RADIANT HEAT CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
    6.
    发明申请
    RADIANT HEAT CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
    辐射热电路板及其制造方法

    公开(公告)号:US20130118782A1

    公开(公告)日:2013-05-16

    申请号:US13811365

    申请日:2011-07-15

    IPC分类号: H05K1/18 H05K1/03 H05K1/09

    摘要: Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced.

    摘要翻译: 公开了一种辐射热电路板及其制造方法。 用于在其上安装发热装置的辐射热电路板包括金属板,该金属板包括金属突起,该金属突起具有焊料,发光装置附着到该金属突起上,金属突起上的接合层, 金属板以暴露金属突起,以及绝缘层上的电路图案。 通过在安装垫下方设置包括散热突起的金属板,将从发热装置发出的热量直接传递到金属板,从而提高散热效率。 热辐射突起的表面镀有包含铜的合金,从而提高相对于焊料的粘合性,从而降低了故障率。