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公开(公告)号：US09844142B2
公开(公告)日：2017-12-12
申请号：US13811365
申请日：2011-07-15
申请人： In Hee Cho , Yun Ho An , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Hyun Gyu Park , Hyuk Soo Lee
发明人： In Hee Cho , Yun Ho An , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Hyun Gyu Park , Hyuk Soo Lee
CPC分类号： H05K1/181 , H01L23/3677 , H01L2224/48227 , H05K1/0204 , H05K1/03 , H05K1/09 , H05K3/0061 , H05K2201/10106 , H05K2203/0369
摘要： Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced.
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2.发明授权Radiant heat circuit board, method of manufacturing the same, heat generating device package having the same, and backlight 有权辐射热电路板，其制造方法，具有该发热装置的发热装置封装以及背光源公开(公告)号：US09307675B2
公开(公告)日：2016-04-05
申请号：US13878637
申请日：2011-10-10
申请人： Hyun Gyu Park , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Yun Ho An , Hyuk Soo Lee , In Hee Cho
发明人： Hyun Gyu Park , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Yun Ho An , Hyuk Soo Lee , In Hee Cho
IPC分类号： F21V29/00 , H05K7/20 , H01L23/367 , H01L25/075 , H01L33/64 , H05K3/30 , H05K13/00 , G02F1/1335 , H05K1/02 , H05K3/46 , F21V29/70 , H05K1/05 , H05K1/11
CPC分类号： H05K7/205 , F21V29/70 , G02F1/133615 , H01L23/3677 , H01L25/0753 , H01L33/647 , H01L2224/16225 , H05K1/0204 , H05K1/056 , H05K1/113 , H05K3/30 , H05K3/4608 , H05K13/00 , H05K2201/09054 , H05K2201/10106 , H05K2201/10969 , Y10T29/4913
摘要： Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached, an insulation member exposing the integrated metal projection, the insulation member comprising a plurality of insulation layers disposed on the metal plate, and first and second electrode pads disposed on the insulation member, the first and second electrode pads disposed being electrically separated from each other. The first and second electrode pads receives a voltage from circuit wires disposed on the insulation layers different from each other of the insulation member. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.
摘要翻译： 提供一种用于安装多个发热装置的辐射热电路板。 辐射热电路板包括金属板，该金属板包括集成的金属突起，多个发热装置附接到该金属突起，暴露一体金属突起的绝缘构件，绝缘构件包括设置在金属板上的多个绝缘层，以及 布置在绝缘构件上的第一和第二电极焊盘，布置的第一和第二电极焊盘彼此电分离。 第一和第二电极焊盘从设置在绝缘层彼此不同的绝缘层上的电路线接收电压。 因此，可以在发热装置之间设置辐射突起以改善热辐射。
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3.发明申请RADIANT HEAT CIRCUIT BOARD, HEAT GENERATING DEVICE PACKAGE HAVING THE SAME, AND BACKLIGHT UNIT 有权辐射热电路板，具有该发光装置的发热装置包和背光单元公开(公告)号：US20130206459A1
公开(公告)日：2013-08-15
申请号：US13878319
申请日：2011-10-05
申请人： Hyun Gyu Park , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Yun Ho An , Hyuk Soo Lee , In Hee Cho
发明人： Hyun Gyu Park , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Yun Ho An , Hyuk Soo Lee , In Hee Cho
IPC分类号： H05K1/02
CPC分类号： H05K1/021 , H01L23/3677 , H01L23/49838 , H01L25/0753 , H01L33/642 , H01L2224/73203 , H05K1/0204 , H05K1/056 , H05K2201/09054 , H05K2201/10106
摘要： Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate including an integrated metal projection to which the plurality of heat generating devices are attached, an insulation layer exposing the integrated metal projection, the insulation layer being disposed on the metal plate, and a plurality of electrode pads disposed on the insulation layer, the plurality of electrode pads applying a voltage into each of the heat generating devices. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.
摘要翻译： 提供一种用于安装多个发热装置的辐射热电路板。 辐射热电路板包括金属板，该金属板包括集成的金属突起，多个发热器件被安装在该金属突起上，暴露集成金属突起的绝缘层，绝缘层设置在金属板上，以及多个电极焊盘 设置在绝缘层上，多个电极焊盘将电压施加到每个发热器件中。 因此，可以在发热装置之间设置辐射突起以改善热辐射。
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4.发明授权Radiant heat circuit board, heat generating device package having the same, and backlight unit 有权辐射热电路板，具有相同的发热装置封装和背光单元公开(公告)号：US09549458B2
公开(公告)日：2017-01-17
申请号：US13878319
申请日：2011-10-05
申请人： Hyun Gyu Park , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Yun Ho An , Hyuk Soo Lee , In Hee Cho
发明人： Hyun Gyu Park , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Yun Ho An , Hyuk Soo Lee , In Hee Cho
IPC分类号： H05K1/02 , H01L25/075 , H05K1/05 , H01L23/367 , H01L23/498 , H01L33/64
CPC分类号： H05K1/021 , H01L23/3677 , H01L23/49838 , H01L25/0753 , H01L33/642 , H01L2224/73203 , H05K1/0204 , H05K1/056 , H05K2201/09054 , H05K2201/10106
摘要： Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate including an integrated metal projection to which the plurality of heat generating devices are attached, an insulation layer exposing the integrated metal projection, the insulation layer being disposed on the metal plate, and a plurality of electrode pads disposed on the insulation layer, the plurality of electrode pads applying a voltage into each of the heat generating devices. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.
摘要翻译： 提供一种用于安装多个发热装置的辐射热电路板。 辐射热电路板包括金属板，该金属板包括集成的金属突起，多个发热器件被安装在该金属突起上，暴露集成金属突起的绝缘层，绝缘层设置在金属板上，以及多个电极焊盘 设置在绝缘层上，多个电极焊盘将电压施加到每个发热器件中。 因此，可以在发热装置之间设置辐射突起以改善热辐射。
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5.发明申请RADIANT HEAT CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, HEAT GENERATING DEVICE PACKAGE HAVING THE SAME, AND BACKLIGHT 有权辐射热电路板，其制造方法，具有该发光装置的发热装置包和背光公开(公告)号：US20130188359A1
公开(公告)日：2013-07-25
申请号：US13878637
申请日：2011-10-10
申请人： Hyun Gyu Park , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Yun Ho An , Hyuk Soo Lee , In Hee Cho
发明人： Hyun Gyu Park , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Yun Ho An , Hyuk Soo Lee , In Hee Cho
CPC分类号： H05K7/205 , F21V29/70 , G02F1/133615 , H01L23/3677 , H01L25/0753 , H01L33/647 , H01L2224/16225 , H05K1/0204 , H05K1/056 , H05K1/113 , H05K3/30 , H05K3/4608 , H05K13/00 , H05K2201/09054 , H05K2201/10106 , H05K2201/10969 , Y10T29/4913
摘要： Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached, an insulation member exposing the integrated metal projection, the insulation member comprising a plurality of insulation layers disposed on the metal plate, and first and second electrode pads disposed on the insulation member, the first and second electrode pads disposed being electrically separated from each other. The first and second electrode pads receives a voltage from circuit wires disposed on the insulation layers different from each other of the insulation member. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.
摘要翻译： 提供一种用于安装多个发热装置的辐射热电路板。 辐射热电路板包括金属板，该金属板包括集成的金属突起，多个发热装置附接到该金属突起，暴露一体金属突起的绝缘构件，绝缘构件包括设置在金属板上的多个绝缘层，以及 布置在绝缘构件上的第一和第二电极焊盘，布置的第一和第二电极焊盘彼此电分离。 第一和第二电极焊盘从设置在绝缘层彼此不同的绝缘层上的电路线接收电压。 因此，可以在发热装置之间设置辐射突起以改善热辐射。
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公开(公告)号：US20130118782A1
公开(公告)日：2013-05-16
申请号：US13811365
申请日：2011-07-15
申请人： In Hee Cho , Yun Ho An , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Hyun Gyu Park , Hyuk Soo Lee
发明人： In Hee Cho , Yun Ho An , Eun Jin Kim , Hae Yeon Kim , Jae Man Park , Hyun Gyu Park , Hyuk Soo Lee
CPC分类号： H05K1/181 , H01L23/3677 , H01L2224/48227 , H05K1/0204 , H05K1/03 , H05K1/09 , H05K3/0061 , H05K2201/10106 , H05K2203/0369
摘要： Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced.
摘要翻译： 公开了一种辐射热电路板及其制造方法。 用于在其上安装发热装置的辐射热电路板包括金属板，该金属板包括金属突起，该金属突起具有焊料，发光装置附着到该金属突起上，金属突起上的接合层， 金属板以暴露金属突起，以及绝缘层上的电路图案。 通过在安装垫下方设置包括散热突起的金属板，将从发热装置发出的热量直接传递到金属板，从而提高散热效率。 热辐射突起的表面镀有包含铜的合金，从而提高相对于焊料的粘合性，从而降低了故障率。
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公开(公告)号：US20140231122A1
公开(公告)日：2014-08-21
申请号：US14119122
申请日：2012-05-21
申请人： Jae Man Park , Eun Jin Kim , Hae Yeon Kim , Hyun Gyu Park , Yun Ho An , In Hee Cho
发明人： Jae Man Park , Eun Jin Kim , Hae Yeon Kim , Hyun Gyu Park , Yun Ho An , In Hee Cho
CPC分类号： H05K1/05 , C08G59/621 , C08G59/686 , C08K3/013 , C08K3/36 , C08K2003/2227 , C08K2003/282 , C08K2003/385 , C08L63/00 , C09K5/14 , H05K1/056 , H05K2201/0209 , H05K2201/10106
摘要： An epoxy resin composition having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin composition can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.
摘要翻译： 提供具有环氧树脂，固化剂和无机填料作为主要成分的环氧树脂组合物。 环氧树脂包括化学式的环氧树脂。 因此，环氧树脂组合物的导热性可以提高，因为环氧树脂具有促进结晶性的介晶结构。 此外，通过使用上述环氧树脂作为印刷电路板的绝缘材料，可以提供高辐射热板。
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公开(公告)号：US09451695B2
公开(公告)日：2016-09-20
申请号：US14119122
申请日：2012-05-21
申请人： Jae Man Park , Eun Jin Kim , Hae Yeon Kim , Hyun Gyu Park , Yun Ho An , In Hee Cho
发明人： Jae Man Park , Eun Jin Kim , Hae Yeon Kim , Hyun Gyu Park , Yun Ho An , In Hee Cho
IPC分类号： C08L63/00 , C08K3/10 , C08K3/22 , C08K3/36 , C08K3/38 , H05K1/05 , C08G59/62 , C08G59/68 , C09K5/14 , C08K3/28 , C08K3/00
CPC分类号： H05K1/05 , C08G59/621 , C08G59/686 , C08K3/013 , C08K3/36 , C08K2003/2227 , C08K2003/282 , C08K2003/385 , C08L63/00 , C09K5/14 , H05K1/056 , H05K2201/0209 , H05K2201/10106
摘要： An epoxy resin composition having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin composition can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.
摘要翻译： 提供具有环氧树脂，固化剂和无机填料作为主要成分的环氧树脂组合物。 环氧树脂包括化学式的环氧树脂。 因此，环氧树脂组合物的导热性可以提高，因为环氧树脂具有促进结晶性的介晶结构。 此外，可以通过使用上述环氧树脂作为印刷电路板的绝缘材料来提供高辐射热板。
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公开(公告)号：US20140290986A1
公开(公告)日：2014-10-02
申请号：US14232510
申请日：2012-07-12
申请人： Eun Jin Kim , Hae Yeon Kim , Sung Bae Moon , Jae Man Park , Jeung Ook Park , Hyun Gyu Park , Jong Heum Yoon , In Hee Cho , Jin Hwan Kim , Thanh Kieu Giang
发明人： Eun Jin Kim , Hae Yeon Kim , Sung Bae Moon , Jae Man Park , Jeung Ook Park , Hyun Gyu Park , Jong Heum Yoon , In Hee Cho , Jin Hwan Kim , Thanh Kieu Giang
CPC分类号： H05K1/0373 , C08K3/013 , C08L63/00 , H05K1/0212 , H05K1/0346 , H05K1/056
摘要： An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.
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公开(公告)号：US20140318839A1
公开(公告)日：2014-10-30
申请号：US14235692
申请日：2012-07-27
申请人： Sung Bae Moon , Jae Man Park , Jong Heum Yoon , Hae Yeon Kim , In Hee Cho
发明人： Sung Bae Moon , Jae Man Park , Jong Heum Yoon , Hae Yeon Kim , In Hee Cho
CPC分类号： H05K1/0201 , C08G59/184 , C08K3/22 , C08K2003/2227 , C08L63/00 , H01L23/142 , H01L23/3737 , H01L2924/0002 , H05K1/0373 , H05K1/056 , H05K2201/0209 , H01L2924/00
摘要： Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The curing agent comprises epoxy adducts formed to add the curing agent to a crystalline epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.
摘要翻译： 公开了一种环氧树脂化合物和使用其的辐射热电路板。 环氧树脂化合物主要包括环氧树脂，固化剂和无机填料。 固化剂包括形成以将固化剂添加到结晶环氧树脂中的环氧加合物。 在印刷电路板上使用环氧树脂作为绝缘材料，从而提供具有高散热性的基板。
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