公开(公告)号：US20120144875A1

公开(公告)日：2012-06-14

申请号：US13256183

申请日：2010-03-19

Applicant: Young Jong Kim ,  Hyuk Soo Lee ,  Seong No Yoon ,  Dong Yoon Kim ,  Dong Min Kim

Inventor： Young Jong Kim ,  Hyuk Soo Lee ,  Seong No Yoon ,  Dong Yoon Kim ,  Dong Min Kim

IPC: D06F37/02 ,  D06F39/00

CPC classification number: F16F15/363 ,  D06F37/206 ,  D06F37/245

Abstract: The present invention relates to a laundry processing apparatus. In particular, the laundry processing apparatus comprises: a cabinet; an outer chamber provided within the cabinet and in which wash water is filled; an inner chamber rotatably provided within the outer chamber to hold laundry; an upper balancer disposed at an upper portion of the inner chamber; and a lower balancer disposed at a lower portion of the inner chamber, wherein either the upper balancer or the lower balancer is a liquid balancer filled with liquid, and the other balancer is a ball balancer having a ball therein, such that the advantages of maximized balancing results and an effective reduction in vibration may be achieved.

Abstract translation: 衣物处理装置技术领域本发明涉及一种衣物处理装置。 具体地，衣物处理装置包括：橱柜; 设置在机柜内并且其中填充有洗涤水的外部室; 内室，其可旋转地设置在所述外室内以保持衣物; 设置在所述内腔的上部的上平衡器; 以及下部平衡器，其设置在所述内部室的下部，其中所述上部平衡器或下部平衡器是充满液体的液体平衡器，并且所述另一个平衡器是具有球的球平衡器，使得最大化 可以实现平衡结果和有效的振动降低。

公开(公告)号：US20100212370A1

公开(公告)日：2010-08-26

申请号：US12708097

申请日：2010-02-18

Applicant: Hyuk Soo LEE ,  Tae Hee LEE ,  Young Jong KIM

Inventor： Hyuk Soo LEE ,  Tae Hee LEE ,  Young Jong KIM

IPC: D06F23/00

CPC classification number: D06F37/206 ,  D06F37/145 ,  D06F37/267 ,  D06F37/30

Abstract: A fabric treating machine according to the present invention comprises a connector which is disposed at an outer tub and is connected to a driving part which is disposed at either the center or the off-center position of the connector optionally. Therefore, not only the direct driving motor but the indirect driving motor can be disposed without change of the outer tub and the connector. Because the common use of the outer tub is possible regardless of the connecting method of the driving part, there are the advantages that the cost is reduced and productivity and assembly are improved.

Abstract translation: 根据本发明的织物处理机包括设置在外桶处的连接器，并且连接到可选地设置在连接器的中心位置或脱离中心位置的驱动部分。 因此，除了外桶和连接器之外，不但可以配置直接驱动电动机，而且可以配置间接驱动电动机。 由于无论驱动部件的连接方式如何，都可以通常使用外桶，因此具有降低成本，提高生产率和组装的优点。

公开(公告)号：US20090218077A1

公开(公告)日：2009-09-03

申请号：US12160097

申请日：2007-01-03

Applicant: Young Hwan Ko ,  Hyuk Soo Lee ,  Bum Suk Kim ,  Sang Kyoung Park ,  Byung Soon Kim

Inventor： Young Hwan Ko ,  Hyuk Soo Lee ,  Bum Suk Kim ,  Sang Kyoung Park ,  Byung Soon Kim

IPC: F28D15/00 ,  F25B39/02 ,  F25B1/10 ,  F25B41/04

CPC classification number: F25B13/00 ,  F25B1/10 ,  F25B31/004 ,  F25B43/00 ,  F25B43/006 ,  F25B2313/02741 ,  F25B2341/0662 ,  F25B2400/075 ,  F25B2400/0751 ,  F25B2400/13 ,  F25B2400/23 ,  F25B2500/01 ,  F25B2600/0253 ,  F25B2600/2509 ,  F25B2600/2519 ,  Y02B30/741

Abstract: The present invention discloses an air conditioning system comprises a phase separator separating a gaseous refrigerant and a liquid refrigerant from a flowing refrigerant, an evaporator evaporating the liquid refrigerant separated by the phase separator, and at least one compressor including a first compressing part receiving the refrigerant via the evaporator and a second compressing part receiving both of the gaseous refrigerant separated by the phase separator and the refrigerant via the first compressing part, wherein a volume of a first cylinder of the first compressing part is different from a volume of a second cylinder of the second compressing part.

Abstract translation: 本发明公开了一种空调系统，包括从流动制冷剂分离气态制冷剂和液体制冷剂的相分离器，蒸发由相分离器分离的液体制冷剂的蒸发器和至少一个压缩机，该压缩机包括接收制冷剂的第一压缩部件 通过蒸发器和第二压缩部件，其接收由相分离器分离的气态制冷剂和经由第一压缩部件的制冷剂，其中第一压缩部件的第一气缸的体积与第一压缩部件的第二气缸的体积不同， 第二压缩部。

公开(公告)号：US20080054518A1

公开(公告)日：2008-03-06

申请号：US11896103

申请日：2007-08-29

Applicant: Seung-Hyun RA ,  Myeong-Ho HONG ,  Hyuk-Soo LEE ,  Jung-Woo LEE ,  Jeong-Bok KWAK

Inventor： Seung-Hyun RA ,  Myeong-Ho HONG ,  Hyuk-Soo LEE ,  Jung-Woo LEE ,  Jeong-Bok KWAK

IPC: B29C33/38

CPC classification number: B29C33/3878 ,  H05K3/0014 ,  H05K2203/0108

Abstract: A method of manufacturing a stamper is disclosed. By using a method that includes: manufacturing a small stamper, in which a first relievo is formed; repeatedly imprinting the small stamper on a large master mold to form a first intaglio corresponding to the first relievo; and molding such that a second relievo is formed, which is in correspondence with the first intaglio, a broad stamper having identical repeated patterns may be manufactured.

Abstract translation: 公开了制造压模的方法。 通过使用包括：制造其中形成有第一缓冲器的小型压模的方法; 将小压模重复地压印在大型模具上以形成对应于第一减压器的第一凹版; 并且成型为形成与第一凹版对应的第二缓冲器，可以制造具有相同重复图案的宽压模。

公开(公告)号：US20080008824A1

公开(公告)日：2008-01-10

申请号：US11819720

申请日：2007-06-28

Applicant: Jae-Choon Cho ,  Myeong-Ho Hong ,  Senug-Hyun Ra ,  Hyuk-Soo Lee ,  Jeong-Bok Kwak ,  Jung-Woo Lee ,  Choon-Keun Lee ,  Sang-Moon Lee

Inventor： Jae-Choon Cho ,  Myeong-Ho Hong ,  Senug-Hyun Ra ,  Hyuk-Soo Lee ,  Jeong-Bok Kwak ,  Jung-Woo Lee ,  Choon-Keun Lee ,  Sang-Moon Lee

IPC: H05K3/46

CPC classification number: H05K1/09 ,  H05K3/0014 ,  H05K3/107 ,  H05K2201/0329 ,  H05K2203/0108 ,  H05K2203/0796

Abstract: The present invention relates to a method for manufacturing a printed circuit board, more particularly to a method for manufacturing a printed circuit board, in which an oxidant capable of polymerizing conductive polymers is selectively marked on a board using imprinting, and the monomer of a conductive polymer is filled in the selected pattern and polymerized, to provide a conductive polymer wiring pattern. With the method for manufacturing a printed circuit board according to certain aspects of the invention as set forth above, a printed circuit board can be given finer wiring widths to allow a highly integrated, highly efficient printed circuit board. Thus, a printed circuit board (PCB) or a flexible printed circuit boards (FPCB) can be manufactured that is applicable to industrial, clerical, and domestic electric electronic products, by a new technique of forming conductive polymer wiring using imprinting.

Abstract translation: 本发明涉及一种印刷电路板的制造方法，更具体地说，涉及一种印刷电路板的制造方法，其中使用压印法在基板上选择性地标记导电聚合物聚合的氧化剂，并且导电的单体 聚合物以选定的图案填充并聚合，以提供导电聚合物布线图案。 根据如上所述的根据本发明的某些方面的印刷电路板的制造方法，印刷电路板可以被给予更细的布线宽度，以允许高度集成的高效印刷电路板。 因此，可以通过使用压印形成导电聚合物布线的新技术，制造适用于工业，文书和家用电子电子产品的印刷电路板（PCB）或柔性印刷电路板（FPCB）。

公开(公告)号：US06178043B1

公开(公告)日：2001-01-23

申请号：US09447564

申请日：1999-11-23

Applicant: Jung Young Son ,  Vadim V. Smirnov ,  Vadim V. Novoselsky ,  Yong-Jin Choi ,  Hyuk-Soo Lee ,  Ji-Eun Ban

Inventor： Jung Young Son ,  Vadim V. Smirnov ,  Vadim V. Novoselsky ,  Yong-Jin Choi ,  Hyuk-Soo Lee ,  Ji-Eun Ban

IPC: G02B2722

CPC classification number: G02B27/2214 ,  G03B21/005

Abstract: A multiview three-dimensional image display system comprises an image projection screen, two image generation components, a bifold mirror, an spatial light modulator, and projection optics. Each of the image generation components generates successive finite time sequences of time-multiplexed multiview images and thus form a channel of multiview images. Each of the reflecting surfaces of the bifold mirror reflects a different one of the two channels of multiview images. The spatial light modulator comprises a plurality of strip-like shutters, each of which transmits a different one of the finite time sequences of time-multiplexed multiview images. The projection optics projects the images through the spatial light modulator onto the image projection screen, where the spatial light modulator is imaged to make a single viewing zone.

Abstract translation: 多视点三维图像显示系统包括图像投影屏幕，两个图像生成部件，双折射镜，空间光调制器和投影光学器件。 每个图像生成组件产生时间复用多视图图像的连续的有限时间序列，并且因此形成多视图图像的通道。 双折射镜的每个反射表面反映了两视通图像中不同的一个。 空间光调制器包括多个带状快门，每个快门都发送时间复用多视点图像的有限时间序列中的不同的一个。 投影光学器件通过空间光调制器将图像投射到图像投影屏幕上，在该投影屏幕上对空间光调制器进行成像以形成单个观察区域。

公开(公告)号：US09549458B2

公开(公告)日：2017-01-17

申请号：US13878319

申请日：2011-10-05

Applicant: Hyun Gyu Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Yun Ho An ,  Hyuk Soo Lee ,  In Hee Cho

Inventor： Hyun Gyu Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Yun Ho An ,  Hyuk Soo Lee ,  In Hee Cho

IPC: H05K1/02 ,  H01L25/075 ,  H05K1/05 ,  H01L23/367 ,  H01L23/498 ,  H01L33/64

CPC classification number: H05K1/021 ,  H01L23/3677 ,  H01L23/49838 ,  H01L25/0753 ,  H01L33/642 ,  H01L2224/73203 ,  H05K1/0204 ,  H05K1/056 ,  H05K2201/09054 ,  H05K2201/10106

Abstract: Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate including an integrated metal projection to which the plurality of heat generating devices are attached, an insulation layer exposing the integrated metal projection, the insulation layer being disposed on the metal plate, and a plurality of electrode pads disposed on the insulation layer, the plurality of electrode pads applying a voltage into each of the heat generating devices. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.

Abstract translation: 提供一种用于安装多个发热装置的辐射热电路板。 辐射热电路板包括金属板，该金属板包括集成的金属突起，多个发热器件被安装在该金属突起上，暴露集成金属突起的绝缘层，绝缘层设置在金属板上，以及多个电极焊盘 设置在绝缘层上，多个电极焊盘将电压施加到每个发热器件中。 因此，可以在发热装置之间设置辐射突起以改善热辐射。

公开(公告)号：US09497853B2

公开(公告)日：2016-11-15

申请号：US13997544

申请日：2011-12-23

Applicant: Sang Myung Lee ,  Sung Woon Yoon ,  Hyuk Soo Lee ,  Sung Won Lee ,  Ki Do Chun

Inventor： Sang Myung Lee ,  Sung Woon Yoon ,  Hyuk Soo Lee ,  Sung Won Lee ,  Ki Do Chun

IPC: H01B13/00 ,  H05K1/11 ,  H05K1/02 ,  H05K3/46 ,  H05K3/20

CPC classification number: H05K1/0298 ,  H05K3/202 ,  H05K3/4647 ,  H05K3/465 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/098 ,  H05K2203/0323 ,  H05K2203/0376

Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a center part having a first width and a contact part having a second width, the contact part makes contact with a surface of the core insulating layer, and the first width is larger than the second width. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.

Abstract translation: 公开了一种印刷电路板及其制造方法。 印刷电路板包括芯绝缘层，至少一个通过芯绝缘层形成的通孔，埋在芯绝缘层中的内电路层，以及在芯绝缘层的顶表面或底表面上的外电路层 其中所述通孔包括具有第一宽度的中心部分和具有第二宽度的接触部分，所述接触部分与所述芯绝缘层的表面接触，并且所述第一宽度大于所述第二宽度。 同时形成内部电路层和通孔，从而减少工艺步骤。 由于设置了奇数电路层，所以印刷电路板具有轻薄的结构。

公开(公告)号：US20130188359A1

公开(公告)日：2013-07-25

申请号：US13878637

申请日：2011-10-10

Applicant: Hyun Gyu Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Yun Ho An ,  Hyuk Soo Lee ,  In Hee Cho

Inventor： Hyun Gyu Park ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Yun Ho An ,  Hyuk Soo Lee ,  In Hee Cho

IPC: H05K7/20 ,  H05K13/00 ,  H05K3/30 ,  F21V29/00

CPC classification number: H05K7/205 ,  F21V29/70 ,  G02F1/133615 ,  H01L23/3677 ,  H01L25/0753 ,  H01L33/647 ,  H01L2224/16225 ,  H05K1/0204 ,  H05K1/056 ,  H05K1/113 ,  H05K3/30 ,  H05K3/4608 ,  H05K13/00 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10969 ,  Y10T29/4913

Abstract: Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached, an insulation member exposing the integrated metal projection, the insulation member comprising a plurality of insulation layers disposed on the metal plate, and first and second electrode pads disposed on the insulation member, the first and second electrode pads disposed being electrically separated from each other. The first and second electrode pads receives a voltage from circuit wires disposed on the insulation layers different from each other of the insulation member. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.

Abstract translation: 提供一种用于安装多个发热装置的辐射热电路板。 辐射热电路板包括金属板，该金属板包括集成的金属突起，多个发热装置附接到该金属突起，暴露一体金属突起的绝缘构件，绝缘构件包括设置在金属板上的多个绝缘层，以及 布置在绝缘构件上的第一和第二电极焊盘，布置的第一和第二电极焊盘彼此电分离。 第一和第二电极焊盘从设置在绝缘层彼此不同的绝缘层上的电路线接收电压。 因此，可以在发热装置之间设置辐射突起以改善热辐射。

公开(公告)号：US20130118782A1

公开(公告)日：2013-05-16

申请号：US13811365

申请日：2011-07-15

Applicant: In Hee Cho ,  Yun Ho An ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Hyun Gyu Park ,  Hyuk Soo Lee

Inventor： In Hee Cho ,  Yun Ho An ,  Eun Jin Kim ,  Hae Yeon Kim ,  Jae Man Park ,  Hyun Gyu Park ,  Hyuk Soo Lee

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K1/181 ,  H01L23/3677 ,  H01L2224/48227 ,  H05K1/0204 ,  H05K1/03 ,  H05K1/09 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2203/0369

Abstract: Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced.

Abstract translation: 公开了一种辐射热电路板及其制造方法。 用于在其上安装发热装置的辐射热电路板包括金属板，该金属板包括金属突起，该金属突起具有焊料，发光装置附着到该金属突起上，金属突起上的接合层， 金属板以暴露金属突起，以及绝缘层上的电路图案。 通过在安装垫下方设置包括散热突起的金属板，将从发热装置发出的热量直接传递到金属板，从而提高散热效率。 热辐射突起的表面镀有包含铜的合金，从而提高相对于焊料的粘合性，从而降低了故障率。