公开(公告)号：USD725168S1

公开(公告)日：2015-03-24

申请号：US29493834

申请日：2014-06-13

Applicant: ASM IP Holding B.V.

Designer： Takayuki Yamagishi ,  Naoto Tsuji ,  Kazuo Sato

公开(公告)号：USD753269S1

公开(公告)日：2016-04-05

申请号：US29514264

申请日：2015-01-09

Applicant: ASM IP Holding B.V.

Designer： Takayuki Yamagishi ,  Kazuo Sato ,  Naoto Tsuji

公开(公告)号：US09018093B2

公开(公告)日：2015-04-28

申请号：US13749878

申请日：2013-01-25

Applicant: ASM IP Holding B.V.

Inventor： Naoto Tsuji ,  Fumitaka Shoji

IPC: H01L21/31 ,  H01L21/469 ,  H01L21/4763 ,  H01L21/02 ,  H01L21/311 ,  H01L21/3205 ,  H01L21/3213 ,  C23C16/30 ,  C23C16/455

CPC classification number: H01L21/02274 ,  C23C16/30 ,  C23C16/45523 ,  C23C16/45557 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/02211 ,  H01L21/31116 ,  H01L21/32055 ,  H01L21/32134 ,  H01L21/32137 ,  H01L21/76832

Abstract: A method for forming a layer constituted by repeated stacked layers includes: forming a first layer and a second layer on a substrate under different deposition conditions to form a stacked layer, wherein the film stresses of the first and second layers are tensile or compressive and opposite to each other, and the wet etch rates of the first and second layers are at least 50 times different from each other; and repeating the above step to form a layer constituted by repeated stacked layers, wherein the deposition conditions for forming at least one stacked layer are different from those for forming another stacked layer.

Abstract translation: 用于形成由重复堆叠层构成的层的方法包括：在不同沉积条件下在衬底上形成第一层和第二层以形成堆叠层，其中第一层和第二层的膜应力是拉伸的或压缩的和相反的 并且第一和第二层的湿蚀刻速率彼此至少是50次不同; 并重复上述步骤以形成由重复堆叠层构成的层，其中用于形成至少一层叠层的沉积条件与用于形成另一层叠层的沉积条件不同。

公开(公告)号：USD724701S1

公开(公告)日：2015-03-17

申请号：US29481312

申请日：2014-02-04

Applicant: ASM IP Holding B.V.

Designer： Takayuki Yamagishi ,  Kazuo Sato ,  Naoto Tsuji

公开(公告)号：US20140116335A1

公开(公告)日：2014-05-01

申请号：US13665366

申请日：2012-10-31

Applicant: ASM IP HOLDING B.V.

Inventor： Naoto Tsuji ,  Yasushi Fukasawa

IPC: H01L21/02

CPC classification number: C23C16/4405 ,  B08B7/0057 ,  C23C16/482 ,  H01J37/32862 ,  H01L21/02348 ,  H01L21/67115

Abstract: A UV irradiation apparatus for processing a semiconductor substrate includes: a UV lamp unit; a reaction chamber disposed under the UV lamp unit; a gas ring with nozzles serving as a first electrode between the UV lamp unit and the reaction chamber; a transmission window supported by the gas ring; an RF shield which covers a surface of the transmission window facing the UV lamp unit; a second electrode disposed in the reaction chamber for generating a plasma between the first and second electrodes; and an RF power source for supplying RF power to one of the first or second electrode.

Abstract translation: 一种用于处理半导体衬底的UV照射设备包括：UV灯单元; 设置在所述UV灯单元下方的反应室; 具有用作UV灯单元和反应室之间的第一电极的喷嘴的气环; 由气环支撑的透射窗; 覆盖面向UV灯单元的透射窗的表面的RF屏蔽; 设置在所述反应室中的用于在所述第一和第二电极之间产生等离子体的第二电极; 以及用于向第一或第二电极之一提供RF功率的RF电源。

公开(公告)号：US20230253232A1

公开(公告)日：2023-08-10

申请号：US18106635

申请日：2023-02-07

Applicant: ASM IP Holding B.V.

Inventor： Naoto Tsuji

IPC: H01L21/683 ,  H01J37/32 ,  C23C16/509 ,  C23C16/46 ,  C23C16/458 ,  C23C16/455

CPC classification number: H01L21/6833 ,  H01J37/32568 ,  H01J37/3255 ,  H01J37/32165 ,  H01J37/32724 ,  C23C16/509 ,  C23C16/46 ,  C23C16/4586 ,  C23C16/45536 ,  H01J2237/2007 ,  H01J2237/332

Abstract: [Problem] A substrate treatment apparatus that can protect an AC power supply connected to a heater is provided.
[Means for solving the problem] A substrate treatment apparatus includes a lower electrode formed of a dielectric, a first AC power supply that is connected to a first internal electrode included in the lower electrode and supplies AC power with a first frequency, a heater included in the lower electrode to heat the lower electrode, a filter circuit connected to the heater, and a second AC power supply connected to the heater via the filter circuit and used for the heater, in which the filter circuit includes a parallel circuit that connects a low-pass filter with a cut-off frequency that is lower than the first frequency and a high-pass filter with a cut-off frequency that is higher than the first frequency in parallel.

公开(公告)号：US20220259731A1

公开(公告)日：2022-08-18

申请号：US17670030

申请日：2022-02-11

Applicant: ASM IP Holding B.V.

Inventor： Naoto Tsuji

IPC: C23C16/455 ,  H01L21/67 ,  H01L21/20

Abstract: Examples of a substrate processing apparatus includes a chamber, a susceptor provided in the chamber, a shower head provided above the susceptor, and a flow control ring having a shape to surround the susceptor, the flow control ring having a first top surface and a second top surface that has an annular shape and is provided closer to an inner edge of the flow control ring than the first top surface at a higher level than the first top surface, the second top surface being a sloped surface whose height decreases toward the first top surface.

公开(公告)号：US10435789B2

公开(公告)日：2019-10-08

申请号：US15370834

申请日：2016-12-06

Applicant: ASM IP Holding B.V.

Inventor： Naoto Tsuji ,  Takuya Suguri ,  Yozo Ikedo

IPC: H01L21/00 ,  C23C16/00 ,  C23C16/50 ,  H01J37/00 ,  H01L21/683 ,  C23C16/503

Abstract: A substrate treatment apparatus includes a lower electrode, an upper electrode, a first AC power supply that is connected to the upper electrode and supplies AC power at a first frequency, a second AC power supply that is connected to the upper electrode and supplies AC power at a second frequency which is lower than the first frequency, an internal electrode provided in the lower electrode, a filter circuit connected to the internal electrode, and a DC power supply connected to the internal electrode via the filter circuit. The filter circuit includes a first filter circuit that becomes low impedance with respect to AC power at the first frequency compared to AC power at the second frequency, and a second filter circuit that becomes low impedance with respect to AC power at the second frequency compared to AC power at the first frequency.

公开(公告)号：US09370863B2

公开(公告)日：2016-06-21

申请号：US14172220

申请日：2014-02-04

Applicant: ASM IP Holding B.V.

Inventor： Naoto Tsuji ,  Takayuki Yamagishi

IPC: B25J15/00 ,  H01L21/677 ,  B23Q7/00 ,  H01L21/687

CPC classification number: B25J15/0014 ,  H01L21/67742 ,  H01L21/68707 ,  Y10T29/49998

Abstract: An anti-slip end-effector for transporting a workpiece, which is configured to be attached to a robotic arm, includes: a workpiece-supporting area for placing a workpiece thereon for transportation; at least one front protrusion disposed at a distal end of the workpiece-supporting area for engaging an edge of the workpiece to restrict movement of the workpiece placed on the workpiece-supporting area beyond the front protrusion; and at least one anti-slip protrusion disposed in the workpiece-supporting area for contacting and supporting the backside of the workpiece, said anti-slip protrusion having a top face having a static friction coefficient of 1.0 or more as measured against the backside of the workpiece, and having a surface roughness of less than 0.4 μm.

Abstract translation: 一种用于运送工件的防滑端部执行器，其构造成附接到机器人手臂，包括：工件支撑区域，用于将工件放置在其上用于运输; 至少一个前突起，其设置在所述工件支撑区域的远端处，用于接合所述工件的边缘以限制放置在所述工件支撑区域上的所述工件的运动超过所述前突起; 以及设置在所述工件支撑区域中用于接触和支撑所述工件的后侧的至少一个防滑突起，所述防滑突起具有的顶面具有1.0或更大的静摩擦系数， 工件，表面粗糙度小于0.4μm。

公开(公告)号：US20150217456A1

公开(公告)日：2015-08-06

申请号：US14172220

申请日：2014-02-04

Applicant: ASM IP Holding B.V.

Inventor： Naoto Tsuji ,  Takayuki Yamagishi

IPC: B25J15/00 ,  H01L21/677 ,  B25J11/00

CPC classification number: B25J15/0014 ,  H01L21/67742 ,  H01L21/68707 ,  Y10T29/49998

Abstract: An anti-slip end-effector for transporting a workpiece, which is configured to be attached to a robotic arm, includes: a workpiece-supporting area for placing a workpiece thereon for transportation; at least one front protrusion disposed at a distal end of the workpiece-supporting area for engaging an edge of the workpiece to restrict movement of the workpiece placed on the workpiece-supporting area beyond the front protrusion; and at least one anti-slip protrusion disposed in the workpiece-supporting area for contacting and supporting the backside of the workpiece, said anti-slip protrusion having a top face having a static friction coefficient of 1.0 or more as measured against the backside of the workpiece, and having a surface roughness of less than 0.4 μm.

Abstract translation: 一种用于运送工件的防滑端部执行器，其构造成附接到机器人手臂，包括：工件支撑区域，用于将工件放置在其上用于运输; 至少一个前突起，其布置在所述工件支撑区域的远端处，用于接合所述工件的边缘，以限制放置在所述工件支撑区域上的所述工件的移动超过所述前突出部; 以及设置在所述工件支撑区域中用于接触和支撑所述工件的后侧的至少一个防滑突起，所述防滑突起具有的顶面具有1.0或更大的静摩擦系数， 工件，表面粗糙度小于0.4μm。