公开(公告)号：US10579919B2

公开(公告)日：2020-03-03

申请号：US16450659

申请日：2019-06-24

Applicant: Thin Film Electronics ASA

Inventor： Matthew A. Bright

IPC: G06K19/077 ,  A61J1/00 ,  B65D27/30 ,  G06Q30/00 ,  H04B5/00 ,  B65D55/02 ,  B65D79/02 ,  G06K1/00

Abstract: A wireless (e.g., near field or RF) communication device, and methods of manufacturing and using the same are disclosed. The wireless communication device includes a receiver and/or transmitter, a substrate with an antenna thereon, an integrated circuit, and one or more protection lines. The antenna receives and/or transmits or broadcasts a wireless signal. The integrated circuit processes the wireless signal and/or information therefrom, and/or generates the wireless signal and/or information therefor. The integrated circuit has a first set of terminals electrically connected to the antenna. The protection line(s) are on a common or different substrate as the antenna. The protection line(s) sense or determine a continuity state of a package or container on which the communication device is placed or to which the communication device is fixed or adhered, and are electrically connected to a second set of terminals of the integrated circuit different from the first set of terminals.

公开(公告)号：US20190138864A1

公开(公告)日：2019-05-09

申请号：US16094194

申请日：2017-04-18

Applicant: Thin Film Electronics ASA

Inventor： Paul REYLAND ,  Alex CHANDLER

IPC: G06K19/04 ,  G06K19/077 ,  G09F3/03

Abstract: A smart label including a communication device and a continuity sensor, and methods of manufacturing and using the same, are disclosed. The smart label includes a substrate having a preferential tearing direction, an antenna or display, an integrated circuit, and a sensing line configured to sense or determine a continuity state of a container on which the communication device is placed or to which the communication device is fixed or adhered. The sensing line has at least one section oriented perpendicularly or substantially perpendicularly to the preferential tearing direction of the substrate. The antenna is configured to receive a first wireless signal and/or transmit or broadcast a second wireless signal. The communication device (or integrated circuit) may further include a receiver and/or transmitter, in which case the integrated circuit may be configured to process the first wireless signal and/or information therefrom and/or generate the second wireless signal and/or information therefor. Alternatively, the smart label may include a display (and optionally a battery) instead of the antenna. The display may be configured to display the continuity state of the container.

公开(公告)号：US20180285706A1

公开(公告)日：2018-10-04

申请号：US15765885

申请日：2015-10-06

Applicant: Thin Film Electronics ASA

Inventor： Mao TAKASHIMA ,  Jacob BOYD ,  Aditi CHANDRA

IPC: G06K19/07 ,  H01Q1/22 ,  H01Q7/00 ,  H05K1/16 ,  H05K3/12 ,  H05K3/36 ,  G08B13/24

Abstract: An electronic device and methods of manufacturing the same are disclosed. One method of manufacturing the electronic device includes forming a first metal layer on a first substrate, forming an electrical device on a second substrate, forming electrical connectors on input and/or output terminals of the electrical device, selectively depositing a second metal on at least part of the first metal layer, and electrically connecting the electrical connectors to the first metal layer by contacting the electrical connectors to the second metal. The second metal is different from the first metal. The second metal improves adhesion and/or electrical connectivity of the first metal layer to the electrical connectors on the electrical device.

公开(公告)号：US09400953B1

公开(公告)日：2016-07-26

申请号：US14285469

申请日：2014-05-22

Applicant: Thin Film Electronics ASA

Inventor： Criswell Choi ,  Joerg Rockenberger ,  Christopher Gudeman ,  J. Devin Mackenzie ,  Partick Smith ,  James Montague Cleeves

IPC: G03F7/00 ,  G01S13/74 ,  G06K19/077 ,  G08B13/24

CPC classification number: G06K19/07773 ,  G03F7/0043 ,  G03F7/2055 ,  G06K19/07749 ,  G08B13/2402 ,  G08B13/2417 ,  G08B13/244 ,  G08B13/2468

Abstract: Methods, algorithms, processes, circuits, and/or structures for laser patterning suitable for customized RFID designs are disclosed. In one embodiment, a method of laser patterning of an identification device can include the steps of: (i) depositing a patternable resist formulation on a substrate having configurable elements and/or materials thereon; (ii) irradiating the resist formulation with a laser tool sufficiently to change the solubility characteristics of the resist in a developer; and (iii) developing exposed areas of the resist using the developer. Embodiments of the present invention can advantageously provide a relatively low cost and high throughput approach for customized RFID devices.

Abstract translation: 公开了适用于定制RFID设计的用于激光图案的方法，算法，过程，电路和/或结构。 在一个实施例中，识别装置的激光图案化的方法可以包括以下步骤：（i）在其上具有可配置元件和/或材料的衬底上沉积可图案化的抗蚀剂制剂; （ii）用激光工具照射抗蚀剂制剂，足以改变显影剂中抗蚀剂的溶解度特性; 和（iii）使用显影剂显影抗蚀剂的曝光区域。 本发明的实施例可以有利地为定制的RFID设备提供相对低成本和高吞吐量的方法。

公开(公告)号：US09359513B1

公开(公告)日：2016-06-07

申请号：US14305559

申请日：2014-06-16

Applicant: Thin Film Electronics ASA

Inventor： Mao Takashima ,  Inna Tregub ,  Wenzhuo Guo ,  Brian Bedwell ,  Klaus Kunze ,  Aditi Chandra ,  Arvind Kamath ,  Jun Li ,  Li Li ,  Junfeng Mei

IPC: C09D11/107

CPC classification number: C09D11/107 ,  C09D11/52 ,  H01L51/0005

Abstract: Printable dopant formulations, methods of making such dopant formulations, and methods of using such dopant formulations are disclosed. The dopant formulations provide a printable dopant ink with a viscosity sufficient to prevent ink spreading when deposited in a pattern on a substrate. Furthermore, an ion exchange purification process provides the dopant formulation with a reduced metal ion concentration, and thus a relatively high purity level. Consequently, the dopant residue remaining on the substrate after curing and/or dopant activation process is relatively uniform, and therefore can be easily removed.

Abstract translation: 公开了可印刷掺杂剂配方，制备这种掺杂剂配方的方法，以及使用这种掺杂剂配方的方法。 掺杂剂配方提供可印刷的掺杂剂油墨，其具有足够的粘度，以防止当以基板上的图案沉积时的油墨扩散。 此外，离子交换纯化方法为掺杂剂配方提供降低的金属离子浓度，从而提供相当高的纯度水平。 因此，在固化和/或掺杂剂活化过程之后残留在基板上的掺杂剂残留物相对均匀，因此可以容易地除去。

公开(公告)号：US09336925B1

公开(公告)日：2016-05-10

申请号：US13889149

申请日：2013-05-07

Applicant: Thin Film Electronics ASA

Inventor： Wenzhuo Guo ,  Brent Ridley ,  Joerg Rockenberger

IPC: C08G77/04 ,  H01B3/02 ,  H01L21/02 ,  C07F7/02 ,  C07F7/08 ,  C08G77/06

CPC classification number: H01L21/2254 ,  C07F7/025 ,  C07F7/0834 ,  C08G77/04 ,  C08G77/06 ,  C09D1/00 ,  H01B3/02 ,  H01B3/025 ,  H01L21/02112 ,  H01L21/02126 ,  H01L21/02282 ,  H01L21/02288 ,  H01L21/02318 ,  H01L21/324

Abstract: In one aspect, the present invention provides undoped and doped siloxanes, germoxanes, and silagermoxanes that are substantially free from carbon and other undesired contaminants. In a second aspect, the present invention provides methods for making such undoped and doped siloxanes, germoxanes, and silagermoxanes. In still another aspect, the present invention provides compositions comprising undoped and/or doped siloxanes, germoxanes, and silagermoxanes and a solvent, and methods for forming undoped and doped dielectric films from such compositions. Undoped and/or doped siloxane compositions as described advantageously provide undoped and/or doped dielectric precursor inks that may be employed in forming substantially carbon-free undoped and/or doped dielectric films.

Abstract translation: 在一个方面，本发明提供基本上不含碳和其它不期望的污染物的未掺杂和掺杂的硅氧烷，锗氧烷和硅胶。 在第二方面，本发明提供了制备这种未掺杂和掺杂的硅氧烷，锗烷和硅胶木糖的方法。 在另一方面，本发明提供了包含未掺杂和/或掺杂的硅氧烷，锗氧烷和硅藻木素和溶剂的组合物，以及用于从这种组合物形成未掺杂和掺杂的介电膜的方法。 所描述的未掺杂和/或掺杂的硅氧烷组合物有利地提供未掺杂和/或掺杂的电介质前体油墨，其可用于形成基本上不含碳的未掺杂和/或掺杂的介电膜。

公开(公告)号：US10371737B2

公开(公告)日：2019-08-06

申请号：US15626512

申请日：2017-06-19

Applicant: Thin Film Electronics ASA

Inventor： Somnath Mukherjee

IPC: G01R27/28 ,  G01R31/02 ,  B65D79/02 ,  G01N27/02 ,  G01D5/20 ,  G08B13/12 ,  G08B13/24 ,  G06K19/07 ,  A61M15/00

Abstract: An electronic device including a continuity sensor and electrical circuitry configured to detect and report the continuity state of an article, container or product packaging is disclosed. The continuity sensor includes a first substrate with first and second coils thereon, and a second substrate with a third coil thereon. The first coil has an integrated circuit electrically connected thereto. The first substrate is part of, or is attached or secured to a part of the article, container or packaging. The second substrate is another part of, or is attached or secured to another part of the article, container or packaging. One of the article, container or packaging parts is (re)movable with respect to the other part. The first and second coils have one coupling when the article, container or packaging is closed or sealed, and a different coupling when the article, container or packaging is open or unsealed.

公开(公告)号：US10360493B2

公开(公告)日：2019-07-23

申请号：US16154496

申请日：2018-10-08

Applicant: Thin Film Electronics ASA

Inventor： Matthew A. Bright

IPC: H04Q5/22 ,  G06K19/077 ,  A61J1/00 ,  B65D27/30 ,  G06Q30/00 ,  H04B5/00 ,  B65D55/02 ,  B65D79/02 ,  G06K1/00

Abstract: A wireless (e.g., near field or RF) communication device, and methods of manufacturing and using the same are disclosed. The wireless communication device includes a receiver and/or transmitter, a substrate with an antenna thereon, an integrated circuit, and one or more protection lines. The antenna receives and/or transmits or broadcasts a wireless signal. The integrated circuit processes the wireless signal and/or information therefrom, and/or generates the wireless signal and/or information therefor. The integrated circuit has a first set of terminals electrically connected to the antenna. The protection line(s) are on a common or different substrate as the antenna. The protection line(s) sense or determine a continuity state of a package or container on which the communication device is placed or to which the communication device is fixed or adhered, and are electrically connected to a second set of terminals of the integrated circuit different from the first set of terminals.

公开(公告)号：US20170313592A1

公开(公告)日：2017-11-02

申请号：US15523921

申请日：2015-10-13

Applicant: Thin Film Electronics ASA

Inventor： Yuichi GOTO ,  Masahisa ENDO ,  Gun SON ,  Kentaro NEGAI

IPC: C01B33/113 ,  C01B33/04 ,  B01J23/46

CPC classification number: C01B33/113 ,  B01J23/464 ,  C01B33/04 ,  C08G77/60 ,  H01L21/0217 ,  H01L21/02214 ,  H01L21/02282

Abstract: A method of producing a silicon hydride oxide-containing organic solvent (coating solution) is provided with which a silicon hydride oxide coating film can be formed on a substrate. Using the silicon hydride oxide-containing organic solvent makes it unnecessary to place a coating solution in non-oxidizing atmosphere at the time of coating or to heat the substrate after coating because the silicon hydride oxide is formed in the coating solution before it is coated. The method includes blowing an oxygen-containing gas through an organic solvent containing a silicon hydride or a polymer thereof. The silicon hydride oxide may contain a proportion of (residual Si—H groups)/(Si—H groups before oxidation) of 1 to 40 mol %. The silicon hydride can be obtained by reacting a cyclic silane with a hydrogen halide in the presence of an aluminum halide, and reducing the obtained cyclic halosilane.

公开(公告)号：US20170210857A1

公开(公告)日：2017-07-27

申请号：US15326632

申请日：2015-06-30

Applicant: Thin Film Electronics ASA

Inventor： Masahisa ENDO ,  Gun SON ,  Yuichi GOTO ,  Kentaro NAGAI

IPC: C08G77/60 ,  C09D5/24 ,  B05D3/02 ,  C01B33/021 ,  C01B33/04 ,  H01L21/02 ,  C09D183/16

CPC classification number: C08G77/60 ,  B05D3/0254 ,  C01B33/02 ,  C01B33/021 ,  C01B33/04 ,  C03C17/22 ,  C09D5/24 ,  C09D183/16 ,  H01L21/02532

Abstract: There is provided a highly conductive and good silicon thin film which is obtained by applying a coating-type polysilane composition prepared by use of a polysilane having a large weight average molecular weight to a substrate, followed by baking. A polysilane having a weight average molecular weight of 5,000 to 8,000. The polysilane may be a polymer of cyclopentasilane. A silicon film obtained by applying a polysilane composition in which the polysilane is dissolved in a solvent to a substrate, and baking the substrate at 100° C. to 425° C. The cyclopentasilane may be polymerized in the presence of a palladium catalyst supported on a polymer. The palladium catalyst supported on a polymer may be a catalyst in which palladium as a catalyst component is immobilized on a functional polystyrene. The palladium may be a palladium compound or a palladium complex. The palladium-immobilized catalyst may be formed by microencapsulating a zero-valent palladium complex or a divalent palladium compound with a functional polystyrene. The zero-valent palladium complex may be a tetrakis(triphenylphosphine)palladium (0) complex.