公开(公告)号：US08472196B2

公开(公告)日：2013-06-25

申请号：US13049322

申请日：2011-03-16

Applicant: Jian-Hong Zeng ,  Shou-Yu Hong ,  Qi-Feng Ye ,  Yi-Cheng Lin

Inventor： Jian-Hong Zeng ,  Shou-Yu Hong ,  Qi-Feng Ye ,  Yi-Cheng Lin

IPC: H05K7/20 ,  H05K13/04 ,  H05K3/34

CPC classification number: H01L23/4334 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/115 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48135 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H02M7/003 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A power module includes a first heat sink, first and second power chips, a thermo-conductive insulating layer, a lead frame and a molding compound. The first heat sink has a first area and a second area. The first power chip is disposed in the first area. The thermo-conductive insulating layer is disposed in the second area. The second power chip is disposed on the heat sink through the thermo-conductive insulating layer. The lead frame is electrically connected to at least one of the first and second power chips. The molding compound covers the first and second power chips, the thermo-conductive insulating layer and a portion of the lead frame. The first heat sink is electrically connected to at least one of the first and second power chips. Because the first power chip is not disposed on the first heat sink through the thermo-conductive insulating layer, the cost can be reduced.

Abstract translation: 功率模块包括第一散热器，第一和第二功率芯片，热导绝缘层，引线框架和模塑料。 第一散热器具有第一区域和第二区域。 第一功率芯片设置在第一区域中。 热导绝缘层设置在第二区域中。 第二功率芯片通过热导绝缘层设置在散热片上。 引线框架电连接到第一和第二功率芯片中的至少一个。 模制化合物覆盖第一和第二功率芯片，热导绝缘层和引线框架的一部分。 第一散热器电连接到第一和第二功率芯片中的至少一个。 由于第一功率芯片不通过导热绝缘层设置在第一散热器上，所以可以降低成本。

公开(公告)号：US08283789B2

公开(公告)日：2012-10-09

申请号：US12348105

申请日：2009-01-02

Applicant: Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

Inventor： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

IPC: H01L23/02

CPC classification number: H01F27/29 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/2804 ,  H01F2017/048 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H02M3/00 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3442 ,  H05K7/026 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

Abstract: An assembled circuit comprising an inductive component, a connecting conductor, and a first electronic component is disclosed. The connecting conductor is adapted to wrap a first surface of the inductive component. The first electronic component stacks on the inductive component. The assembled circuit is electrically connected to the carrier via the connecting conductor.

Abstract translation: 公开了一种包括电感元件，连接导体和第一电子部件的组装电路。 连接导体适于包裹电感元件的第一表面。 第一个电子元件堆叠在电感元件上。 组装电路通过连接导体与载体电连接。

公开(公告)号：US20100301981A1

公开(公告)日：2010-12-02

申请号：US12787893

申请日：2010-05-26

Applicant: Jian-Hong Zeng ,  Shou-Yu Hong ,  Nan Ye ,  Wei Yang ,  Jian-Ping Ying

Inventor： Jian-Hong Zeng ,  Shou-Yu Hong ,  Nan Ye ,  Wei Yang ,  Jian-Ping Ying

IPC: H01F17/00

CPC classification number: H01F27/2885

Abstract: A coil assembly includes at least one insulated wire and an electromagnetic interference shielding layer. The insulated wire is wound into a winding coil part. The winding coil part includes a first wire-outlet segment, a second wire-outlet segment and a central through-hole. The electromagnetic interference shielding layer is formed on the winding coil part for shielding the insulated wire. The electromagnetic interference shielding layer has lateral projection profile on the winding coil part. The electromagnetic interference shielding layer has a radial gap such that the electromagnetic interference shielding layer is a non-conducting loop.

Abstract translation: 线圈组件包括至少一个绝缘线和电磁干扰屏蔽层。 绝缘线缠绕在绕组线圈部分。 绕组线圈部分包括第一线出口段，第二线出口段和中心通孔。 电磁干扰屏蔽层形成在用于屏蔽绝缘线的绕组线圈部分上。 电磁干扰屏蔽层在绕组线圈部分具有侧向突出轮廓。 电磁干扰屏蔽层具有径向间隙，使得电磁干扰屏蔽层是非导通环路。

公开(公告)号：US07729140B2

公开(公告)日：2010-06-01

申请号：US12044392

申请日：2008-03-07

Applicant: Jian-Ping Ying ,  Ai-Bin Qiu ,  Jian-Hong Zeng ,  Zi-Ying Zhou

Inventor： Jian-Ping Ying ,  Ai-Bin Qiu ,  Jian-Hong Zeng ,  Zi-Ying Zhou

IPC: H02M1/12 ,  H02M1/14

CPC classification number: H02M3/157 ,  H02M2001/0009 ,  H02M2001/0012

Abstract: A sampling method with adjusting duty ratios is provided and includes the following steps. A first working pulse signal which has a pulse-width duty ratio D in a switching period Ts is provided. A first adjusting period comprising first N successive switching periods of the first working pulse signal is set, wherein N is a natural number larger than 1. A second working pulse signal which has second N successive switching periods with their corresponding pulse-width duty ratio D1, D2, . . . , DN to drive the switch in the converter circuit is provided and the measured signal is generated, wherein the sum of D1, D2, . . . , DN substantially equals to N·D and the second N successive switching periods constitute a second adjusting period.

Abstract translation: 提供了具有调节占空比的采样方法，包括以下步骤。 提供在开关周期Ts中具有脉冲宽度占空比D的第一工作脉冲信号。 设置包括第一工作脉冲信号的第一N个连续切换周期的第一调整周期，其中N是大于1的自然数。具有第二N个连续切换周期的第二工作脉冲信号，其相应的脉冲宽度占空比D1 ，D2，。 。 。 ，提供在转换器电路中驱动开关的DN，并产生测量信号，其中D1，D2，...的总和。 。 。 ，DN基本上等于N·D，并且第二N个连续切换周期构成第二调整周期。

公开(公告)号：US20090175014A1

公开(公告)日：2009-07-09

申请号：US12348105

申请日：2009-01-02

Applicant: JIAN-HONG Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

Inventor： JIAN-HONG Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

IPC: H05K7/00

CPC classification number: H01F27/29 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/2804 ,  H01F2017/048 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H02M3/00 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3442 ,  H05K7/026 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

Abstract: An assembled circuit comprising an inductive component, a connecting conductor, and a first electronic component is disclosed. The connecting conductor is adapted to wrap a first surface of the inductive component. The first electronic component stacks on the inductive component. The assembled circuit is electrically connected to the carrier via the connecting conductor.

Abstract translation: 公开了一种包括电感元件，连接导体和第一电子部件的组装电路。 连接导体适于包裹电感元件的第一表面。 第一个电子元件堆叠在电感元件上。 组装电路通过连接导体与载体电连接。

公开(公告)号：US07099161B2

公开(公告)日：2006-08-29

申请号：US10858243

申请日：2004-06-01

Applicant: Chao Yan ,  Hao-Yi Ye ,  Hong-Yang Wu ,  Jian-Hong Zeng ,  Jian-Ping Ying

Inventor： Chao Yan ,  Hao-Yi Ye ,  Hong-Yang Wu ,  Jian-Hong Zeng ,  Jian-Ping Ying

IPC: H02H3/335

CPC classification number: H02M3/33592 ,  Y02B70/1475

Abstract: A control method for a first synchronous rectifier and a second synchronous rectifier in a switching power converter is presented. The switching power converter includes a transformer, and a first switching device and a second switching device connected in series and in parallel with an input voltage source. The first synchronous rectifier is connected with a low end of a secondary winding of the transformer. The second synchronous rectifier is connected with a high end of the secondary winding of said transformer. The first switching device is connected with a high end of the input voltage source, and the second switching device is connected with a low end of the input voltage source. The control includes the steps of driving the first switching device to an on state and the second switching device to an off state; and driving the second synchronous rectifier to an off state after the second switching device has been driven to an on state, such that a power is delivered from the primary winding to the secondary winding.

Abstract translation: 提出了一种开关电源转换器中的第一同步整流器和第二同步整流器的控制方法。 开关电源转换器包括变压器以及与输入电压源串联并联连接的第一开关器件和第二开关器件。 第一同步整流器与变压器次级绕组的低端连接。 第二同步整流器与所述变压器的次级绕组的高端连接。 第一开关装置与输入电压源的高端连接，第二开关装置与输入电压源的低端连接。 该控制包括以下步骤：将第一开关装置驱动为导通状态，将第二开关装置切换到断开状态; 并且在所述第二开关装置被驱动到接通状态之后将所述第二同步整流器驱动到截止状态，使得从所述初级绕组向次级绕组输送功率。

公开(公告)号：US20050265056A1

公开(公告)日：2005-12-01

申请号：US10858243

申请日：2004-06-01

Applicant: Chao Yan ,  Hao-Yi Ye ,  Hong-Yang Wu ,  Jian-Hong Zeng ,  Jian-Ping Ying

Inventor： Chao Yan ,  Hao-Yi Ye ,  Hong-Yang Wu ,  Jian-Hong Zeng ,  Jian-Ping Ying

IPC: H02M3/335

CPC classification number: H02M3/33592 ,  Y02B70/1475

Abstract: A control method for a first synchronous rectifier and a second synchronous rectifier in a switching power converter is presented. The switching power converter includes a transformer, and a first switching device and a second switching device connected in series and in parallel with an input voltage source. The first synchronous rectifier is connected with a low end of a secondary winding of the transformer. The second synchronous rectifier is connected with a high end of the secondary winding of said transformer. The first switching device is connected with a high end of the input voltage source, and the second switching device is connected with a low end of the input voltage source. The control includes the steps of driving the first switching device to an on state and the second switching device to an off state; and driving the second synchronous rectifier to an off state after the second switching device has been driven to an on state, such that a power is delivered from the primary winding to the secondary winding.

Abstract translation: 提出了一种开关电源转换器中的第一同步整流器和第二同步整流器的控制方法。 开关电源转换器包括变压器以及与输入电压源串联并联连接的第一开关器件和第二开关器件。 第一同步整流器与变压器次级绕组的低端连接。 第二同步整流器与所述变压器的次级绕组的高端连接。 第一开关装置与输入电压源的高端连接，第二开关装置与输入电压源的低端连接。 该控制包括以下步骤：将第一开关装置驱动为导通状态，将第二开关装置切换到断开状态; 并且在所述第二开关装置被驱动到接通状态之后将所述第二同步整流器驱动到截止状态，使得从所述初级绕组向次级绕组输送功率。

公开(公告)号：US20140085848A1

公开(公告)日：2014-03-27

申请号：US14094811

申请日：2013-12-03

Applicant: Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

Inventor： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

IPC: H05K7/02 ,  H01F17/00

CPC classification number: H01F27/29 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/2804 ,  H01F2017/048 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H02M3/00 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3442 ,  H05K7/026 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

Abstract: An assembled circuit is disclosed, wherein the assembled circuit comprises an inductor having a top surface, a bottom surface and side surfaces, wherein each of a plurality of conductors extends from the top surface to the bottom surface via one of the side surfaces of the inductor, wherein a circuit board is disposed over the top surface of the first electronic component and electrically connected to the plurality of conductors and a plurality of pins disposed on the bottom surface of the inductor for connecting to another circuit board.

Abstract translation: 公开了组装电路，其中组装电路包括具有顶表面，底表面和侧表面的电感器，其中多个导体中的每一个通过电感器的一个侧表面从顶表面延伸到底表面 其中电路板设置在所述第一电子部件的顶表面上并电连接到所述多个导体，以及设置在所述电感器的底表面上的多个引脚用于连接到另一个电路板。

公开(公告)号：US08624701B2

公开(公告)日：2014-01-07

申请号：US13602326

申请日：2012-09-04

Applicant: Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

Inventor： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

IPC: H01F5/00

CPC classification number: H01F27/29 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/2804 ,  H01F2017/048 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H02M3/00 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3442 ,  H05K7/026 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

Abstract: An assembled circuit comprising a substrate, a coil, a first conductive segment, a second conductive segment, a first through-hole connector and a second through-hole connector is disclosed. The first conductive segment is electrically connected to one end of the first through-hole connector, the other end of the first through-hole connector is electrically connected to one end of the second through-hole connector via the first conductive segment, and the other end of the second through-hole connector is electrically connected to the second conductive segment.

Abstract translation: 公开了一种包括基板，线圈，第一导电段，第二导电段，第一通孔连接器和第二通孔连接器的组装电路。 第一导电段电连接到第一通孔连接器的一端，第一通孔连接器的另一端通过第一导电段电连接到第二通孔连接器的一端，另一端 第二通孔连接器的端部电连接到第二导电段。

公开(公告)号：US08426963B2

公开(公告)日：2013-04-23

申请号：US13084292

申请日：2011-04-11

Applicant: Jian-Hong Zeng ,  Shou-Yu Hong

Inventor： Jian-Hong Zeng ,  Shou-Yu Hong

IPC: H01L23/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/00 ,  H01L21/44

CPC classification number: H01L23/49524 ,  H01L23/3107 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/73 ,  H01L25/071 ,  H01L25/074 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32155 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/1203 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A power semiconductor package structure includes a carrier, a first power chip, a second power chip, a first conductive sheet, a second conductive sheet and a third conductive sheet. The first power chip has a first surface and a second surface opposing to the first surface. A first control electrode and a first main power electrode are disposed on the first surface, and a second main power electrode is disposed on the second surface. The second surface is disposed on the carrier, and electrically connected to the carrier through the second main power electrode. The second power chip has a third surface and a fourth surface opposing to the third surface. A third main power electrode is disposed on the third surface, and a fourth main power electrode is disposed on the fourth surface. The fourth surface is disposed on the first power chip. The first conductive sheet is electrically connected to the first main power electrode and the fourth main power electrode. The second conductive sheet is electrically connected to the third main power electrode. The third conductive sheet is electrically connected to the first control electrode. At least a part of the first control electrode is non-covered by the second power chip along a projection direction, which is perpendicular to the carrier.

Abstract translation: 功率半导体封装结构包括载体，第一功率芯片，第二功率芯片，第一导电薄片，第二导电薄片和第三导电薄片。 第一功率芯片具有与第一表面相对的第一表面和第二表面。 第一控制电极和第一主电极设置在第一表面上，第二主电极设置在第二表面上。 第二表面设置在载体上，并通过第二主电极与载体电连接。 第二功率芯片具有与第三表面相对的第三表面和第四表面。 第三主电源电极设置在第三表面上，第四主电源设置在第四表面上。 第四表面设置在第一功率芯片上。 第一导电片电连接到第一主电源电极和第四主电源电极。 第二导电片与第三主电极电连接。 第三导电片与第一控制电极电连接。 第一控制电极的至少一部分沿着垂直于载体的投影方向被第二功率芯片未被覆盖。