公开(公告)号：US20030137501A1

公开(公告)日：2003-07-24

申请号：US10340162

申请日：2003-01-10

Applicant: REFLECTIVITY, INC., a California corporation

Inventor： Peter W. Richards

IPC: G09G005/00

CPC classification number: G09G3/34 ,  G02F1/136277 ,  G09G3/2018 ,  G09G3/346 ,  G09G3/3648 ,  G09G2300/08 ,  G09G2310/0235 ,  G09G2310/0251 ,  G11C11/401 ,  G11C11/404

Abstract: A voltage storage cell circuit includes an access transistor and a storage capacitor, wherein the source of said access transistor is connected to a bitline, the gate of said access transistor is connected to a wordline, and wherein the drain of said access transistor is connected to a first plate of said storage capacitor forming a storage node, and wherein the second plate of said storage capacitor is connected to a pump signal. This arrangement allows for a novel pixel circuit design with area requirements comparable to that of a 1T1C DRAM-like pixel cell, but with the advantage of an output voltage swing of the full range allowed by the breakdown voltage of the pass transistor. A spatial light modulator such as a micromirror array can comprise such a voltage storage cell.

Abstract translation: 电压存储单元电路包括存取晶体管和存储电容器，其中所述存取晶体管的源极连接到位线，所述存取晶体管的栅极连接到字线，并且其中所述存取晶体管的漏极连接到 所述存储电容器的第一板形成存储节点，并且其中所述存储电容器的第二板连接到泵浦信号。 这种布置允许具有与1T1C类DRAM像素单元的面积要求相当的面积要求的新型像素电路设计，但是具有通过晶体管的击穿电压允许的全范围的输出电压摆幅的优点。 诸如微镜阵列的空间光调制器可以包括这种电压存储单元。

公开(公告)号：US20030073302A1

公开(公告)日：2003-04-17

申请号：US10270465

申请日：2002-10-11

Applicant: REFLECTIVITY, INC., a California corporation

Inventor： Andrew G. Huibers

IPC: H01L021/4763

CPC classification number: B81C1/00801 ,  B81C1/00095 ,  B81C1/00476 ,  B81C99/0065 ,  B81C2201/0138 ,  B81C2201/117 ,  H01L21/7682

Abstract: Processes are disclosed for forming integrated circuit devices where multilayered structures are formed having between layers a removable silicon material. The layers adjacent the removable silicon can be either conducting or insulating or both. After forming one or more layers with the removable silicon therebetween, the silicon is removed so as to provide for an air-gap dielectric. In one embodiment, adjacent layers are copper. Between the copper and removable silicon can be a barrier layer, such as a transition metal-silicon-nitride layer. In a preferred embodiment, the removable silicon is removed with a gas phase interhalogen or noble gas halide.

Abstract translation: 公开了用于形成集成电路器件的工艺，其中多层结构在层之间形成可移除的硅材料。 与可去除的硅相邻的层可以是导电的或绝缘的，也可以是两者。 在其间具有可去除的硅形成一个或多个层之后，去除硅以提供气隙电介质。 在一个实施例中，相邻层是铜。 在铜和可移除的硅之间可以是阻挡层，例如过渡金属 - 氮化硅层。 在优选的实施方案中，用气相卤间或惰性气体卤化物除去可除去的硅。

公开(公告)号：US20040233505A1

公开(公告)日：2004-11-25

申请号：US10346506

申请日：2003-01-15

Applicant: REFLECTIVITY, INC., a California corporation

Inventor： Andrew G. Huibers ,  Satyadev R. Patel

IPC: G02B026/00

CPC classification number: G02B26/0841

Abstract: A MEMS device is disclosed comprising: a substrate; a movable micromechanical element movable relative to the substrate; a connector and a hinge for allowing movement of the micromechanical element, wherein the connector is made of a material different than the hinge. In another embodiment of the invention, the connector has a conductivity greater than the hinge. In a further embodiment of the invention, the hinge provides at least 90% of the restoring force to the MEMS device, and the connector provides 10% or less of the restoring force. In a further embodiment of the invention, the connector and the hinge have different spring constants. In a still further embodiment of the invention, the connector experiences a lower strain at maximum deflection of the micromechanical element than the hinge.

Abstract translation: 公开了一种MEMS器件，包括：衬底; 可移动微机械元件，其相对于所述基板移动; 用于允许微机械元件移动的连接器和铰链，其中连接器由不同于铰链的材料制成。 在本发明的另一个实施例中，连接器的导电率大于铰链。 在本发明的另一实施例中，铰链提供至少90％的恢复力到MEMS装置，并且连接器提供10％或更小的恢复力。 在本发明的另一实施例中，连接器和铰链具有不同的弹簧常数。 在本发明的另一个实施例中，连接器在微机械元件的最大偏转处经受比铰链更低的应变。

公开(公告)号：US20040100594A1

公开(公告)日：2004-05-27

申请号：US10305507

申请日：2002-11-26

Applicant: REFLECTIVITY, INC., a California corporation

Inventor： Andrew G. Huibers ,  Peter W. Richards

IPC: G02F001/135

CPC classification number: B82Y30/00 ,  G02B26/0841 ,  H04N5/7458

Abstract: A projection system, a spatial light modulator, and a method for forming micromirrors are disclosed. A substrate comprises circuitry and electrodes for electrostatically deflecting micromirror elements that are disposed within an array of such elements forming the spatial light modulator. In one embodiment, the substrate is a silicon substrate having circuitry and electrodes thereon for electrostatically actuating adjacent micromirror elements, and the substrate is fully or selectively covered with a light absorbing material.

Abstract translation: 公开了投影系统，空间光调制器和用于形成微镜的方法。 衬底包括用于静电偏转微镜元件的电路和电极，微镜元件设置在形成空间光调制器的这种元件的阵列内。 在一个实施例中，衬底是具有电路和电极的硅衬底，用于静电地驱动相邻的微镜元件，并且衬底被完全或选择性地覆盖有光吸收材料。

公开(公告)号：US20030047533A1

公开(公告)日：2003-03-13

申请号：US10167272

申请日：2002-06-10

Applicant: REFLECTIVITY, INC., a California corporation

Inventor： Jason S. Reid ,  Nungavaram S. Viswanathan

IPC: C23F001/00 ,  C23C016/00

CPC classification number: B81C1/00476 ,  B81B2201/045 ,  B81C2201/0108 ,  B81C2201/112 ,  B81C2201/117 ,  B82Y30/00

Abstract: A method comprises depositing an organic material on a substrate; depositing additional material different from the organic material after depositing the organic material; and removing the organic material with a compressed fluid. Also disclosed is a method comprising: providing an organic layer on a substrate; after providing the organic layer, providing one or more layers of a material different than the organic material of the organic layer; removing the organic layer with a compressed fluid; and providing an anti-stiction agent with a compressed fluid to material remaining after removal of the organic layer.

Abstract translation: 一种方法包括在衬底上沉积有机材料; 在沉积有机材料之后沉积与有机材料不同的附加材料; 并用压缩流体除去有机材料。 还公开了一种方法，包括：在衬底上提供有机层; 在提供有机层之后，提供与有机层的有机材料不同的一层或多层材料; 用压缩流体去除有机层; 并且在去除有机层之后向剩余的材料提供具有压缩流体的抗静电剂。

公开(公告)号：US20030036215A1

公开(公告)日：2003-02-20

申请号：US10198389

申请日：2002-07-17

Applicant: REFLECTIVITY, INC., a Delaware Corporation

Inventor： Jason S. Reid

IPC: H01L021/00 ,  C23F001/00

CPC classification number: B81B3/0078 ,  B81B2201/045 ,  B81B2203/0118

Abstract: Micromechanical devices are provided that are capable of movement due to a flexible portion. The micromechanical device can have a flexible portion formed of an oxide of preferably an element from groups 3A to 6A of the periodic table (preferably from the first two rows of these groups) and a late transition metal (preferably from groups 8B or 1B of the periodic table). The micromechanical devices can be any device, particularly MEMS sensors or actuators preferably having a flexible portion such as an accelerometer, DC relay or RF switch, optical cross connect or optical switch, or a micromirror part of an array for direct view and projection displays. The flexible portion is preferably formed by sputtering a target having a group 8B or 1B element and a selected group 3A to 6A element, namely B, Al, In, Si, Ge, Sn, or Pb. The target can have other major constituents or impurities (e.g. additional group 3A to 6A element(s)). The target is reactively sputtered in a oxygen ambient so as to result in a sputtered hinge. It is possible to form both stiff and/or flexible portions of the micromechanical device in this way.

Abstract translation: 提供能够由于柔性部分而移动的微机械装置。 微机械装置可以具有柔性部分，该柔性部分由优选来自元素周期表3A〜6A族元素的氧化物（优选地来自这些基团的前两行）和后过渡金属（优选来自该组的第8B或1B族） 周期表）。 微机械装置可以是任何装置，特别是优选地具有诸如加速度计，DC继电器或RF开关，光交叉连接或光开关的柔性部分的MEMS传感器或致动器，或用于直视和投影显示器的阵列的微镜部分。 柔性部分优选通过溅射具有组8B或1B元素的靶和选定的3A至6A元素，即B，Al，In，Si，Ge，Sn或Pb来形成。 靶可以具有其它主要成分或杂质（例如另外的3A至6A族元素）。 目标物在氧气氛中反应溅射，以产生溅射铰链。 以这种方式可以形成微机械装置的刚性和/或柔性部分。

公开(公告)号：US20020196524A1

公开(公告)日：2002-12-26

申请号：US10155744

申请日：2002-05-24

Applicant: REFLECTIVITY, INC.

Inventor： Andrew G. Huibers ,  Peter J. Heureux ,  Satyadev R. Patel

IPC: G02B026/00

CPC classification number: G02B26/0841

Abstract: A spatial light modulator having a micromirror and one or more deflection limiting mechanisms, and a process for fabrication therefor. In one embodiment, the mirror support structure has a deflection stopping mechanism that limits the tilt angle of the reflective plate. Alternatively, a deflection stopping mechanism can be provided separate from the mirror support structure. The deflection stopping mechanism can be used in conjunction with one or more additional stopping mechanisms such as the abutment of a portion of the reflective plate against the substrate upon which it was constructed and/or abutment of the micromirror on a surface or structure of the circuit substrate.

Abstract translation: 具有微反射镜和一个或多个偏转限制机构的空间光调制器及其制造方法。 在一个实施例中，反射镜支撑结构具有限制反射板的倾斜角度的偏转停止机构。 或者，偏转止动机构可以与镜支撑结构分开设置。 偏转止动机构可以与一个或多个附加止动机构结合使用，例如反射板的一部分抵靠其上构造的基板和/或微镜在电路的表面或结构上的邻接 基质。

公开(公告)号：US20020195423A1

公开(公告)日：2002-12-26

申请号：US10104109

申请日：2002-03-22

Applicant: REFLECTIVITY, INC.

Inventor： Satyadev R. Patel ,  Gregory P. Schaadt ,  Douglas B. MacDonald ,  Hongqin Shi ,  Andrew G. Huibers ,  Peter Heureux

IPC: C23F001/00 ,  B44C001/22 ,  C03C015/00 ,  C03C025/68

CPC classification number: B81C1/00 ,  B81B2201/045 ,  B81C1/00476 ,  B81C1/00531 ,  B81C1/00595 ,  B81C99/0025 ,  B81C2201/0138 ,  B82Y30/00 ,  H01L21/3065 ,  H01L21/3081 ,  H01L21/32135

Abstract: The etching of a material in a vapor phase etchant is disclosed where a vapor phase etchant is provided to an etching chamber at a total gas pressure of 10 Torr or more, preferably 20 Torr or even 200 Torr or more. The vapor phase etchant can be gaseous acid etchant, a noble gas halide or an interhalogen. The sample/workpiece that is etched can be, for example, a semiconductor device or MEMS device, etc. The material that is etched/removed by the vapor phase etchant is preferably silicon and the vapor phase etchant is preferably provided along with one or more diluents. Another feature of the etching system includes the ability to accurately determine the end point of the etch step, such as by creating an impedance at the exit of the etching chamber (or downstream thereof) so that when the vapor phase etchant passes from the etching chamber, a gaseous product of the etching reaction is monitored, and the end point of the removal process can be determined. The vapor phase etching process can be flow through, a combination of flow through and pulse, or recirculated back to the etching chamber. A first plasma or wet chemical etch (or both) can be performed prior to the vapor phase etch.

Abstract translation: 公开了在气相蚀刻剂中的材料的蚀刻，其中气蚀刻蚀刻剂以10托或更大，优选20托或甚至200托或更大的总气体压力提供给蚀刻室。 气相蚀刻剂可以是气态酸蚀刻剂，惰性气体卤化物或中间卤素。 被蚀刻的样品/工件可以是例如半导体器件或MEMS器件等。通过气相蚀刻剂蚀刻/去除的材料优选为硅，并且气相蚀刻剂优选与一个或多个 稀释剂。 蚀刻系统的另一特征包括能够精确地确定蚀刻步骤的终点，例如通过在蚀刻室的出口处（或其下游）处产生阻抗，使得当气相蚀刻剂从蚀刻室 ，监测蚀刻反应的气体产物，并且可以确定除去过程的终点。 气相蚀刻工艺可以流过，流过和脉冲的组合，或再循环回蚀刻室。 可以在气相蚀刻之前执行第一等离子体或湿化学蚀刻（或两者）。

公开(公告)号：US20020185699A1

公开(公告)日：2002-12-12

申请号：US10176478

申请日：2002-06-21

Applicant: REFLECTIVITY, INC., a Delaware corporation

Inventor： Jason S. Reid

IPC: H01L027/14 ,  H01L021/00

CPC classification number: B81B3/0078 ,  B81B2201/045 ,  B81B2203/0118

Abstract: MEMS devices are provided that are capable of movement due to a flexible portion formed of unique materials for this purpose. The MEMS device can have a flexible portion formed of a nitride or oxynitride of at least one transition metal, and formed of a nitride or oxynitride of at least one metalloid or near metalloid; a flexible portion formed of a single transition metal nitride or oxynitride and in the absence of any other metal or metalloid nitrides; a flexible portion formed of one or more late transition metal nitrides or oxynitrides; a flexible portion formed of a single transition metal in nitride form, and an additional metal substantially in elemental form; or a flexible portion formed of at least one metalloid nitride or oxynitride. The MEMS devices can be any device, though preferably one with a flexible portion such as an accelerometer, DC relay or RF switch, optical cross connect or optical switch, or micromirror arrays for direct view and projection displays. The flexible portion (e.g. the hinge of the micromirror) is preferably formed by sputtering a metal and/or metalloid target in nitrogen ambient so as to result in a sputtered hinge. It is also possible to form other parts of the MEMS device (e.g structural parts that do not flex).

Abstract translation: 提供了由于为此目的而由独特材料形成的柔性部分能够移动的MEMS装置。 MEMS器件可以具有由至少一种过渡金属的氮化物或氮氧化物形成的柔性部分，并且由至少一种准金属或近乎准金属的氮化物或氧氮化物形成; 由单一过渡金属氮化物或氮氧化物形成并且不存在任何其它金属或准金属氮化物的柔性部分; 由一个或多个后过渡金属氮化物或氮氧化物形成的柔性部分; 由氮化物形式的单一过渡金属形成的柔性部分和基本上为元素形式的附加金属; 或由至少一种准金属氮化物或氧氮化物形成的柔性部分。 MEMS器件可以是任何器件，尽管优选地具有诸如加速度计，DC继电器或RF开关，光学交叉连接或光学开关的柔性部分或用于直视和投影显示器的微镜阵列。 柔性部分（例如微镜的铰链）优选通过在氮气环境中溅射金属和/或准金属靶以形成溅射铰链来形成。 也可以形成MEMS器件的其他部分（例如，不弯曲的结构部件）。

公开(公告)号：US20020132389A1

公开(公告)日：2002-09-19

申请号：US10099314

申请日：2002-03-15

Applicant: REFLECTIVITY, INC., a Delaware corporation

Inventor： Satyadev R. Patel ,  Andrew G. Huibers

IPC: H01L021/00 ,  H01L021/302 ,  H01L021/461 ,  H01L021/26

CPC classification number: B81C1/00214 ,  B81B7/0077 ,  B81B2201/042 ,  B81C1/00333 ,  B81C1/00896 ,  B81C1/00904 ,  B81C2203/0118 ,  B82Y30/00 ,  G02B26/0833 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01054 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

Abstract: A method is disclosed for forming a micromechanical device. The method includes fully or partially forming one or more micromechanical structures multiple times on a first substrate. A second substrate is bonded onto the first substrate so as to cover the multiple areas each having one or more micromechanical structures, so as to form a substrate assembly. The substrate assembly is then separated into individual dies, each die having the one or more micromechanical structures held on a portion of the first substrate, with a portion of the second substrate bonded to the first substrate portion. Finally, the second substrate portion is removed from each die to expose the one or more micromechanical structures on the first substrate portion. The invention is also directed to a method for forming a micromechanical device, including: forming one or more micromechanical structures in one or more areas on a first substrate; bonding caps onto the first substrate so as to cover the one or more areas each having one or more micromechanical structures, so as to form a substrate assembly; after a period of time, removing the caps to expose the one or more micromechanical structures. During the period of time between bonding the caps and later removing the caps, the substrate assembly can be singulated, inspected, irradiated, annealed, die attached, shipped and/or stored.

Abstract translation: 公开了一种用于形成微机械装置的方法。 该方法包括在第一衬底上多次完全或部分地形成一个或多个微机械结构。 将第二基板接合到第一基板上以覆盖各自具有一个或多个微机械结构的多个区域，以便形成基板组件。 然后将基板组件分离成单个管芯，每个管芯具有保持在第一衬底的一部分上的一个或多个微机械结构，其中第二衬底的一部分结合到第一衬底部分。 最后，从每个管芯移除第二衬底部分以露出第一衬底部分上的一个或多个微机械结构。 本发明还涉及一种用于形成微机械装置的方法，包括：在第一基板上的一个或多个区域中形成一个或多个微机械结构; 将盖接合到第一基板上以覆盖每个具有一个或多个微机械结构的一个或多个区域，以便形成基板组件; 在一段时间之后，移除盖以露出一个或多个微机械结构。 在接合盖子和稍后移除盖子之间的时间段期间，可以对基板组件进行单切割，检查，照射，退火，模具附接，运输和/或存储。