of the nanoribbon, a sidewall, and a portion of a second face of the nanoribbon. Portions of the gate stack provided over the first and second faces of the nanoribbon extend in a direction parallel to the longitudinal axis of the nanoribbon for a certain distance that may be referred to as a “gate length.” A portion of the gate stack wrapping around the sidewall of the nanoribbon does not extend along the entire gate length, but, rather, extends over less than a half of the gate length, e.g., about one third of the gate length, thus making the gate enclosure on that sidewall asymmetric.