Abstract:
A polarity-reversal protection device for integrated circuits, comprising a substrate of a first conductivity type; a well region of a second conductivity type opposite said first conductivity type, within said substrate; a field effect transistor having drain and source regions within said well of said first conductivity type, said drain region being connectable to external circuitry to be protected from polarity reversal of a supply voltage, said supply voltage being applied to said source region via a low impedance; and resistor means, coupled to said well region, for enabling said supply voltage to be applied therethrough to said well region, said resistor means operative to sink current during undesirable polarity reversal of the supply voltage, thereby preventing damage to the external circuitry and to the FET itself.
Abstract:
In this method, said emitter area (6) and said collector area of a bipolar transistor are each covered with a portion (71, 72) of an oxidation mask layer in a conventional manner. After implantation of ions of said conductivity type of said base region, an oxide stripe (21) surrounding said emitter are (6) is formed by thermal oxidation. After removal of said portions (71, 72) of said oxidation mask layer, successive layers (9, 10) are deposited which consist at least of a top layer (10) and an underlying doped silicide layer (9). Using a masked anisotropic etching process through said oxide stripe (21), said successive layers (9, 10) are divided into said emitter electrode (61) and said collector electrode (32), out of which said emitter region (4) and said collector contact region (31) are diffused.
Abstract:
A device for scanning optical images wherein light intensity of a scanned image line is converted to a pulse width modulation rather than a charge profile. A photo transistor row is connected to an inverter chain, and OR-gates have outputs which are fed to a common read line while the input signal of each OR-gate is tapped over coordinated partial rows of the photo transistor row.
Abstract:
To detect the rotational speed and angular position of a rotating wheel, a non-contact sensor (e.g., an optical sensor or a Hall sensor) scans scan marks on the wheel, and generates a pulse train. The amplitude of the pulses is compared in a comparator with a variable switching threshold. To achieve accurate measurement results, and to compensate for offset and long-term drift of the sensor, the switching threshold is adjusted if one or more of the following conditions is met: (i) the difference between the pulse amplitude and the switching threshold exceeds a fixable first maximum, (ii) the difference of the amplitudes of two successive pulses exceeds a fixable second maximum, (iii) the difference of the frequencies of successive pulses exceeds a fixable third maximum. The method is particularly advantageous in a motor vehicle, to detect the rotational speed and angular position for an electronic ignition system, or the rotational speed and angular position of the wheels for an ABS braking system, an anti-skid system, or a vehicle stabilization system.
Abstract:
Two-wire sensors for measuring physical quantities have only two connections (A1, A2), which serve to connect the power supply and also to conduct the measuring signals. However, because two-wire sensors have the property of controlled current sources, they can be connected only in parallel. Consequently, for a parallel circuit of n two-wire sensors disposed at different locations, two n lines are required. To reduce the number of lines, a two-wire sensor is provided with an end stage (W), which generates an output voltage (UA), which is a measure of the physical quantity measured by a measuring sensor (S) and which is always greater than an adjustable reference voltage signal (Uref). Because the inventive two-wire sensor therefore has the property of a voltage source, several of them can be connected in series. Consequently, even for a series circuit of several two-wire sensors, only two lines are required.
Abstract:
A system for processing a signal s(t) from a sensor to recover sensed signal information within the bandwidth of the summation signal, wherein the signal s(t) includes a sensed signal m(t) and an offset signal having a first frequency f1. The system comprises: a sampling device for sampling the signal s(t) at a second frequency f2 that is a multiple of the first frequency f1, to create a sequence of sampled values; and an averaging device for averaging the sequence of sampled values to provide a sequence of averaged sampled values indicative of the sensed signal m(t).
Abstract:
A collector contact (6) is fabricated which is attached on the side to the collector zone (1), and around which a moat (3) is produced which laterally restricts the collector zone (1). The depth of the moat (3) is so dimensioned to be at least equal to the vertical thickness of the collector zone (1). The collector contact (6) comprises a polycrystalline silicon layer which contains dopants of the same conductivity type as the collector zone (1), and covers a highly doped contacting zone (7') which has been diffused from the adjoining collector contact (6).
Abstract:
In fabricating the contact, the electrode layer of polycrystalline silicon whose rim portion is bonded via a layer portion of insulating material to the substrate, is used at least throughout the length of a part of its rim portion for the lateral delimitation of a etching process, as an etch mask, in the course of which a frame-shaped layer portion is formed underneath the rim portion of the electrode layer, and the contact area of the substrate as bordering on the layer portion is exposed. Following the deposition of a metal layer of a metal forming a silicide in a thickness smaller than the thickness of the layer portion, and the heating for forming the silicide, the metal which has so far not reacted with the silicon, is removed by using an etching agent selectively dissolving the metal.
Abstract:
The invention includes a method of manufacture of monolithic integrated VLSI circuits comprising bipolar transistors whose base regions are contacted in a self-aligned manner in proximity to the respective emitter regions by the use of silicide layers. The invention starts out from a process which, when using an insulating masking layer portion covering up the emitter area of the planar transistor, permits the self-aligned fabrication of emitter regions extending to the adjoining base region and to the base contacting region. Further embodiments of the process according to the invention permit the simultaneous manufacture of co-integrated CMOS circuits and of polycrystalline. Si-conductor leads whose resistances are reduced owing to the use of silicide layers.
Abstract:
A method of manufacturing bipolar transistors is described. The emitter areas are protected by means of an oxidation masking layer and subsequently after applying a photo-resist layer which defines the base areas two implantation processes of ions of the base zone conductivity type are performed. The one is performed with low doping dose and high acceleration voltage sufficient to render the masking layer penetrable and the other with high doping dose and low acceleration voltage as to render the masking layer impenetrable.