Manufacture method and system for semiconductor device with thin gate insulating film of oxynitride
    11.
    发明授权
    Manufacture method and system for semiconductor device with thin gate insulating film of oxynitride 有权
    半导体器件的制造方法和系统,其具有氮氧化物的薄栅极绝缘膜

    公开(公告)号:US06468926B1

    公开(公告)日:2002-10-22

    申请号:US09342057

    申请日:1999-06-29

    IPC分类号: H01L2131

    摘要: A manufacture method for a semiconductor device includes the steps of: (a) transporting a silicon wafer into a reaction chamber having first and second gas introducing inlet ports; (b) introducing an oxidizing atmosphere via the first gas introducing inlet port and raising the temperature of the silicon wafer to an oxidation temperature; (c) introducing a wet oxidizing atmosphere to form a thermal oxide film on the surface of the silicon wafer; (d) purging gas in the reaction chamber by using inert gas to lower a residual water concentration to about 1000 ppm or lower; and (e) introducing an NO or N2O containing atmosphere into the reaction chamber via the second gas introducing inlet port while the silicon wafer is maintained above 700° C. and above the oxidation temperature, to introduce nitrogen into the thermal oxide film and form an oxynitride film. A thin oxynitride film can be manufactured with good mass productivity.

    摘要翻译: 半导体器件的制造方法包括以下步骤:(a)将硅晶片输送到具有第一和第二气体引入入口的反应室中; (b)经由第一气体导入口引入氧化气氛,将硅晶片的温度升高至氧化温度; (c)引入湿氧化气氛以在硅晶片的表面上形成热氧化膜; (d)通过使用惰性气体将残留水浓度降低至约1000ppm或更低,在反应室中吹扫气体; 和(e)在硅晶片保持在700℃以上并高于氧化温度的同时,经由第二气体导入口将NO或N 2 O的气氛引入反应室,将氮引入热氧化膜中,形成 氧氮化物膜。 可以以良好的质量生产率制造薄氧氮化物膜。

    Semiconductor device including FinFETs having different gate structures and method of manufacturing the semiconductor device
    13.
    发明授权
    Semiconductor device including FinFETs having different gate structures and method of manufacturing the semiconductor device 有权
    包括具有不同栅极结构的FinFET和半导体器件的制造方法的半导体器件

    公开(公告)号:US09564435B2

    公开(公告)日:2017-02-07

    申请号:US14754400

    申请日:2015-06-29

    摘要: A semiconductor device includes a substrate having a logic device region including logic devices thereon, and an input/output (I/O) device region including I/O devices thereon adjacent the logic device region. A first fin field-effect transistor (FinFET) on the logic device region includes a first semiconductor fin protruding from the substrate, and a triple-gate structure having a first gate dielectric layer and a first gate electrode thereon. A second FinFET on the I/O device region includes a second semiconductor fin protruding from the substrate, and a double-gate structure having a second gate dielectric layer and a second gate electrode thereon. The first and second gate dielectric layers have different thicknesses. Related devices and fabrication methods are also discussed.

    摘要翻译: 半导体器件包括具有其上包括逻辑器件的逻辑器件区域的衬底,以及在其上邻近逻辑器件区域的包括I / O器件的输入/输出(I / O)器件区域。 逻辑器件区域上的第一鳍状场效应晶体管(FinFET)包括从衬底突出的第一半导体鳍片,以及在其上具有第一栅极电介质层和第一栅极电极的三栅极结构。 I / O器件区域上的第二FinFET包括从衬底突出的第二半导体鳍片,以及在其上具有第二栅极介电层和第二栅电极的双栅极结构。 第一和第二栅极电介质层具有不同的厚度。 还讨论了相关设备和制造方法。

    Methods for fabricating a cell string and a non-volatile memory device including the cell string
    14.
    发明授权
    Methods for fabricating a cell string and a non-volatile memory device including the cell string 有权
    制造电池串的方法和包括电池串的非易失性存储装置

    公开(公告)号:US08785276B2

    公开(公告)日:2014-07-22

    申请号:US13198143

    申请日:2011-08-04

    CPC分类号: H01L27/11582

    摘要: A method for fabricating a cell string includes forming an interlayer dielectric layer, a sacrificial layer, and a semiconductor pattern on a semiconductor substrate, such that the interlayer dielectric layer and the sacrificial layer are formed in a first direction parallel with the semiconductor substrate, and such that the semiconductor pattern is formed in a second direction perpendicular to the semiconductor substrate, forming an opening by patterning the interlayer dielectric layer and the sacrificial layer, filling the opening with a metal, and annealing the semiconductor pattern having the opening filled with the metal.

    摘要翻译: 一种电池串的制造方法,包括在半导体基板上形成层间电介质层,牺牲层和半导体图案,使得层间绝缘层和牺牲层沿与半导体基板平行的第一方向形成,以及 使得半导体图案在垂直于半导体衬底的第二方向上形成,通过图案化层间电介质层和牺牲层形成开口,用金属填充开口,并且将具有填充有金属的开口的半导体图案退火 。

    Three-dimensional semiconductor memory devices
    15.
    发明授权
    Three-dimensional semiconductor memory devices 有权
    三维半导体存储器件

    公开(公告)号:US08598647B2

    公开(公告)日:2013-12-03

    申请号:US13291519

    申请日:2011-11-08

    IPC分类号: H01L29/788

    摘要: Provided are three-dimensional semiconductor devices. The device includes conductive patterns stacked on a substrate, and an active pattern penetrating the conductive patterns to be connected to the substrate. The active pattern includes a first doped region disposed adjacent to at least one of the conductive patterns, and a diffusion-resistant doped region overlapped with at least a portion of the first doped region. The diffusion-resistant doped region may be a region doped with carbon.

    摘要翻译: 提供三维半导体器件。 该器件包括堆叠在衬底上的导电图案,以及穿透要连接到衬底的导电图案的有源图案。 有源图案包括邻近至少一个导电图案设置的第一掺杂区域和与第一掺杂区域的至少一部分重叠的扩散阻抗掺杂区域。 扩散阻止掺杂区域可以是掺杂有碳的区域。

    THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
    18.
    发明申请
    THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
    三维半导体存储器件及其制造方法

    公开(公告)号:US20110294290A1

    公开(公告)日:2011-12-01

    申请号:US13117489

    申请日:2011-05-27

    IPC分类号: H01L21/283

    摘要: A three-dimensional semiconductor memory device includes a stacked structure including a plurality of conductive patterns, an active pillar penetrating the stacked structure, and a data storage pattern between the active pillar and the conductive patterns, wherein the active pillar includes a vertical semiconductor pattern penetrating the stacked structure and protruding semiconductor patterns between the vertical semiconductor pattern and the data storage pattern, the protruding semiconductor patterns having a different crystalline structure from that of the vertical semiconductor pattern.

    摘要翻译: 一种三维半导体存储器件包括:堆叠结构,包括多个导电图案,穿透层叠结构的有源柱,以及有源柱和导电图案之间的数据存储图案,其中有源柱包括垂直半导体图案, 垂直半导体图案和数据存储图案之间的堆叠结构和突出的半导体图案,突出的半导体图案具有与垂直半导体图案不同的晶体结构。