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    Etching method, a method of forming a trench isolation structure, a semiconductor substrate and a semiconductor apparatus
    13.
    发明申请
    Etching method, a method of forming a trench isolation structure, a semiconductor substrate and a semiconductor apparatus 失效
    蚀刻方法，形成沟槽隔离结构的方法，半导体衬底和半导体器件

    公开(公告)号：US20060033178A1

    公开(公告)日：2006-02-16

    申请号：US11201266

    申请日：2005-08-10

    申请人： Hiroyuki Matsuo ,  Toshiki Nakajima ,  Kunihiro Miyazaki

    发明人： Hiroyuki Matsuo ,  Toshiki Nakajima ,  Kunihiro Miyazaki

    IPC分类号： H01L29/00 ,  H01L21/76

    CPC分类号： H01L21/823481 ,  H01L21/30604 ,  H01L21/31055 ,  H01L21/31111 ,  H01L21/76224 ,  H01L29/66575

    摘要： An etching method of subjecting a base material to an etching process using an etching agent containing hydrogen fluoride and ozone is disclosed. The base material has a first region constituted from silicon as a main material and a second region constituted from SiO2 as a main material. The etching method includes the steps of: preparing the base material; and supplying the etching agent onto the base material to form a step between the first and second regions using a feature that an etching rate of silicon by the etching agent is higher than an etching rate of SiO2 by the etching agent, so that the height of the surface of the first region is lower than the height of the surface of the second region.

    摘要翻译： 公开了一种使用含有氟化氢和臭氧的蚀刻剂对基材进行蚀刻处理的蚀刻方法。 基材具有以硅为主要材料的第一区域和由SiO 2主要材料构成的第二区域。 蚀刻方法包括以下步骤：制备基材; 以及将所述蚀刻剂供应到所述基材上以形成所述第一和第二区域之间的台阶，其特征在于，所述蚀刻剂的硅的蚀刻速率高于所述蚀刻剂的SiO 2的蚀刻速率 蚀刻剂，使得第一区域的表面的高度低于第二区域的表面的高度。

    Electrical connection box
    14.
    发明申请
    Electrical connection box 审中-公开
    电气接线盒

    公开(公告)号：US20050227552A1

    公开(公告)日：2005-10-13

    申请号：US11091374

    申请日：2005-03-29

    申请人： Hisanobu Yamashita ,  Kunihiro Miyazaki ,  Takashi Miyamoto ,  Takumi Ejima

    发明人： Hisanobu Yamashita ,  Kunihiro Miyazaki ,  Takashi Miyamoto ,  Takumi Ejima

    IPC分类号： H01R13/46 ,  H01R4/48 ,  H01R9/24 ,  H01R13/11 ,  H01R13/115 ,  H02G3/16

    CPC分类号： H01R9/2466 ,  H01R13/113

    摘要： A case accommodates two circuit components to be overlapped one above the other and mutually in an approximately parallel form. The terminals of the upper electric power conducting channel are fitted into the terminals of the lower electric power conducting channel one above the other so that they can be connected. The case is provided with a positioning part which regulates deflection of both the terminals above and below toward the vertical direction intersecting with the direction that the terminal is fitted into the terminal, thus making it possible to give positioning to a plurality of the terminals all together and also making it possible to connect the terminals and the terminals respectively to their counterparts without fail. Further, the positioning part is provided on the case for accommodating the circuit components, which eliminates the necessity for a special positioning member.

    摘要翻译： 壳体容纳两个电路组件以彼此重叠并且大致平行的形式相互重叠。 上部电力传导通道的端子一个接一个地安装在下部电力传导通道的端子中，使得它们可以被连接。 该壳体设置有定位部件，该定位部件朝向与端子装配到端子的方向相交的垂直方向上调节两个端子的偏转，从而使得可以将多个端子一起定位在一起 并且也可以将端子和端子分别连接到其对应部件。 此外，定位部设置在用于容纳电路部件的壳体上，这消除了对特殊定位部件的需要。

    Ozonizer
    15.
    发明授权
    Ozonizer 失效
    臭氧发生器

    公开(公告)号：US5794114A

    公开(公告)日：1998-08-11

    申请号：US517879

    申请日：1995-08-23

    申请人： Minoru Harada ,  Ryoichi Shinjo ,  Manabu Tsujimura ,  Rempei Nakata ,  Kunihiro Miyazaki ,  Naruhiko Kaji

    发明人： Minoru Harada ,  Ryoichi Shinjo ,  Manabu Tsujimura ,  Rempei Nakata ,  Kunihiro Miyazaki ,  Naruhiko Kaji

    IPC分类号： C01B13/11 ,  B01J19/08

    CPC分类号： C01B13/11

    摘要： In an improved ozonizer, at least those parts of an ozone gas delivery path located downstream of an ozone generating cell which are to come into contact with ozone gas are either composed of or coated with at least one ozone-resistant, Cr-free material selected from among aluminum (Al), an aluminum alloy, Teflon, fluorinated nickel, a nickel alloy, a silicon oxide based glass and a high-purity aluminium oxide. The ozonizer is capable of producing ozone that is not contaminated with Cr compounds at all or which is insufficiently contaminated to cause any practical problem in the fabrication of highly integrated semiconductor devices.

    摘要翻译： 在改进的臭氧发生器中，至少与臭氧气体接触的位于臭氧发生电池下游的臭氧气体输送路径的那些部分由或者由至少一种耐臭氧，不含Cr的材料选择 从铝（Al），铝合金，特氟隆，氟化镍，镍合金，氧化硅基玻璃和高纯度氧化铝中选择。 臭氧发生器能够产生根本没有被Cr化合物污染的臭氧，或者在高度集成的半导体器件的制造中没有被污染不足造成任何实际问题。

    Abrasive composition and process for polishing
    18.
    发明授权
    Abrasive composition and process for polishing 失效
    研磨组合物和抛光工艺

    公开(公告)号：US4883502A

    公开(公告)日：1989-11-28

    申请号：US255897

    申请日：1988-10-11

    申请人： Kunihiro Miyazaki ,  Ken Ishitobi

    发明人： Kunihiro Miyazaki ,  Ken Ishitobi

    IPC分类号： B24B37/00 ,  C09G1/02 ,  C09K3/14 ,  C23F3/00 ,  H01L21/304

    CPC分类号： C23F3/00 ,  C09G1/02 ,  C09K3/1463

    摘要： An abrasive composition comprising: an aluminous abrasive, preferably having an average particle size of 0.5-10 .mu.m and a concentration of 1 to 25% by weight; nickel sulfamate, preferably having a concentration of 0.5 to 10% by weight; and water, the composition preferably having a pH of 4 to 7. This abrasive composition produces a superior effect when used for polishing an aluminum-based substrate for a magnetic recording disc.

    摘要翻译： 一种磨料组合物，其包含：优选具有0.5-10μm平均粒径和1至25重量％浓度的铝磨料; 氨基磺酸镍，优选浓度为0.5〜10重量％ 和水，该组合物优选具有4至7的pH。当用于抛光用于磁记录盘的铝基基材时，该磨料组合物产生优异的效果。

    System for controlling production of electronic devices, system and method for producing electronic devices, and computer program product
    19.
    发明申请
    System for controlling production of electronic devices, system and method for producing electronic devices, and computer program product 审中-公开
    用于控制电子设备生产的系统，用于生产电子设备的系统和方法以及计算机程序产品

    公开(公告)号：US20070233302A1

    公开(公告)日：2007-10-04

    申请号：US11600791

    申请日：2006-11-17

    申请人： Kunihiro Miyazaki ,  Yoshihiro Ogawa ,  Shoichi Harakawa

    发明人： Kunihiro Miyazaki ,  Yoshihiro Ogawa ,  Shoichi Harakawa

    IPC分类号： G06F19/00

    CPC分类号： G05B19/41865 ,  G05B2219/32097 ,  G05B2219/32275 ,  G05B2219/45031 ,  Y02P90/20 ,  Y02P90/265

    摘要： A system for controlling production of electronic devices includes a recipe creation unit creating a processing recipe describing processing conditions for first and second processes so as to satisfy a production specification of a characteristic and a yield rate of the electronic devices, and an additional recipe describing additional processing conditions determined based on a relation of the characteristic and the yield rate to a latency time between a completion time of the first process and a start time of the second process so as to satisfy the production specification; and a recipe designation module designating the additional recipe for processing of intermediate products of the electronic devices, produced by the first process, when the latency time exceeds a reference.

    摘要翻译： 一种用于控制电子设备生产的系统包括：配方创建单元，其创建描述第一和第二处理的处理条件的处理配方，以满足电子设备的特性和成品率的生产规格，以及描述附加的附加配方 基于特性和产率的关系确定的处理条件与第一处理的完成时间和第二处理的开始时间之间的等待时间以满足生产规范; 以及当延迟时间超过参考时，指定由第一处理产生的电子设备的中间产品的处理的附加配方的配方指定模块。

    Material supply system in semiconductor device manufacturing plant
    20.
    发明申请
    Material supply system in semiconductor device manufacturing plant 失效
    半导体器件制造厂的材料供应系统

    公开(公告)号：US20050177273A1

    公开(公告)日：2005-08-11

    申请号：US10507699

    申请日：2003-03-27

    申请人： Kunihiro Miyazaki ,  Soichi Nadahara ,  Kinya Usuda ,  Masaji Akahori ,  Sota Nakagawa ,  Ken Nakajima

    发明人： Kunihiro Miyazaki ,  Soichi Nadahara ,  Kinya Usuda ,  Masaji Akahori ,  Sota Nakagawa ,  Ken Nakajima

    IPC分类号： H01L21/02 ,  B24B57/02 ,  C11D11/00 ,  C23C16/52 ,  H01L21/00 ,  H01L21/306 ,  G06F19/00

    CPC分类号： H01L21/67276 ,  B24B37/04 ,  B24B57/02 ,  C11D11/0047 ,  C23C16/52 ,  G05B2219/32082 ,  H01L21/02052 ,  Y02P90/20 ,  Y10S210/90

    摘要： In a small scaled plant intended for flexible manufacturing, a pure water supply system is provided at a low cost without reducing a production efficiency. A pure water system produces a plurality of grades of pure water which are supplied through pipes connected to points of use for cleaning, CMP, lithography, and the like. Upon receipt of a request signal from each point of use for starting to use a certain grade of pure water, a controller determines whether or not a required amount exceeds the capacity of the grade of pure water which can be supplied by the pure water system. If not, the controller sends a use permission signal to the point of use for permitting the same to use the pure water. When a certain use point is using the requested grade of pure water, the controller may not permit the requesting point of use to use the pure water until a use end signal is sent from the use point which is using the pure water.

    摘要翻译： 在用于灵活制造的小规模工厂中，以低成本提供纯净水供应系统，而不降低生产效率。 纯水系统产生多个等级的纯水，其通过连接到用于清洁，CMP，光刻等的使用点的管道供应。 一旦控制器收到来自每个使用点的请求信号以开始使用一定等级的纯水，则控制器确定所需量是否超过纯水系统能提供的纯水等级的容量。 如果没有，控制器将使用许可信号发送到使用点，以允许其使用纯净水。 当某个使用点正在使用所要求的纯水量时，控制器可能不允许请求使用点使用纯净水，直到从使用纯水的使用点发出使用结束信号。