ROUGH STRUCTURE OF OPTOELECTRONIC DEVICE AND FABRICATION THEREOF
    12.
    发明申请
    ROUGH STRUCTURE OF OPTOELECTRONIC DEVICE AND FABRICATION THEREOF 审中-公开
    光电器件的粗糙结构及其制造

    公开(公告)号:US20100019263A1

    公开(公告)日:2010-01-28

    申请号:US12505711

    申请日:2009-07-20

    Abstract: A dual-scale rough structure, in which a plurality of islands are grown on a semiconductor layer by heavily doping a dopant during epitaxy of a semiconductor layer of an optoelectronics device, is provided. A plurality of pin holes are formed on the islands by lowering the epitaxial temperature. The pin holes are distributed over the top and sidewall surfaces of the islands so that the total internal reflection within the optoelectronics device can be significantly reduced so as to enhance the brightness thereof. Compared with traditional technologies, the process method of the present invention has the advantages of producing less pollution, being able to perform easily, reducing manufactured cost, increasing the efficiency of light extraction, and increasing the effective area of the dual-scale emitting surface, which is not a smooth surface, of the structure.

    Abstract translation: 提供了一种双尺度粗糙结构,其中通过在光电子器件的半导体层的外延期间重掺杂掺杂剂,在半导体层上生长多个岛。 通过降低外延温度,在岛上形成多个针孔。 针孔分布在岛的顶壁和侧壁表面上,使得光电子器件内的全内反射可以显着地减小,从而增强其亮度。 与传统技术相比,本发明的方法具有污染少,能够容易地实现,降低制造成本,提高光提取效率,增加双尺度发射面有效面积的优点, 这不是一个光滑的表面,结构。

    RADIATION EMITTING SEMICONDUCTOR DEVICE
    14.
    发明申请
    RADIATION EMITTING SEMICONDUCTOR DEVICE 审中-公开
    辐射发射半导体器件

    公开(公告)号:US20090278160A1

    公开(公告)日:2009-11-12

    申请号:US12435984

    申请日:2009-05-05

    Abstract: The present invention provides a radiation emitting semiconductor device, which comprises an active layer for emitting radiation, a p-type conductive layer, a transparent conductive layer, and a non-p-type ohmic contact layer. The p-type conductive layer is formed on the active layer. The transparent conductive layer is formed on the p-type conductive layer. The non-p-type ohmic contact layer is disposed between said p-type conductive layer and said transparent conductive layer. The non-p-type ohmic contact layer is configured to reduce the operating voltage of said radiation emitting semiconductor device. In addition, the present invention provides that the non-p-type ohmic contact layer is made of a quaternary alloy of AlxInyGa1-x-yN. The aluminum composition in the quaternary alloy of AlxInyGa1-x-yN can be used to adjust the band gap energy of the quaternary alloy such that the band gap energy of the quaternary alloy is larger than that of the active layer, thereby reducing the absorption of radiation by the non-p-type ohmic contact layer.

    Abstract translation: 本发明提供一种辐射发射半导体器件,其包括用于发射辐射的有源层,p型导电层,透明导电层和非p型欧姆接触层。 p型导电层形成在有源层上。 透明导电层形成在p型导电层上。 非p型欧姆接触层设置在所述p型导电层和所述透明导电层之间。 非p型欧姆接触层被配置为降低所述辐射发射半导体器件的工作电压。 此外,本发明提供非p-型欧姆接触层由Al x In y Ga 1-x-y N的四元合金制成。 可以使用Al x In y Ga 1-x-y N的四元合金中的铝组成来调节四元合金的带隙能量,使得四元合金的带隙能量大于活性层的带隙能量,从而降低 由非p型欧姆接触层辐射。

    SEMICONDUCTOR OPTOELECTRONIC STRUCTURE WITH INCREASED LIGHT EXTRACTION EFFICIENCY
    16.
    发明申请
    SEMICONDUCTOR OPTOELECTRONIC STRUCTURE WITH INCREASED LIGHT EXTRACTION EFFICIENCY 有权
    具有提高光提取效率的半导体光电结构

    公开(公告)号:US20140027806A1

    公开(公告)日:2014-01-30

    申请号:US14037386

    申请日:2013-09-26

    Abstract: A semiconductor optoelectronic structure with increased light extraction efficiency, includes a substrate; a buffer layer is formed on the substrate and includes a pattern having plural grooves formed adjacent to the substrate; a semiconductor layer is formed on the buffer layer and includes an n-type conductive layer formed on the buffer layer, an active layer formed on the n-type conductive layer, and a p-type conductive layer formed on the active layer; a transparent electrically conductive layer is formed on the semiconductor layer; a p-type electrode is formed on the transparent electrically conductive layer; and an n-type electrode is formed on the n-type conductive layer.

    Abstract translation: 具有提高光提取效率的半导体光电子结构包括基片; 在基板上形成缓冲层,并具有与基板相邻形成有多个槽的图案, 在缓冲层上形成半导体层,在缓冲层上形成n型导体层,在n型导电层上形成有源层,在活性层上形成p型导电层。 在半导体层上形成透明导电层; 在透明导电层上形成p型电极; 在n型导电层上形成n型电极。

    CERAMIC DEVICE AND METHOD FOR FABRICATING THE SAME
    18.
    发明申请
    CERAMIC DEVICE AND METHOD FOR FABRICATING THE SAME 审中-公开
    陶瓷器件及其制造方法

    公开(公告)号:US20120231154A1

    公开(公告)日:2012-09-13

    申请号:US13353322

    申请日:2012-01-19

    CPC classification number: H05K3/1258 H05K3/4629 H05K3/4685

    Abstract: A method for fabricating a ceramic device is provided. A green sheet is adhered on an adhesive film. A photoresist film is then formed on the green sheet. A photolithographic process is carried out to form circuit trenches in the photoresist film. The circuit trenches are filled with metal paste, thereby forming a circuit pattern. The photoresist film is then removed.

    Abstract translation: 提供一种制造陶瓷器件的方法。 生片粘附在粘合膜上。 然后在生片上形成光致抗蚀剂膜。 进行光刻工艺以在光致抗蚀剂膜中形成电路沟槽。 电路沟槽填充有金属膏,从而形成电路图案。 然后除去光致抗蚀剂膜。

    Light-emitting diode module
    19.
    发明授权
    Light-emitting diode module 有权
    发光二极管模块

    公开(公告)号:US08174842B2

    公开(公告)日:2012-05-08

    申请号:US12495818

    申请日:2009-07-01

    Abstract: A light-emitting diode (LED) module includes a plurality of LED units and a converter having a first side. The LED units respectively include a circuit board having a second side perpendicular to the first side and a third side parallel to the first side, a plurality of LEDs positioned on the circuit board, and a connector positioned on the second side proximal to the converter. The LED module further includes a plurality of flexible flat cables (FFCs) used to electrically connect the connectors to the converter, respectively.

    Abstract translation: 发光二极管(LED)模块包括多个LED单元和具有第一侧的转换器。 LED单元分别包括具有垂直于第一侧的第二侧和与第一侧平行的第三侧的电路板,位于电路板上的多个LED以及位于转换器附近的第二侧的连接器。 LED模块还包括分别用于将连接器电连接到转换器的多个柔性扁平电缆(FFC)。

    Method for separating semiconductor layer from substrate
    20.
    发明授权
    Method for separating semiconductor layer from substrate 失效
    从衬底分离半导体层的方法

    公开(公告)号:US08148246B2

    公开(公告)日:2012-04-03

    申请号:US12437058

    申请日:2009-05-07

    CPC classification number: H01L21/76256

    Abstract: A method for separating a semiconductor from a substrate is disclosed. The method comprises the following steps: forming a plurality of columns on a substrate; epitaxially growing a semiconductor on the plurality of columns; and injecting etching liquid into the void among the plurality of columns so as to separate the semiconductor from the substrate. The method of this invention can enhance the etching efficiency of separating the semiconductor from the substrate and reduce the fabrication cost because the etching area is increased due to the void among the plurality of columns. In addition, the method will not confine the material of the above-mentioned substrate.

    Abstract translation: 公开了一种从衬底分离半导体的方法。 该方法包括以下步骤:在衬底上形成多个柱; 在多个柱上外延生长半导体; 并将蚀刻液注入到多个列之间的空隙中,以将半导体与基板分离。 本发明的方法可以提高从衬底分离半导体的蚀刻效率,并降低制造成本,因为蚀刻区域由于多个色谱柱之间的空隙而增加。 此外,该方法不会限制上述衬底的材料。

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