公开(公告)号：US20220234163A1

公开(公告)日：2022-07-28

申请号：US17716941

申请日：2022-04-08

Applicant: Applied Materials, Inc.

Inventor： Jimin Zhang ,  Jianshe Tang ,  Brian J. Brown ,  Wei Lu ,  PrIscilla Diep

IPC: B24B37/005 ,  H01L21/321 ,  H01L21/306

Abstract: A method of chemical mechanical polishing includes rotating a polishing pad about an axis of rotation, positioning a substrate against the polishing pad, the polishing pad having a groove that is concentric with the axis of rotation, oscillating the substrate laterally across the polishing pad such that a central portion of the substrate and an edge portion of the substrate are positioned over a polishing surface of the polishing pad for a first duration, and holding the substrate substantially laterally fixed in a position such that the central portion of the substrate is positioned over the polishing surface of the polishing pad and the edge portion of the substrate is positioned over the groove for a second duration.

公开(公告)号：US20210331288A1

公开(公告)日：2021-10-28

申请号：US17371032

申请日：2021-07-08

Applicant: Applied Materials, Inc.

Inventor： Yen-Chu Yang ,  Stephen Jew ,  Jianshe Tang ,  Haosheng Wu ,  Shou-Sung Chang ,  Paul D. Butterfield ,  Alexander John Fisher ,  Bum Jick Kim

IPC: B24B57/02 ,  B24B37/10 ,  H01L21/67

Abstract: An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface. The first barrier includes a solid first body having a first flat bottom surface and having a first leading surface configured to contact the used polishing liquid.

公开(公告)号：US20210154796A1

公开(公告)日：2021-05-27

申请号：US16953139

申请日：2020-11-19

Applicant: Applied Materials, Inc.

Inventor： Jimin Zhang ,  Jianshe Tang ,  Brian J. Brown ,  Wei Lu ,  PrIscilla Diep

IPC: B24B37/26 ,  B24B37/27 ,  B24B37/04 ,  B24B37/005

Abstract: A chemical mechanical polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, and a controller. The polishing pad has a polishing control groove. The carrier is laterally movable by a first actuator across the polishing pad and rotatable by a second actuator. The controller synchronizes lateral oscillation of the carrier head with rotation of the carrier head such that over a plurality of successive oscillations of the carrier head such that when a first angular swath of an edge portion of the substrate is at an azimuthal angular position about an axis of rotation of the carrier head the first angular swath overlies the polishing surface and when a second angular swath of the edge portion of the substrate is at the azimuthal angular position the second angular swath overlies the polishing control groove.

公开(公告)号：US20210046602A1

公开(公告)日：2021-02-18

申请号：US16831436

申请日：2020-03-26

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Hari Soundararajan ,  Jianshe Tang ,  Shou-Sung Chang ,  Brian J. Brown ,  Yen-Chu Yang ,  You Wang ,  Rajeev Bajaj

IPC: B24B37/015 ,  B24B55/03 ,  B24B37/10

Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of coolant, a dispenser having one or more apertures suspended over the platen to direct coolant from the source of coolant onto the polishing surface of the polishing pad; and a controller coupled to the source of coolant and configured to cause the source of coolant to deliver the coolant through the nozzles onto the polishing surface during a selected step of a polishing operation.

公开(公告)号：US20160256978A1

公开(公告)日：2016-09-08

申请号：US14639859

申请日：2015-03-05

Applicant: Applied Materials, Inc.

Inventor： Jianshe Tang ,  David Masayuki Ishikawa ,  Benjamin Cherian ,  Jeonghoon Oh ,  Thomas H. Osterheld

IPC: B24B37/013 ,  B24B49/00

CPC classification number: B24B37/013 ,  B24B49/003

Abstract: A chemical mechanical polishing apparatus includes a platen to support a polishing pad, and an in-situ acoustic emission monitoring system including an acoustic emission sensor supported by the platen, a waveguide configured to extending through at least a portion of the polishing pad, and a processor to receive a signal from the acoustic emission sensor. The in-situ acoustic emission monitoring system is configured to detect acoustic events caused by deformation of the substrate and transmitted through the waveguide, and the processor is configured to determine a polishing endpoint based on the signal.

Abstract translation: 化学机械抛光装置包括用于支撑抛光垫的压板，以及包括由压板支撑的声发射传感器的原位声发射监测系统，配置成延伸穿过抛光垫的至少一部分的波导，以及 处理器以从声发射传感器接收信号。 原位声发射监测系统被配置为检测由基板的变形引起的并通过波导传播的声学事件，并且处理器被配置为基于该信号来确定抛光端点。

公开(公告)号：US20250114909A1

公开(公告)日：2025-04-10

申请号：US18481761

申请日：2023-10-05

Applicant: Applied Materials, Inc.

Inventor： Priscilla Diep LaRosa ,  Chih Chung Chou ,  Haosheng Wu ,  Taketo Sekine ,  Chen-Wei Chang ,  Elton Zhong ,  Jianshe Tang ,  Songling Shin

IPC: B24B55/03 ,  B24B37/015 ,  B24B37/20

Abstract: A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a polishing liquid dispenser having a polishing liquid port positioned over the platen to deliver polishing liquid onto the polishing pad, a temperature control system including coolant liquid fluid reservoirs for containing coolant fluids, a thermal controller configured to control the temperature of the coolant fluid within the coolant fluid reservoirs, and a first dispenser having openings in fluid connection with the coolant fluid reservoirs, the openings positioned configured to spray an aerosolized coolant liquid directly onto the polishing pad, and a second dispenser having a coolant port in fluid connection with the coolant fluid reservoirs, the coolant port positioned over the platen and configured to flow a stream of coolant liquid directly onto the polishing pad.

公开(公告)号：US20240342855A1

公开(公告)日：2024-10-17

申请号：US18632044

申请日：2024-04-10

Applicant: Applied Materials, Inc.

Inventor： Chad Pollard ,  Sih-Ling Yeh ,  Jonathan P. Domin ,  Shou-Sung Chang ,  Haosheng Wu ,  Jeonghoon Oh ,  Jianshe Tang

IPC: B24B37/015 ,  B24B37/04

CPC classification number: B24B37/015 ,  B24B37/04

Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, a motor to generate relative motion, a steam generator, and an arm extending over the platen with and at least one opening to deliver steam from the steam generator onto the polishing pad. The steam generator includes a canister, a barrier in the canister dividing the canister into a lower chamber having a water inlet and an upper chamber having a steam outlet, a heating element configured to apply heat to a portion of lower chamber, and a nucleation surface positioned in the lower chamber. The barrier has apertures for steam to pass from the lower chamber to the upper chamber and allows for condensation to pass from the upper chamber to the lower chamber.

公开(公告)号：US20240139900A1

公开(公告)日：2024-05-02

申请号：US18101025

申请日：2023-01-24

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon Oh ,  Jianshe Tang ,  Steven M. Zuniga ,  Brian J. Brown ,  Andrew J. Nagengast ,  Derek R. Witty ,  Rushabhkumar Desai ,  Shih-Haur Shen ,  Haosheng Wu ,  Yufei Hu

IPC: B24B37/005 ,  B24B37/04

CPC classification number: B24B37/005 ,  B24B37/042

Abstract: A chemical mechanical polishing apparatus has a platen to support a polishing pad, a carrier head comprising a rigid housing and configured to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier head so as to polish the substrate, an in-situ carrier head monitoring system including a sensor positioned to interact with the housing and to detect vibrational motion of the housing and generate signals based on the detected vibrational motion, and a controller. The controller is configured to generate a value for a carrier head status parameter based on received signals from the in-situ carrier head monitoring system, and change a polishing parameter or generate an alert based on the carrier head status parameter.

公开(公告)号：US20240042570A1

公开(公告)日：2024-02-08

申请号：US18358563

申请日：2023-07-25

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Shou-Sung Chang ,  Jianshe Tang ,  Jonathan P. Domin ,  Shuchivrat Datar ,  Yasuhiro Hori ,  Sameer Deshpande ,  Chad Pollard ,  Sih-Ling Yeh ,  Priscilla Diep ,  Ningzhuo Cui ,  Brian J. Brown ,  Hui Chen

IPC: B24B37/015

CPC classification number: B24B37/015

Abstract: A chemical mechanical polishing apparatus has a heating system, a purge gas source, a purge liquid source, and a controller. The heating system includes a source of heated gas, an arm extending over a platen, and a manifold in the arm with an a plurality of openings positioned over the platen and separated from a polishing pad for delivering the heated gas onto the polishing pad. The controller is configured to cause the heated gas to flow from the source of heated gas through the manifold and the plurality of openings to heat the polishing pad during a polishing operation, and to cause the apparatus to perform a purging operation which alternates between flowing purge gas from the purge gas source and flowing purge liquid from the purge liquid source through the manifold and the plurality of openings.

公开(公告)号：US11787008B2

公开(公告)日：2023-10-17

申请号：US17127065

申请日：2020-12-18

Applicant: Applied Materials, Inc.

Inventor： Xingfeng Wang ,  Jianshe Tang ,  Feng Q. Liu ,  David M. Gage ,  Stephen Jew

IPC: B24B37/04 ,  B24B57/02 ,  B24B37/20 ,  B24B37/10

CPC classification number: B24B37/046 ,  B24B37/105 ,  B24B37/20 ,  B24B57/02

Abstract: A polishing station for polishing a substrate using a polishing slurry is disclosed. The polishing station includes a substrate carrier having a substrate-receiving surface and a rotatable platen having a polishing pad disposed on a platen surface, where the polishing pad has a polishing surface facing the substrate-receiving surface. The polishing station includes an electromagnetic assembly disposed over the platen surface. The electromagnetic assembly includes an array of electromagnetic devices that are each operable to generate a magnetic field that is configured to pass through the polishing surface. The magnetic fields generated by the array of electromagnetic devices are oriented and configured to induce an electromagnetic force on a plurality of charged particles disposed in a polishing slurry disposed on the polishing surface. The applied magnetic field is configured to induce movement of the plurality of charged particles in a direction parallel or orthogonal to the polishing surface.