公开(公告)号：US20120021567A1

公开(公告)日：2012-01-26

申请号：US13252424

申请日：2011-10-04

Applicant: Jeffrey T. Coffin ,  Steven P. Ostrander ,  Frank L. Pompeo ,  Jiali Wu

Inventor： Jeffrey T. Coffin ,  Steven P. Ostrander ,  Frank L. Pompeo ,  Jiali Wu

IPC: H01L21/56

CPC classification number: H01L23/293 ,  H01L21/563 ,  H01L23/3157 ,  H01L24/32 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The present invention provides chip containing electronic devices such as Multichip Ceramic Modules (MCM's) containing a plurality of chips on a substrate which chips are underfilled with a reworkable composition which allows one or more chips to be removed from the device and replaced. The reworkable compositions contain a base resin which is not cross-linkable and which forms a matrix with a linear curable component or preferably a combination of linear curable components which curable components are cross-linkable and when cured form a cross-linked domain in the base resin matrix. A suitable cross-linking catalyst such as Pt is used and optionally a filler preferably silane surface treated silica. The preferred base resin is linear polydimethylsiloxane and the preferred curable components are vinyl terminated linear poly dimethyl siloxane and hydrogen terminated linear poly dimethyl siloxane.

Abstract translation: 本发明提供了包含电子器件的芯片，例如在衬底上包含多个芯片的多芯片陶瓷模块（MCM），其中芯片底部填充有可重复组合，其允许从器件中移除一个或多个芯片并被替换。 可再加工组合物含有不可交联的基础树脂，并且其形成具有线性可固化组分或优选可固化组分可交联的线性可固化组分的组合的基质，并且当固化形成基底中的交联结构域时 树脂基体。 使用合适的交联催化剂如Pt，任选的填料优选是硅烷表面处理的二氧化硅。 优选的基础树脂是直链聚二甲基硅氧烷，优选的可固化组分是乙烯基封端的直链聚二甲基硅氧烷和氢封端的直链聚二甲基硅氧烷。

公开(公告)号：US20110171466A1

公开(公告)日：2011-07-14

申请号：US12684174

申请日：2010-01-08

Applicant: Evan George Colgan ,  Paul W. Coteus ,  Michael Authony Gaynes ,  Kenneth Charles Marston ,  Steven P. Ostrander

Inventor： Evan George Colgan ,  Paul W. Coteus ,  Michael Authony Gaynes ,  Kenneth Charles Marston ,  Steven P. Ostrander

IPC: B32B7/06 ,  B32B38/10

CPC classification number: B32B37/1207 ,  B32B37/26 ,  B32B2037/243 ,  B32B2037/268 ,  B32B2309/02 ,  B32B2311/12 ,  B32B2311/24 ,  B32B2457/08 ,  Y10T156/11 ,  Y10T156/1195 ,  Y10T428/2804 ,  Y10T428/2813 ,  Y10T428/2861

Abstract: Precast curable thermal interface adhesives facilitating the easy and repeatable separation and remaining of electronic components at thermal interfaces thereof, and a method for implementing the foregoing repeatable separation and remating at the thermal interfaces of components through the use of such adhesives.

Abstract translation: 预制的可固化热界面粘合剂便于在其热界面处容易且可重复地分离和保留电子部件，以及用于通过使用这种粘合剂在组件的热界面处实现上述可重复分离和重新化的方法。

公开(公告)号：US07786579B2

公开(公告)日：2010-08-31

申请号：US11752449

申请日：2007-05-23

Applicant: Jean Audet ,  Anson J. Call ,  Steven P. Ostrander ,  Douglas O. Powell ,  Roger D. Weekly

Inventor： Jean Audet ,  Anson J. Call ,  Steven P. Ostrander ,  Douglas O. Powell ,  Roger D. Weekly

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H05K1/116 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/562 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2924/0002 ,  H01L2924/19051 ,  H01L2924/3011 ,  H05K1/0271 ,  H05K1/113 ,  H05K2201/09454 ,  H05K2201/09718 ,  H01L2924/00

Abstract: A microelectronic package having integrated circuits is provided. The microelectronic package includes multiple dielectric laminate layers, copper circuitry between the dielectric laminate layers where the copper circuitry includes circuit traces, and ball grid arrays/land grid arrays operatively connected to the copper circuitry such that conduction occurs. Further, proximate to the connection of the copper circuitry and the ball grid arrays/land grid arrays, a protective copper tongue is below an extension of the circuit traces, such that the protective copper tongue prevents the circuit traces from being affected by cracking propagated in the dielectric laminate layers or the ball grid arrays/land grid arrays.

Abstract translation: 提供具有集成电路的微电子封装。 微电子封装包括多个电介质层压层，铜电路在介电层压层之间，其中铜电路包括电路迹线，以及球栅阵列/焊盘电极阵列，可操作地连接到铜电路，从而导通发生。 此外，靠近铜电路和球栅阵列/接地栅阵列的连接，保护铜舌低于电路迹线的延伸线，使得保护铜舌防止电路迹线受到在 电介质层压层或球栅阵列/焊盘阵列。

公开(公告)号：US07462294B2

公开(公告)日：2008-12-09

申请号：US11739701

申请日：2007-04-25

Applicant: Rajneesh Kumar ,  Steven P Ostrander

Inventor： Rajneesh Kumar ,  Steven P Ostrander

IPC: C09K5/08 ,  C09K5/10 ,  C09K5/14 ,  H01B1/00 ,  H05K7/20

CPC classification number: H01L23/42 ,  H01L23/3737 ,  H01L2924/0002 ,  Y10T428/25 ,  H01L2924/00

Abstract: A thermal conducting mixture is provided which is used to make thermal conducting formulations such as a paste having a high thermal conductivity and a relatively low viscosity. The paste is used to provide a thermal conductor connection between an electronic component and a cooling device to increase the heat transfer rate between the component and the device cooling the electronic component. The formulation contains the mixture of thermally conductive particles in various particle size ranges typically dispersed in a non-aqueous dielectric carrier containing an antioxidant and a dispersant with the thermally conductive particles mixture being specially correlated in the mixture by volume % based on particle size range and by particle size ratio of each particle size range. The mixture may be used to make other similar products such as thermal gels, adhesives, slurries and composites, for electronic and cosmetics, pharmaceuticals, automotive, and like products.

Abstract translation: 提供了一种导热混合物，其用于制备导热配方，例如具有高导热性和较低粘度的糊状物。 该糊料用于在电子部件和冷却装置之间提供热导体连接，以增加部件和冷却电子部件的装置之间的传热速率。 制剂含有各种粒度范围内的导热颗粒的混合物，通常分散在含有抗氧化剂和分散剂的非水电介质载体中，导热颗粒混合物在混合物中基于粒度范围以体积百分数特别相关， 通过颗粒尺寸比各个粒径范围。 该混合物可用于制造其他类似产品，例如热凝胶，粘合剂，浆料和复合材料，用于电子和化妆品，药​​品，汽车和类似产品。

公开(公告)号：US20080290510A1

公开(公告)日：2008-11-27

申请号：US11752449

申请日：2007-05-23

Applicant: Jean Audet ,  Anson J. Call ,  Steven P. Ostrander ,  Douglas O. Powell ,  Roger D. Weekly

Inventor： Jean Audet ,  Anson J. Call ,  Steven P. Ostrander ,  Douglas O. Powell ,  Roger D. Weekly

IPC: H01L23/485

CPC classification number: H05K1/116 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/562 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2924/0002 ,  H01L2924/19051 ,  H01L2924/3011 ,  H05K1/0271 ,  H05K1/113 ,  H05K2201/09454 ,  H05K2201/09718 ,  H01L2924/00

Abstract: A microelectronic package having integrated circuits is provided. The microelectronic package includes multiple dielectric laminate layers, copper circuitry between the dielectric laminate layers where the copper circuitry includes circuit traces, and ball grid arrays/land grid arrays operatively connected to the copper circuitry such that conduction occurs. Further, proximate to the connection of the copper circuitry and the ball grid arrays/land grid arrays, a protective copper tongue is below an extension of the circuit traces, such that the protective copper tongue prevents the circuit traces from being affected by cracking propagated in the dielectric laminate layers or the ball grid arrays/land grid arrays.

Abstract translation: 提供具有集成电路的微电子封装。 微电子封装包括多个电介质层压层，铜电路在介电层压层之间，其中铜电路包括电路迹线，以及球栅阵列/焊盘电极阵列，可操作地连接到铜电路，从而导通发生。 此外，靠近铜电路和球栅阵列/接地栅阵列的连接，保护铜舌低于电路迹线的延伸线，使得保护铜舌防止电路迹线受到在 电介质层压层或球栅阵列/焊盘阵列。

公开(公告)号：US06908025B2

公开(公告)日：2005-06-21

申请号：US10604111

申请日：2003-06-26

Applicant: Patrick A. Coico ,  Steven P. Ostrander ,  Sudipta K. Ray

Inventor： Patrick A. Coico ,  Steven P. Ostrander ,  Sudipta K. Ray

IPC: B23K1/018 ,  B23K31/02 ,  B23K31/00

CPC classification number: B23K1/018 ,  Y10T29/4973 ,  Y10T29/4975 ,  Y10T29/49824

Abstract: A process and apparatus for preparing an MCM for hat removal where the hat includes a piston thermally coupled to a corresponding chip. The apparatus includes a heater positioned to reflow a joint between the piston and a base of the hat; and a retractor for biasing the piston away from the corresponding chip. Implementation of the apparatus and process prevent a piston, as it moves across the top of a corresponding chip during mechanical shear to remove the hat, to impact chip(s) and surrounding components. In addition, since piston(s) are retracted, the likelihood of piston impact with or cracking of a chip is reduced. In addition, cutting into a corresponding chip having a tilted back surface is prevented. The need to replace chips and other electronic components when making other repairs may, therefore, be greatly reduced.

Abstract translation: 一种制备用于帽子去除的MCM的方法和装置，其中帽子包括热耦合到相应芯片的活塞。 该装置包括加热器，该加热器定位成回流活塞和帽子的基座之间的接头; 以及用于将活塞偏压离开相应芯片的牵开器。 该设备和过程的实施防止活塞在机械剪切过程中跨过相应芯片的顶部移动以去除帽子，以冲击芯片和周围部件。 此外，由于活塞缩回，因此减少了活塞撞击或碎裂的可能性。 此外，防止切入具有倾斜背面的相应芯片。 因此，在进行其他维修时需要更换芯片和其他电子部件可能会大大降低。

公开(公告)号：US06821026B2

公开(公告)日：2004-11-23

申请号：US10235435

申请日：2002-09-04

Applicant: William T. Devine ,  Jeffrey A. Kash ,  John U. Knickerbocker ,  Steven P. Ostrander ,  Jeannine M. Trewhella ,  Ronald P. Luijten

Inventor： William T. Devine ,  Jeffrey A. Kash ,  John U. Knickerbocker ,  Steven P. Ostrander ,  Jeannine M. Trewhella ,  Ronald P. Luijten

IPC: G02B636

CPC classification number: H01S5/423 ,  H01S5/02248 ,  H01S5/02284

Abstract: A redundant configurable VCSEL laser array optical light source which provides for integrating optical communications capabilities into manufacturing processes for a substrate or submount such as a silicon or ceramic substrate, a multi-chip module, a package board, backplane or similar component. Multiple, spatially proximate lasers and photodetectors are provided as part of an optical transmitter or receiver module to simplify assembly of the module, particularly alignment of a laser or photodetector to an optical fiber or waveguide. A feedback loop and control logic select those laser(s) or photodiodes(s) which are most strongly coupled to the transmission medium to produce the best signals. This approach greatly simplifies optical alignment, to improve yield and relax mechanical tolerances, leading to lower assembly costs and higher manufacturing yields.

公开(公告)号：US5468427A

公开(公告)日：1995-11-21

申请号：US127637

申请日：1993-09-27

Applicant: Gregory C. Stangle ,  Koththavasal R. Venkatachari ,  Steven P. Ostrander ,  Walter A. Schulze

Inventor： Gregory C. Stangle ,  Koththavasal R. Venkatachari ,  Steven P. Ostrander ,  Walter A. Schulze

IPC: C01B13/32 ,  C01B13/34 ,  C01G3/00 ,  C01G23/00 ,  C01G23/047 ,  C01G25/02 ,  C01G49/00 ,  C04B35/45 ,  H01L39/24 ,  C01F1/00 ,  C01G1/00

CPC classification number: B82Y30/00 ,  C01B13/324 ,  C01B13/34 ,  C01G23/006 ,  C01G23/047 ,  C01G25/02 ,  C01G3/006 ,  C01G49/0036 ,  C01G49/0054 ,  C04B35/4508 ,  H01L39/2419 ,  C01P2004/64 ,  C01P2006/10 ,  C01P2006/12 ,  C01P2006/40

Abstract: A process for producing ultra-fine ceramic particles in which droplets are formed from a ceramic precursor mixture containing a metal cation, a nitrogen-containing fuel, a solvent, and an anion capable of participating in an anionic oxidation-reduction reaction with the nitrogen containing fuel. The nitrogen-containing fuel contains at least three nitrogen atoms, at least one oxygen atom, and at least one carbon atom. The ceramic precursor mixture is dried to remove at least 85 weight percent of the solvent, and the dried mixture is then ignited to form a combusted powder.

Abstract translation: 一种制造超细陶瓷颗粒的方法，其中由含有金属阳离子，含氮燃料，溶剂和能够参与与含氮的阴离子氧化还原反应的阴离子的陶瓷前体混合物形成液滴 汽油。 含氮燃料含有至少三个氮原子，至少一个氧原子和至少一个碳原子。 将陶瓷前体混合物干燥以除去至少85重量％的溶剂，然后将干燥的混合物点燃以形成燃烧的粉末。

公开(公告)号：US09272498B2

公开(公告)日：2016-03-01

申请号：US13546151

申请日：2012-07-11

Applicant: Evan George Colgan ,  Paul W. Coteus ,  Michael Anthony Gaynes ,  Kenneth Charles Marston ,  Steven P. Ostrander

Inventor： Evan George Colgan ,  Paul W. Coteus ,  Michael Anthony Gaynes ,  Kenneth Charles Marston ,  Steven P. Ostrander

IPC: B32B15/08 ,  B32B37/12 ,  B32B37/26 ,  B32B37/24

CPC classification number: B32B37/1207 ,  B32B37/26 ,  B32B2037/243 ,  B32B2037/268 ,  B32B2309/02 ,  B32B2311/12 ,  B32B2311/24 ,  B32B2457/08 ,  Y10T156/11 ,  Y10T156/1195 ,  Y10T428/2804 ,  Y10T428/2813 ,  Y10T428/2861

Abstract: Precast curable thermal interface adhesives facilitating the easy and repeatable separation and remaining of electronic components at thermal interfaces thereof, and a method for implementing the foregoing repeatable separation and remating at the thermal interfaces of components through the use of such adhesives.

Abstract translation: 预制的可固化热界面粘合剂便于在其热界面处容易且可重复地分离和保留电子部件，以及用于通过使用这种粘合剂在组件的热界面处实现上述可重复分离和重新化的方法。

公开(公告)号：US09048245B2

公开(公告)日：2015-06-02

申请号：US13488678

申请日：2012-06-05

Applicant: Edmund Blackshear ,  Thomas E. Lombardi ,  Donald A. Merte ,  Steven P. Ostrander ,  Thomas Weiss ,  Jiantao Zheng

Inventor： Edmund Blackshear ,  Thomas E. Lombardi ,  Donald A. Merte ,  Steven P. Ostrander ,  Thomas Weiss ,  Jiantao Zheng

IPC: B23K31/00 ,  B23K31/02 ,  B23K1/00 ,  B23K1/008 ,  B23K1/19 ,  B23K37/00 ,  B23K37/04 ,  H01L23/00 ,  H01L21/673

CPC classification number: H01L23/562 ,  H01L21/67333 ,  H01L22/12 ,  H01L22/20 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/81024 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81908 ,  H01L2924/3511 ,  Y02P80/30

Abstract: A method including providing a fixture comprising a trap ring, a base plate having a recess adapted to receive a laminate substrate, the base plate including an opening and an adjustable height center button disposed in the opening, the opening being located within the recess and located in a center of the laminate substrate, characterizing the laminate substrate for warpage characteristics by using one of room temperature techniques and elevated temperature techniques, determining a horizontal plane distortion based on the warpage characteristics, and placing the laminate substrate into the fixture with an adjustment to correct the horizontal plane distortion, the adjustment is provided by the adjustable height center button, wherein the adjustable height center button contacts the laminate substrate. The method further includes fluxing the laminate substrate, placing a chip onto the laminate substrate, and placing the fixture into a reflow furnace to join the chip and the laminate substrate.

Abstract translation: 一种方法，包括提供包括陷阱环的固定装置，具有适于接收层压基板的凹部的基板，所述基板包括设置在所述开口中的开口和可调节的高度中心按钮，所述开口位于所述凹部内并且位于 在层压基板的中心，通过使用室温技术和高温技术中的一种来表征层压基板的翘曲特性，基于翘曲特性确定水平面变形，并将层压基板放置到固定装置中， 校正水平面失真，调节由可调高度中心按钮提供，其中可调节的高度中心按钮接触层压基板。 该方法还包括使层压基板熔化，将芯片放置在层压基板上，并将固定装置放入回流炉中以连接芯片和层叠基板。