Semiconductor device substrate with embedded capacitor
    11.
    发明授权
    Semiconductor device substrate with embedded capacitor 有权
    具有嵌入式电容器的半导体器件衬底

    公开(公告)号:US07235838B2

    公开(公告)日:2007-06-26

    申请号:US10881372

    申请日:2004-06-30

    Abstract: A method for forming a semiconductor device including a DRAM cell structure comprising a silicon on insulator (SOI) substrate with an embedded capacitor structure including providing a substrate comprising an overlying first electrically insulating layer; forming a first electrically conductive layer on the first electrically insulating layer to form a first electrode; forming a capacitor dielectric layer on the first electrode; forming a second electrically conductive layer on the capacitor dielectric layer to form a second electrode; forming a second electrically insulating layer on the second electrode; and, forming a monocrystalline silicon layer over the second electrode to form an SOI substrate comprising a first capacitor structure.

    Abstract translation: 一种用于形成半导体器件的方法,该半导体器件包括具有嵌入式电容器结构的绝缘体上硅(SOI)衬底的DRAM单元结构,包括提供包括上覆的第一电绝缘层的衬底; 在所述第一电绝缘层上形成第一导电层以形成第一电极; 在所述第一电极上形成电容器电介质层; 在所述电容器介电层上形成第二导电层以形成第二电极; 在所述第二电极上形成第二电绝缘层; 以及在所述第二电极上形成单晶硅层以形成包括第一电容器结构的SOI衬底。

    Ultra-thin body transistor with recessed silicide contacts
    15.
    发明申请
    Ultra-thin body transistor with recessed silicide contacts 审中-公开
    具有凹陷硅化物触点的超薄体晶体管

    公开(公告)号:US20050158923A1

    公开(公告)日:2005-07-21

    申请号:US11081104

    申请日:2005-03-15

    Abstract: A semiconductor device (100), including a dielectric pedestal (220) located above and integral to a substrate (110) and having first sidewalls (230), a channel region (210) located above the dielectric pedestal (220) and having second sidewalls (240), and source and drain regions (410) opposing the channel region (210) and each substantially spanning one of the second sidewalls (240). An integrated circuit (800) incorporating the semiconductor device (100) is also disclosed, as well as a method of manufacturing the semiconductor device (100).

    Abstract translation: 一种半导体器件(100),包括位于衬底(110)上方并与衬底(110)成一体并具有第一侧壁(230)的电介质基座(220),位于电介质基座(220)上方的通道区域(210) (240),以及与沟道区(210)相对并且每个基本跨越第二侧壁(240)中的一个的源极和漏极区(410)。 还公开了结合半导体器件(100)的集成电路(800),以及制造半导体器件(100)的方法。

    Semiconductor device with high-k gate dielectric
    18.
    发明申请
    Semiconductor device with high-k gate dielectric 有权
    具有高k栅极电介质的半导体器件

    公开(公告)号:US20050035345A1

    公开(公告)日:2005-02-17

    申请号:US10832020

    申请日:2004-04-26

    Abstract: An integrated circuit includes a substrate, a first transistor, and a second transistor. The first transistor has a first gate dielectric portion located between a first gate electrode and the substrate. The first gate dielectric portion includes a first high-permittivity dielectric material and/or a second high-permittivity dielectric material. The first gate dielectric portion has a first equivalent silicon oxide thickness. The second transistor has a second gate dielectric portion located between a second gate electrode and the substrate. The second gate dielectric portion includes the first high-permittivity dielectric material and/or the second high-permittivity dielectric material. The second gate dielectric portion has a second equivalent silicon oxide thickness. The second equivalent silicon oxide thickness may be different than the first equivalent silicon oxide thickness.

    Abstract translation: 集成电路包括衬底,第一晶体管和第二晶体管。 第一晶体管具有位于第一栅电极和衬底之间的第一栅电介质部分。 第一栅介质部分包括第一高介电常数电介质材料和/或第二高介电常数介电材料。 第一栅介质部分具有第一等效氧化硅厚度。 第二晶体管具有位于第二栅电极和衬底之间的第二栅介质部分。 第二栅介质部分包括第一高介电常数电介质材料和/或第二高介电常数介电材料。 第二栅介质部分具有第二等效氧化硅厚度。 第二等效氧化硅厚度可以不同于第一等效氧化硅厚度。

    Photo-induced DNA-cleaving agents
    20.
    发明授权
    Photo-induced DNA-cleaving agents 失效
    光诱导的DNA切割剂

    公开(公告)号:US5734032A

    公开(公告)日:1998-03-31

    申请号:US581314

    申请日:1995-12-29

    CPC classification number: C07H21/00 C12N15/10 C12Q1/68

    Abstract: The present invention discloses a photo-induced DNA-cleaving agent composition comprises N-aryl-N-(alkyl or arylalkyl)hydroxylamine having the following formula: ##STR1## wherein R is C.sub.1 -C.sub.6 alkyl, phenyl, C.sub.1 -C.sub.6 alkoxy, phenoxy, C.sub.1 -C.sub.6 alkoxycarbonyl, halogen or halo(C.sub.1 -C.sub.6 alkyl)wherein R.sub.1 is hydrogen, C.sub.1 -C.sub.6 alkyl, phenyl, C.sub.1 -C.sub.6 alkoxy, C.sub.1 -C.sub.6 alkoxycarbonyl, halogen or halo(C.sub.1 -C.sub.6 alkyl); R.sub.2 is hydrogen; R.sub.3 is hydrogen or phenyl; R.sub.4 is hydrogen, phenyl, hydroxylphenyl, methoxyphenyl, dimethoxyphenyl, dimethylaminophenyl or naphthyl. The present N-aryl-N-(alkyl or arylalkyl)hydroxylamine is stable in dark, but it can react with O.sub.2 to form HO.multidot. radicals under irradiation of UV light for a period of 2-3 hours. The HO.multidot. radicals then react with DNA to accomplish cleavage of DNA.

    Abstract translation: 本发明公开了一种光致DNA切割剂组合物,其包含具有下式的N-芳基-N-(烷基或芳烷基)羟胺:其中R是C1-C6烷基,苯基,C1-C6 烷氧基,苯氧基,C1-C6烷氧基羰基,卤素或卤素(C1-C6烷基),其中R1是氢,C1-C6烷基,苯基,C1-C6烷氧基,C1-C6烷氧基羰基,卤素或卤素(C1-C6烷基) R2是氢; R3是氢或苯基; R4是氢,苯基,羟基苯基,甲氧基苯基,二甲氧基苯基,二甲基氨基苯基或萘基。 本发明的N-芳基-N-(烷基或芳基烷基)羟胺在黑暗中稳定,但在紫外线照射下可与O 2反应形成HOx自由基2-3小时。 然后,HOx自由基与DNA反应以完成DNA的切割。

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