公开(公告)号：US20110149471A1

公开(公告)日：2011-06-23

申请号：US12976500

申请日：2010-12-22

Applicant: Kang Heon HUR ,  Byung Gyun Kim ,  Sang Hoon Kwon ,  Doo Young Kim ,  Hyun Tae Kim ,  Mi Young Kim ,  Eun Sang Na ,  Jae Joon Lee

Inventor： Kang Heon HUR ,  Byung Gyun Kim ,  Sang Hoon Kwon ,  Doo Young Kim ,  Hyun Tae Kim ,  Mi Young Kim ,  Eun Sang Na ,  Jae Joon Lee

IPC: H01G4/12 ,  H01G7/00

CPC classification number: H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/30 ,  H01G13/00 ,  Y10T29/43

Abstract: There is provided a multilayer ceramic capacitor including: a capacitor main body formed by alternately stacking an internal electrode including an internal electrode-forming material and a dielectric layer; and an external electrode formed on the external surface of the capacitor to be electrically connected to the internal electrode and having an external electrode-forming material, wherein the internal electrode includes a non-diffusion layer including the external electrode-forming material of 2 vol % to 20 vol % and a diffusion layer made of the external electrode-forming material on at least one of the both ends of the non-diffusion layer.The multilayer ceramic capacitor capable of preventing cracking due to the diffusion of electrode materials while stably securing capacitance and the method of fabricating the same can be provided.

Abstract translation: 提供了一种多层陶瓷电容器，包括：电容器主体，其通过交替堆叠包括内部电极形成材料和电介质层的内部电极而形成; 以及形成在所述电容器的外表面上以与内部电极电连接并具有外部电极形成材料的外部电极，其中所述内部电极包括包含2体积％的所述外部电极形成材料的非扩散层， 至20体积％以及由非扩散层的两端中的至少一方形成的外部电极形成材料的扩散层。 可以提供能够防止电极材料的扩散同时稳定地保持电容的开裂的多层陶瓷电容器及其制造方法。

公开(公告)号：US20100139964A1

公开(公告)日：2010-06-10

申请号：US12382360

申请日：2009-03-13

Applicant: Jin Yong An ,  Jae Joon Lee

Inventor： Jin Yong An ,  Jae Joon Lee

IPC: H05K1/11 ,  B44C1/22

CPC classification number: H05K3/4007 ,  H01L21/4857 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2221/68345 ,  H01L2924/0002 ,  H05K3/108 ,  H05K3/205 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2203/0228 ,  H05K2203/0376 ,  H05K2203/054 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2924/00

Abstract: Disclosed herein is a printed circuit board, including: an upper circuit layer including connection pads made of a conductive metal and buried in an insulation layer; and metal bumps, each having a constant diameter, which are integrated with the connection pads and protrude over the insulation layer.

Abstract translation: 这里公开了一种印刷电路板，包括：上电路层，包括由导电金属制成的并埋在绝缘层中的连接焊盘; 和金属凸块，每个具有恒定的直径，其与连接焊盘成一体并突出在绝缘层上。

公开(公告)号：US08563141B2

公开(公告)日：2013-10-22

申请号：US12716193

申请日：2010-03-02

Applicant: Jae Joon Lee ,  Jin Yong Ahn ,  Suk Hyeon Cho ,  Ki Hwan Kim ,  Seok Kyu Lee

Inventor： Jae Joon Lee ,  Jin Yong Ahn ,  Suk Hyeon Cho ,  Ki Hwan Kim ,  Seok Kyu Lee

IPC: B21C1/00

CPC classification number: H05K3/007 ,  B32B3/10 ,  B32B3/14 ,  B32B3/18 ,  B32B7/04 ,  B32B15/00 ,  B32B15/043 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B2457/08 ,  H05K3/0097 ,  H05K3/205 ,  H05K2201/0355 ,  Y10T156/10 ,  Y10T156/1052 ,  Y10T428/12 ,  Y10T428/12229 ,  Y10T428/12264 ,  Y10T428/12271 ,  Y10T428/161 ,  Y10T428/19 ,  Y10T428/192 ,  Y10T428/239 ,  Y10T428/24917

Abstract: Disclosed is a carrier for manufacturing a printed circuit board, which includes a first carrier including a first binder having a first opening and a first metal layer formed in the first opening of the first binder, and a second carrier, stacked with the first carrier and including a second binder having a second opening and a second metal layer which is formed in the second opening of the second binder and which partially overlaps with the first metal layer, so that the carrier is simply configured and the binders are formed not only on the lateral surfaces of the metal layers but also on the upper surfaces thereof, thus improving the reliability of bonding of the carrier at the periphery. A method of manufacturing the carrier and a method of manufacturing a printed circuit board using the carrier are also provided.

Abstract translation: 公开了一种用于制造印刷电路板的载体，其包括第一载体，其包括具有第一开口的第一粘合剂和形成在第一粘合剂的第一开口中的第一金属层，以及与第一载体堆叠的第二载体， 包括具有第二开口的第二粘合剂和形成在第二粘合剂的第二开口中并且与第一金属层部分重叠的第二金属层，使得载体被简单地构造，并且粘结剂不仅形成在 金属层的侧面，也在其上表面，从而提高载体在周边的接合的可靠性。 还提供了制造载体的方法和使用该载体制造印刷电路板的方法。

公开(公告)号：US08541096B2

公开(公告)日：2013-09-24

申请号：US12654446

申请日：2009-12-18

Applicant: Mi Sun Hwang ,  Jae Joon Lee ,  Myung Sam Kang

Inventor： Mi Sun Hwang ,  Jae Joon Lee ,  Myung Sam Kang

IPC: H05K1/03 ,  H05K7/02

CPC classification number: H05K3/10 ,  H05K1/0271 ,  H05K1/09 ,  H05K3/4602 ,  H05K2201/0338 ,  H05K2201/0352 ,  H05K2201/068 ,  H05K2201/09136

Abstract: There is provided a printed circuit board. The printed circuit board may be configured to include: a core layer in which a bending prevention portion of at least two layers is interposed between a plurality of insulating members and includes metal layers having different thermal expansion coefficients is disposed; a circuit pattern that is formed so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and an insulating layer that is formed on the core layer and includes an opening portion that exposes the circuit pattern, and a method of manufacturing the printed circuit board. According to the above-described printed circuit board and the method of manufacturing the printed circuit board, by disposing a bending prevention portion inside the printed circuit board, a printed circuit board capable of improving the progress rate and the productivity and a method of manufacturing the printed circuit board can be provided.

Abstract translation: 提供了印刷电路板。 印刷电路板可以被构造为包括：芯层，其中至少两层的弯曲防止部分插入在多个绝缘构件之间并且包括具有不同热膨胀系数的金属层; 形成为在芯层的内部和芯层的外表面中的至少一个上具有期望图案的电路图案; 以及形成在芯层上并包括露出电路图案的开口部分的绝缘层，以及制造印刷电路板的方法。 根据上述印刷电路板和印刷电路板的制造方法，通过在印刷电路板内设置弯曲防止部，能够提高进度和生产率的印刷电路板，以及制造印刷电路板的方法 可以提供印刷电路板。

公开(公告)号：US08422248B2

公开(公告)日：2013-04-16

申请号：US13137504

申请日：2011-08-22

Applicant: Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

Inventor： Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

IPC: H05K9/00

CPC classification number: H05K1/0236 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/116 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09663 ,  H01L2224/0401

Abstract: An electromagnetic bandgap structure, including: a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, having one end part which is connected to the first metal layer; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer, whereas the other end part of the via is connected to a via land which is placed in a hole formed in the metal plate, and the via land is connected to the metal plate through a metal line.

Abstract translation: 一种电磁带隙结构，包括：第一金属层; 第一介电层，堆叠在第一金属层中; 金属板，堆叠在第一介电层中; 通孔，其具有连接到所述第一金属层的一个端部; 第二电介质层，堆叠在所述金属板和所述第一介电层中; 以及第二金属层，层叠在第二电介质层中，而通孔的另一端部连接到放置在形成在金属板中的孔中的通孔焊盘，并且通路焊盘通过 金属线。

公开(公告)号：US20120195501A1

公开(公告)日：2012-08-02

申请号：US13359979

申请日：2012-01-27

Applicant: Byung Tae OH ,  Du Sik Park ,  Jae Joon Lee

Inventor： Byung Tae OH ,  Du Sik Park ,  Jae Joon Lee

IPC: G06K9/34 ,  G06K9/46

CPC classification number: G06T9/00 ,  H04N19/597

Abstract: An apparatus and method for processing an image are provided. The apparatus may determine a distortion region based on warped pixels in a synthesized image of an intermediate view; and define a surface area of the distortion region as a distortion function of the synthesized image.

Abstract translation: 提供了一种用于处理图像的装置和方法。 该装置可以基于中间视图的合成图像中的翘曲像素来确定失真区域; 并且将失真区域的表面区域定义为合成图像的失真函数。

公开(公告)号：US08207450B2

公开(公告)日：2012-06-26

申请号：US12382360

申请日：2009-03-13

Applicant: Jin Yong An ,  Jae Joon Lee

Inventor： Jin Yong An ,  Jae Joon Lee

IPC: H05K1/11

CPC classification number: H05K3/4007 ,  H01L21/4857 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2221/68345 ,  H01L2924/0002 ,  H05K3/108 ,  H05K3/205 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2203/0228 ,  H05K2203/0376 ,  H05K2203/054 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2924/00

Abstract: Disclosed herein is a printed circuit board, including: an upper circuit layer including connection pads made of a conductive metal and buried in an insulation layer; and metal bumps, each having a constant diameter, which are integrated with the connection pads and protrude over the insulation layer.

Abstract translation: 这里公开了一种印刷电路板，包括：上电路层，包括由导电金属制成的并埋在绝缘层中的连接焊盘; 和金属凸块，每个具有恒定的直径，其与连接焊盘成一体并突出在绝缘层上。

公开(公告)号：US20120087594A1

公开(公告)日：2012-04-12

申请号：US13377437

申请日：2010-06-08

Applicant: Jin Young Lee ,  Jae Joon Lee ,  Ho Cheon Wey

Inventor： Jin Young Lee ,  Jae Joon Lee ,  Ho Cheon Wey

IPC: G06K9/36

CPC classification number: H04N19/85 ,  H04N19/463 ,  H04N19/59 ,  H04N19/593 ,  H04N19/597 ,  H04N19/61

Abstract: Disclosed are an image-encoding apparatus and an image-decoding apparatus for efficiently transmitting a large capacity image. The image encoding apparatus separates an input image into pixel units to generate real images of a first region and of a second region, performs a predictive filtering process on the real image of the first region to generate a predictive image of the second region, and differentiates the predictive image of the second region from the real image of the second region to thereby efficiently reduce the volume of data prior to encoding the input image.

Abstract translation: 公开了一种用于高效传输大容量图像的图像编码装置和图像解码装置。 图像编码装置将输入图像分离为像素单位以生成第一区域和第二区域的实际图像，对第一区域的实际图像执行预测滤波处理，以生成第二区域的预测图像，并且区分 从第二区域的实际图像获得第二区域的预测图像，从而在编码输入图像之前有效地减少数据量。

公开(公告)号：US20110303452A1

公开(公告)日：2011-12-15

申请号：US13137504

申请日：2011-08-22

Applicant: Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

Inventor： Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

IPC: H05K1/11

CPC classification number: H05K1/0236 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/116 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09663 ,  H01L2224/0401

Abstract: An electromagnetic bandgap structure, including: a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, having one end part which is connected to the first metal layer; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer, whereas the other end part of the via is connected to a via land which is placed in a hole formed in the metal plate, and the via land is connected to the metal plate through a metal line.

Abstract translation: 一种电磁带隙结构，包括：第一金属层; 第一介电层，堆叠在第一金属层中; 金属板，堆叠在第一介电层中; 通孔，其具有连接到所述第一金属层的一个端部; 第二电介质层，堆叠在所述金属板和所述第一介电层中; 以及第二金属层，层叠在第二电介质层中，而通孔的另一端部连接到放置在形成在金属板中的孔中的通孔焊盘，并且通路焊盘通过 金属线。

公开(公告)号：US08035991B2

公开(公告)日：2011-10-11

申请号：US12010872

申请日：2008-01-30

Applicant: Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

Inventor： Han Kim ,  Jae-Joon Lee ,  Mi-Ja Han ,  Dae-Hyun Park

IPC: H05K9/00

CPC classification number: H05K1/0236 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/116 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09663 ,  H01L2224/0401

Abstract: Disclosed are an electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit. The electromagnetic bandgap structure in which a first metal layer, a first dielectric layer, a second dielectric layer and a second metal layer are stacked can include a first metal plate, formed between the first dielectric layer and the second dielectric layer; a second metal plate, formed on a same planar surface as the first metal plate, accommodated into a hole which is formed in the first metal plate and electrically connected to the first metal plate through a metal line; and a via, connecting the second metal plate to any one of the first metal layer and the second metal layer. With the present invention, the electromagnetic bandgap structure can be not only miniaturized but also have a low bandgap frequency.

Abstract translation: 公开了一种能够解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。 层叠有第一金属层，第一电介质层，第二电介质层和第二金属层的电磁带隙结构可以包括形成在第一电介质层和第二电介质层之间的第一金属板; 形成在与第一金属板相同的平面上的第二金属板，容纳在形成在第一金属板中并通过金属线电连接到第一金属板的孔中; 以及将第二金属板连接到第一金属层和第二金属层中的任一个的通孔。 利用本发明，电磁带隙结构不仅可以小型化，而且具有低带隙频率。