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    Current sensor isolation
    11.
    发明授权
    Current sensor isolation 有权

    公开(公告)号：US10345343B2

    公开(公告)日：2019-07-09

    申请号：US15179147

    申请日：2016-06-10

    Applicant: Allegro MicroSystems, LLC

    Inventor： Shaun D. Milano ,  Shixi Louis Liu

    IPC: H01L29/82 ,  H01L43/04 ,  G01R15/20 ,  H01L43/06 ,  H01L43/08 ,  G01R19/00 ,  G01R33/00 ,  G01R33/09 ,  H01L21/48 ,  H01L43/02 ,  G01R33/07 ,  H01L23/00 ,  H01L23/495

    Abstract: A current sensor integrated circuit includes a lead frame having a primary conductor and at least one secondary lead, a semiconductor die disposed adjacent to the primary conductor, an insulation structure disposed between the primary conductor and the semiconductor die, and a non-conductive insulative material enclosing the semiconductor die, the insulation structure, a first portion of the primary conductor, and a first portion of the at least one secondary lead to form a package. The first portion of the at least one secondary lead (between a first end proximal to the primary conductor and a second end proximal to the second, exposed portion of the at least one secondary lead) has a thickness that is less than a thickness of the second, exposed portion of the least one secondary lead. A distance between the second, exposed portion of the primary conductor and the second, exposed portion of the at least one secondary lead is at least 7.2 mm.

    SENSOR PACKAGE AND SYSTEM
    14.
    发明公开
    SENSOR PACKAGE AND SYSTEM 审中-公开

    公开(公告)号：US20240003995A1

    公开(公告)日：2024-01-04

    申请号：US17810353

    申请日：2022-07-01

    Applicant: Allegro MicroSystems, LLC

    Inventor： Simon E. Rock ,  Georges El Bacha ,  Shaun D. Milano ,  Loïc André Messier ,  Alexander Latham ,  Maxwell McNally ,  Shixi Louis Liu

    IPC: G01R33/06 ,  G01R19/00 ,  H05K1/18

    CPC classification number: G01R33/06 ,  G01R19/0092 ,  H05K1/181 ,  H05K2201/10151

    Abstract: A current sensor IC includes a lead frame having a die attach pad and elongated leads extending in a single direction with respect to the die attach pad, a semiconductor die having a first surface attached to the die attach pad and a second, opposing surface supporting magnetic field sensing elements, and a non-conductive mold material. A first portion of the mold material encloses the semiconductor die and the die attach pad, a second portion of the mold material encloses a portion of the elongated leads, and the mold material further includes a wing structure between the first portion and the second portion. In assembly, the first portion of the mold material extends into a cutout through a current conductor and the wing structure abuts a surface of the conductor. The current sensor can implement differential sensing based on signals from at least two magnetic field sensing elements.

    Current sensor integrated circuit with a dual gauge lead frame
    15.
    发明授权
    Current sensor integrated circuit with a dual gauge lead frame 有权

    公开(公告)号：US11768230B1

    公开(公告)日：2023-09-26

    申请号：US17657135

    申请日：2022-03-30

    Applicant: Allegro MicroSystems, LLC

    Inventor： Shixi Louis Liu ,  Maxwell McNally ,  Alexander Latham

    IPC: G01R15/20 ,  H10N52/01 ,  H10N52/80 ,  H10N52/00

    CPC classification number: G01R15/207 ,  H10N52/01 ,  H10N52/101 ,  H10N52/80

    Abstract: A current sensor IC includes a unitary lead frame having a primary conductor with a first thickness and a secondary lead having a second thickness less than the first thickness. A semiconductor die adjacent to the primary conductor includes a magnetic field sensing circuit to sense a magnetic field associated with the current and generate a secondary signal indicative of the current. An insulation structure is disposed between the primary conductor and the die. A mold material encloses a first portion of the secondary lead and a second portion of the secondary lead that is exposed outside of the package has the second thickness. A method of manufacturing a current sensor IC includes providing a unitary lead frame sheet having a first thickness, decreasing a thickness of a portion of the sheet to provide a first portion with the first thickness and a second portion with a smaller thickness, and stamping the sheet to form a repeating lead frame pattern, with each pattern including a primary conductor formed from the first portion and secondary leads formed from the second portion.

    Power module package and packaging techniques
    16.
    发明授权
    Power module package and packaging techniques 有权

    公开(公告)号：US11183436B2

    公开(公告)日：2021-11-23

    申请号：US16746275

    申请日：2020-01-17

    Applicant: Allegro MicroSystems, LLC

    Inventor： Shixi Louis Liu ,  Natasha Healey ,  Rishikesh Nikam

    IPC: H01L23/495 ,  H01L23/31 ,  H01L27/07

    Abstract: A power integrated circuit (IC) includes a lead frame comprising a signal lead, a power lead, and a paddle attached to one or more of the signal lead and the power lead, an electrical component supported by the paddle, and a mold material configured to enclose a portion of the lead frame and expose a surface of the paddle, wherein the power lead has a first portion extending from an edge of the mold material outside of the mold material in a first direction and a second portion enclosed by the mold material and extending from the edge of the mold material inside the mold material in a second direction to the paddle, wherein the second direction is substantially opposite to the first direction. In embodiments, the paddle is only attached to the second portion of the power lead. The first and second portions of the power lead meet at a junction between a first portion of the mold material and a second portion of the mold material, the junction positioned on a side surface of the mold material that extends from a first surface to a substantially parallel second surface of the mold material.

    Sensor package and system
    19.
    发明授权
    Sensor package and system 有权

    公开(公告)号：US12282075B2

    公开(公告)日：2025-04-22

    申请号：US17810353

    申请日：2022-07-01

    Applicant: Allegro MicroSystems, LLC

    Inventor： Simon E. Rock ,  Georges El Bacha ,  Shaun D. Milano ,  Loïc André Messier ,  Alexander Latham ,  Maxwell McNally ,  Shixi Louis Liu

    IPC: G01R33/06 ,  G01R19/00 ,  H05K1/18

    Abstract: A current sensor IC includes a lead frame having a die attach pad and elongated leads extending in a single direction with respect to the die attach pad, a semiconductor die having a first surface attached to the die attach pad and a second, opposing surface supporting magnetic field sensing elements, and a non-conductive mold material. A first portion of the mold material encloses the semiconductor die and the die attach pad, a second portion of the mold material encloses a portion of the elongated leads, and the mold material further includes a wing structure between the first portion and the second portion. In assembly, the first portion of the mold material extends into a cutout through a current conductor and the wing structure abuts a surface of the conductor. The current sensor can implement differential sensing based on signals from at least two magnetic field sensing elements.

    Packaged current sensor integrated circuit
    20.
    发明授权
    Packaged current sensor integrated circuit 有权

    公开(公告)号：US12163983B2

    公开(公告)日：2024-12-10

    申请号：US18053480

    申请日：2022-11-08

    Applicant: Allegro MicroSystems, LLC

    Inventor： Shixi Louis Liu ,  Robert A. Briano ,  Natasha Healey

    IPC: G01R15/20 ,  G01R19/00 ,  H01L21/66 ,  H01L23/495

    Abstract: A packaged current sensor integrated circuit includes a primary conductor having an input portion and an output portion configured to carry a current to be measured by one or more magnetic sensing elements supported by a semiconductor die adjacent to the primary conductor. A method of fabricating the packaged current sensor integrated circuit includes partially encasing the lead frame in a first mold material, applying an insulator to one or more die attach pads, attaching a die to the insulator, electrically connecting the die to secondary leads, and providing a second mold to the subassembly. The package is configured to provide increased voltage isolation.

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