公开(公告)号：US4894279A

公开(公告)日：1990-01-16

申请号：US861393

申请日：1986-05-09

Applicant: Krishna G. Sachdev ,  Keith S. Pennington ,  Mitchell S. Cohen

Inventor： Krishna G. Sachdev ,  Keith S. Pennington ,  Mitchell S. Cohen

IPC: B41M5/24 ,  H05K3/00 ,  H05K3/08

CPC classification number: B41M5/245 ,  H05K3/0002 ,  H05K3/08 ,  Y10T428/24975 ,  Y10T428/24983 ,  Y10T428/265 ,  Y10T428/31507 ,  Y10T428/31522 ,  Y10T428/31565 ,  Y10T428/31587 ,  Y10T428/31591 ,  Y10T428/31605 ,  Y10T428/31703 ,  Y10T428/3179 ,  Y10T428/31986

Abstract: The present invention provides an improved electroerosin recording medium which comprises, in a preferred embodiment, a non-conductive support, a hard, abrasion resistant layer, preferably comprising an organic polymer matrix containing an inorganic particulate material, a thin conductive film, typically of a metal such as aluminum, and an abrasion resistant overlayer that most preferably comprises a solid conductive lubricant dispersed in an organotitanium regaent modified polymer system. The overlayer is highly adherent to the conductive surface, has a low organic binder content and provides effective protection against abrasion of the conductive layer and fouling of a print head during electroerosion printing.

Abstract translation: 本发明提供了一种改进的电解质记录介质，其在优选的实施方案中包括非导电载体，硬的耐磨层，优选包含含有无机颗粒材料的有机聚合物基质，通常为 金属如铝，和耐磨覆层，其最优选包含分散在有机钛改性聚合物体系中的固体导电润滑剂。 覆盖层高度贴附于导电表面，具有低的有机粘合剂含量，并提供有效的保护，防止导电层的磨损和打印头在电腐蚀印刷期间的结垢。

公开(公告)号：US4830909A

公开(公告)日：1989-05-16

申请号：US16981

申请日：1987-02-18

Applicant: Mitchell S. Cohen ,  Krishna G. Sachdev ,  John C. S. Shen ,  Keith S. Pennington

Inventor： Mitchell S. Cohen ,  Krishna G. Sachdev ,  John C. S. Shen ,  Keith S. Pennington

IPC: B41M5/24

CPC classification number: B41M5/245 ,  Y10T428/259 ,  Y10T428/31551 ,  Y10T428/31565

Abstract: Electroerosion recording materials of superior scratch resistance are provided by incorporating a hard, crosslinked polymer film or layer between the support and the removable, thin conductive layer to reduce plastic deformation of the support under stylus writing pressure. The intermediate polymer layer may be unfilled or filled with solid particles, such as silica particles. The materials may be used in various printing processes including making directly readable images, direct negatives, and offset masters.

Abstract translation: 通过在支撑体和可移除的薄导电层之间并入硬质交联的聚合物膜或层，提供具有优异耐划伤性的电蚀记录材料，以减少支架在笔写压力下的塑性变形。 中间聚合物层可以是未填充的或填充有固体颗粒，例如二氧化硅颗粒。 这些材料可用于各种印刷工艺中，包括制作直接可读的图像，直接底片和偏移胶片。

公开(公告)号：US4665006A

公开(公告)日：1987-05-12

申请号：US806597

申请日：1985-12-09

Applicant: Krishna G. Sachdev ,  Ranee W. Kwong ,  Mahmoud M. Khojasteh ,  Harbans S. Sachdev

Inventor： Krishna G. Sachdev ,  Ranee W. Kwong ,  Mahmoud M. Khojasteh ,  Harbans S. Sachdev

IPC: G03F7/20 ,  G03F7/039 ,  G03F7/075 ,  H01L21/027 ,  G03C5/16 ,  G03C1/495 ,  G03F7/26

CPC classification number: G03F7/0757 ,  Y10S430/115 ,  Y10S430/12 ,  Y10S430/122 ,  Y10S430/123 ,  Y10S430/126

Abstract: A photoresist composition comprised of a radiation scissionable polymeric system having organopolysiloxane segments sensitized by an onium salt is disclosed. Useful organopolysiloxane containing polymers include polysiloxane-polycarbonate block copolymers, and polyorganosiloxane polyaryl esters. The resist films produced from the photoresist compositions exhibit high sensitivity, high thermal stability and resistance to oxygen reactive ion etching which makes them desirable for dry etching processes to enable submicron resolution.

Abstract translation: 公开了一种光致抗蚀剂组合物，其包含具有由鎓盐敏化的有机聚硅氧烷部分的可辐射可分裂聚合物体系。 有用的含有机聚硅氧烷的聚合物包括聚硅氧烷 - 聚碳酸酯嵌段共聚物和聚有机硅氧烷聚芳酯。 由光致抗蚀剂组合物制成的抗蚀剂膜显示出高灵敏度，高热稳定性和耐氧反应离子蚀刻性能，这使得它们对于干蚀刻工艺是可取的，以实现亚微米分辨率。

公开(公告)号：US4617579A

公开(公告)日：1986-10-14

申请号：US597148

申请日：1984-04-05

Applicant: Krishna G. Sachdev ,  Ali Afzali-Ardakani ,  Keith S. Pennington ,  Mitchell S. Cohen

Inventor： Krishna G. Sachdev ,  Ali Afzali-Ardakani ,  Keith S. Pennington ,  Mitchell S. Cohen

IPC: G06K15/14 ,  B41M5/24 ,  B41N3/03 ,  G01D15/06

CPC classification number: B41M5/245 ,  B41N3/03

Abstract: Electroerosion recording materials for "direct negative" and "offset master" are provided with a surface protective coating of solid conductive lubricant dispersed in a hydrophilic, crosslinked polymeric matrix. The protective films are especially useful where direct offset masters are produced without removal of non-eroded lubricant film.The recording medium of this invention provides use as a defect-free "direct negative" and/or "direct offset master", without requiring the removal of the overlayer prior to use on the printing press. The protective coatings are applied from aqueous dispersions of polymer-particulate compositions and thus avoiding the use of organic solvents.

Abstract translation: “直接负极”和“偏移母版”的电极记录材料设置有分散在亲水交联聚合物基体中的固体导电润滑剂的表面保护涂层。 保护膜特别适用于直接胶印主机而不去除未被侵蚀的润滑剂膜。 本发明的记录介质提供用作无缺陷的“直接负极”和/或“直接偏移主控”，而不需要在印刷机上使用之前去除覆盖层。 保护涂层由聚合物 - 颗粒组合物的水性分散体施加，从而避免使用有机溶剂。

公开(公告)号：US07312261B2

公开(公告)日：2007-12-25

申请号：US10709518

申请日：2004-05-11

Applicant: Krishna G. Sachdev ,  Daniel George Berger ,  Kelly May Chioujones ,  Glenn Graham Daves ,  Hilton T. Toy

Inventor： Krishna G. Sachdev ,  Daniel George Berger ,  Kelly May Chioujones ,  Glenn Graham Daves ,  Hilton T. Toy

IPC: C08L63/00 ,  C08K3/08 ,  C08K7/00 ,  B32B27/38

CPC classification number: H01L24/32 ,  C08K3/08 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/3011 ,  H05K3/321 ,  Y10T428/31515 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014

Abstract: A reworkable conductive adhesive composition, and method of making such, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix. In an additional embodiment an improved method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components.

Abstract translation: 可再加工的导电粘合剂组合物及其制造方法包括含有分散在无溶剂的杂环氧聚合物基质中的导电金属填料颗粒的环氧基导电粘合剂。 在另外的实施方案中，从用于回收或回收模块组件的可用部件，特别是高成本半导体器件，散热器和其它模块部件的电子部件中去除固化的导电聚合物粘合剂（这里公开为热界面材料）的改进方法。

公开(公告)号：US06742530B2

公开(公告)日：2004-06-01

申请号：US10294236

申请日：2002-11-14

Applicant: Krishna G. Sachdev ,  James N. Humenik ,  Chon Cheong Lei ,  Glenn A. Pomerantz

Inventor： Krishna G. Sachdev ,  James N. Humenik ,  Chon Cheong Lei ,  Glenn A. Pomerantz

IPC: B08B308

CPC classification number: H01L21/02063 ,  B23K35/025 ,  C11D7/263 ,  C11D11/0047 ,  C11D11/007 ,  C23G5/032 ,  H05K3/1233 ,  H05K3/26 ,  Y10S134/902

Abstract: A process of cleaning of objects that relate to semiconductor fabrication processes, such as, for example, conductive paste screening in the production of multilayer ceramic substrates and composite solder paste by stencil printing in electronic circuit assembly. Specifically, the process removes a metal/polymer composite paste from screening masks and associated paste making and processing equipment used in printing conductive metal pattern onto ceramic green sheet in the fabrication of semiconductor packaging substrates. The process also cleans solder paste residue from stencil printing equipment used in electronic module assembly surface mount technology for SMT discretes, solder column attachment, and BGA (Ball Grid Array) attachment on ceramic chip carrier or for screening solder paste onto printed circuit board. More particularly, paste residue is cleaned from metal, ceramic, and plastic substrates by a non-alkaline semi-aqueous cleaning method employing high boiling propylene glycol alkyl ether or mixtures of propylene glycol alkyl ether and propylene glycol solvents.

Abstract translation: 清洁与半导体制造工艺有关的物体的过程，例如通过在电子电路组件中的模版印刷生产多层陶瓷衬底中的导电糊料和复合焊膏。 具体地说，该方法在半导体封装衬底的制造中，将金属/聚合物复合糊剂从掩模掩模和用于印刷导电金属图案的相关糊剂制造和加工设备移除到陶瓷生片上。 该工艺还可以将陶瓷芯片载体上用于SMT离散，焊料柱附件和BGA（球栅阵列）附件的电子模块组件表面贴装技术中使用的模版印刷设备的焊膏残留物清理或用于将焊膏屏蔽到印刷电路板上。 更具体地，通过使用高沸点丙二醇烷基醚或丙二醇烷基醚和丙二醇溶剂的混合物的非碱性半水洗涤方法，从金属，陶瓷和塑料基材中清除糊状残余物。

公开(公告)号：US06426007B1

公开(公告)日：2002-07-30

申请号：US09301566

申请日：1999-04-29

Applicant: Krishna G. Sachdev ,  Umar M. Ahmad

Inventor： Krishna G. Sachdev ,  Umar M. Ahmad

IPC: C02F142

CPC classification number: C02F1/42 ,  B01J39/04 ,  B01J41/05 ,  Y10S210/912 ,  B01J41/04

Abstract: This invention provides a method for treating waste water containing organic bases such as tetramethyl ammonium hydroxide and dissolved metals such as Mo, W, Cu and Ni which are generated from mask cleaning and Mo etching processes. The organic base along with Cu and Ni is first removed preferably by passing the effluent through a cation exchange resin followed by passing the cation exchanged effluent through an anion exchange resin to remove the Mo and W metals. The treated waste water meets federal guidelines for dissolved metal contaminant limits for water discharge to water ways. Alternatively, filtered effluent is directly passed through an anion exchange resin to remove Mo and W and the dissolved TMAH and copper and nickel are removed by cation exchange.

Abstract translation: 本发明提供了一种处理废水的方法，所述废水含有有机碱如四甲基氢氧化铵和由掩模清洗和Mo蚀刻工艺产生的诸如Mo，W，Cu和Ni的溶解金属。 首先将有机碱与Cu和Ni一起除去，优选通过使流出物通过阳离子交换树脂，然后使阳离子交换的流出物通过阴离子交换树脂以除去Mo和W金属。 经处理的废水符合联邦关于排水到水路的溶解金属污染物限值的指南。 或者，过滤的流出物直接通过阴离子交换树脂以除去Mo和W，并通过阳离子交换除去溶解的TMAH和铜和镍。

公开(公告)号：US06262390B1

公开(公告)日：2001-07-17

申请号：US09211595

申请日：1998-12-14

Applicant: David B. Goland ,  Mark J. LaPlante ,  David C. Long ,  Dale C. McHerron ,  Krishna G. Sachdev ,  Subhash L. Shinde

Inventor： David B. Goland ,  Mark J. LaPlante ,  David C. Long ,  Dale C. McHerron ,  Krishna G. Sachdev ,  Subhash L. Shinde

IPC: B23K2600

CPC classification number: C04B41/009 ,  B23K26/1224 ,  C04B41/488 ,  C04B2111/00844 ,  C04B41/0036 ,  C04B41/53 ,  C04B35/581

Abstract: A method to repair Aluminum Nitride (AlN) substrates is disclosed wherein a frequency doubled Q-switched Nd:YAG laser is used to remove unwanted metallurgy. The substrate is place in a liquid filled work chamber which acts to prevent metallic species of AlN from forming. The repair site can be sealed with a novel polymer coating to prevent contamination or corrosion. Repairs can be made to buried or surface metallurgy.

Abstract translation: 公开了一种修复氮化铝（AlN）衬底的方法，其中使用频率倍增的Q开关Nd：YAG激光器来去除不想要的冶金。 衬底位于液体填充的工作室中，其用于防止AlN的金属物质的形成。 修复部位可以用新颖的聚合物涂层密封，以防止污染或腐蚀。 维修可以进行埋地或表面冶金。

公开(公告)号：US06261927B1

公开(公告)日：2001-07-17

申请号：US09302943

申请日：1999-04-30

Applicant: Govindarajan Natarajan ,  Richard F. Indyk ,  Vincent P. Peterson ,  Krishna G. Sachdev

Inventor： Govindarajan Natarajan ,  Richard F. Indyk ,  Vincent P. Peterson ,  Krishna G. Sachdev

IPC: H01L2130

CPC classification number: H01L21/481 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  Y10S438/976 ,  H01L2924/00

Abstract: This invention relates generally to a new method of forming semiconductor substrates with defect-free surface metallurgical features. In particular, the invention related to a method for providing surface protected ceramic green sheet laminates using at least one thermally depolymerizable surface layer. More particularly, the invention encompasses a method for fabricating semiconductor substrates wherein a thermally depolymerizable/decomposable surface film is placed over a ceramic green sheet stack or assembly prior to lamination and caused to conform to the surface topography of the green sheet during lamination. The invention also encompasses a method for fabricating surface protected green sheet laminates which can be sized or diced without causing process related defects on the ceramic surface. After lamination the thermally depolymerizable/decomposable film is conveniently and cleanly removed due to thermal depolymerization and burn-off of volatile species during the sintering process, thus providing surface defect-free ceramic substrates.

Abstract translation: 本发明一般涉及一种形成具有无缺陷表面冶金特征的半导体衬底的新方法。 特别地，本发明涉及使用至少一个可热解聚表面层来提供表面保护的陶瓷生片层叠体的方法。 更具体地说，本发明包括一种制造半导体衬底的方法，其中在层压之前将热可解聚/可分解的表面薄膜放置在陶瓷生片层或组件上方并使其在叠层过程中符合生片的表面形貌。 本发明还包括用于制造表面保护的生片层压板的方法，其可以在陶瓷表面上不引起工艺相关缺陷的尺寸或切割。 在层压之后，由于在烧结过程中挥发物质的热解聚和燃烧，因此可方便且清洁地除去热可分解/可分解的膜，从而提供无表面缺陷的陶瓷基材。

公开(公告)号：US06221269B1

公开(公告)日：2001-04-24

申请号：US09233384

申请日：1999-01-19

Applicant: Krishna G. Sachdev ,  Umar M. Ahmad ,  Hsing H. Chen ,  Lawrence D. David ,  Charles H. Perry ,  Donald R. Wall

Inventor： Krishna G. Sachdev ,  Umar M. Ahmad ,  Hsing H. Chen ,  Lawrence D. David ,  Charles H. Perry ,  Donald R. Wall

IPC: C03C1500

CPC classification number: C04B41/009 ,  C04B41/5353 ,  C04B2111/00844 ,  H05K1/092 ,  H05K3/067 ,  H05K3/26 ,  H05K2201/0761 ,  H05K2203/0789

Abstract: A method is provided for etching and removing extraneous molybdenum or debris on ceramic substrates such as semiconductor devices and also for molybdenum etching in the fabrication of molybdenum photomasks. The method employs a multi-step process using an acidic aqueous solution of a ferric salt to remove (etch) the molybdenum debris followed by contacting the treated substrate with an organic quaternary ammonium hydroxide to remove any molybdenum black oxides which may have formed on the exposed surface of treated molybdenum features in ceramic substrates. The method is environmentally safe and the waste solutions may be easily waste treated for example by precipitating the ferric salts as ferric hydroxide and removing anions such as sulfate by precipitation with lime. The method replaces the currently used method of employing ferricyanide salts which create serious hazardous waste disposal and environmental problems.

Abstract translation: 提供了一种用于在陶瓷衬底（例如半导体器件）上蚀刻和去除外来的钼或碎片以及在钼光掩模的制造中用于钼蚀刻的方法。 该方法采用多步法，使用酸式的铁盐水溶液去除（蚀刻）钼碎片，随后将经处理的底物与有机季铵氢氧化物接触以除去可能形成于暴露的钼黑氧化物 处理的钼特征在陶瓷衬底中的表面。 该方法是环境安全的，并且废溶液可以容易地被废物处理，例如通过将铁盐沉淀为氢氧化铁并通过用石灰沉淀除去诸如硫酸盐的阴离子。 该方法取代了目前使用的铁氰化物盐的方法，造成严重的危险废物处理和环境问题。