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11.发明授权Power semiconductor component with charge compensation structure and method for the fabrication thereof 有权具有电荷补偿结构的功率半导体元件及其制造方法公开(公告)号：US07554137B2
公开(公告)日：2009-06-30
申请号：US11552804
申请日：2006-10-25
申请人： Stefan Sedlmaier , Hans-Joachim Schulze , Anton Mauder , Helmut Strack , Armin Willmeroth , Frank Pfirsch
发明人： Stefan Sedlmaier , Hans-Joachim Schulze , Anton Mauder , Helmut Strack , Armin Willmeroth , Frank Pfirsch
IPC分类号： H01L29/732 , H01L29/423
CPC分类号： H01L29/7811 , H01L21/2205 , H01L21/2252 , H01L21/2255 , H01L23/291 , H01L23/298 , H01L29/0634 , H01L29/0661 , H01L29/1095 , H01L29/1604 , H01L29/1608 , H01L29/165 , H01L29/66712 , H01L29/7802 , H01L29/7813 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor component (1) with charge compensation structure (3) has a semiconductor body (4) having a drift path (5) between two electrodes (6, 7). The drift path (5) has drift zones of a first conduction type, which provide a current path between the electrodes (6, 7) in the drift path, while charge compensation zones (11) of a complementary conduction type constrict the current path of the drift path (5). For this purpose, the drift path (5) has two alternately arranged, epitaxially grown diffusion zone types (9, 10), the first drift zone type (9) having monocrystalline semiconductor material on a monocrystalline substrate (12), and a second drift zone type (10) having monocrystalline semiconductor material in a trench structure (13), with complementarily doped walls (14, 15), the complementarily doped walls (14, 15) forming the charge compensation zones (11).
摘要翻译： 具有电荷补偿结构（3）的半导体部件（1）具有在两个电极（6,7）之间具有漂移路径（5）的半导体本体（4）。 漂移路径（5）具有第一导电类型的漂移区，其在漂移路径中的电极（6,7）之间提供电流路径，而互补导电类型的电荷补偿区域（11） 漂移路径（5）。 为此，漂移路径（5）具有两个交替布置的外延生长的扩散区类型（9,10），在单晶衬底（12）上具有单晶半导体材料的第一漂移区类型（9）和第二漂移 在沟槽结构（13）中具有单晶半导体材料的具有互补掺杂壁（14,15）的区域型（10），形成电荷补偿区（11）的互补掺杂壁（14,15）。
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12.发明申请Power Semiconductor Component With Charge Compensation Structure And Method For The Fabrication Thereof 有权具有电荷补偿结构的功率半导体元件及其制造方法公开(公告)号：US20070108512A1
公开(公告)日：2007-05-17
申请号：US11552804
申请日：2006-10-25
申请人： Stefan Sedlmaier , Hans-Joachim Schulze , Anton Mauder , Helmut Strack , Armin Willmeroth , Frank Pfirsch
发明人： Stefan Sedlmaier , Hans-Joachim Schulze , Anton Mauder , Helmut Strack , Armin Willmeroth , Frank Pfirsch
IPC分类号： H01L29/76 , H01L21/336
CPC分类号： H01L29/7811 , H01L21/2205 , H01L21/2252 , H01L21/2255 , H01L23/291 , H01L23/298 , H01L29/0634 , H01L29/0661 , H01L29/1095 , H01L29/1604 , H01L29/1608 , H01L29/165 , H01L29/66712 , H01L29/7802 , H01L29/7813 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to a power semiconductor component (1) with charge compensation structure (3) and a method for the fabrication thereof. For this purpose, the power semiconductor component (1) has a semiconductor body (4) having a drift path (5) between two electrodes (6, 7). The drift path (5) has drift zones of a first conduction type, which provide a current path between the electrodes (6, 7) in the drift path, while charge compensation zones (11) of a complementary conduction type constrict the current path of the drift path (5). For this purpose, the drift path (5) has two alternately arranged, epitaxially grown diffusion zone types (9, 10), the first drift zone type (9) having monocrystalline semiconductor material on a monocrystalline substrate (12), and a second drift zone type (10) having monocrystalline semiconductor material in a trench structure (13), with complementarily doped walls (14, 15), the complementarily doped walls (14, 15) forming the charge compensation zones (11).
摘要翻译： 本发明涉及具有电荷补偿结构（3）的功率半导体元件（1）及其制造方法。 为此，功率半导体部件（1）具有在两个电极（6,7）之间具有漂移路径（5）的半导体本体（4）。 漂移路径（5）具有第一导电类型的漂移区，其在漂移路径中的电极（6,7）之间提供电流路径，而互补导电类型的电荷补偿区域（11） 漂移路径（5）。 为此，漂移路径（5）具有两个交替布置的外延生长的扩散区类型（9,10），在单晶衬底（12）上具有单晶半导体材料的第一漂移区类型（9）和第二漂移 在沟槽结构（13）中具有单晶半导体材料的具有互补掺杂壁（14,15）的区域型（10），形成电荷补偿区（11）的互补掺杂壁（14,15）。
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公开(公告)号：US20050116249A1
公开(公告)日：2005-06-02
申请号：US10971572
申请日：2004-10-22
申请人： Anton Mauder , Frank Hille , Vytla Krishna , Elmar Falck , Hans-Joachim Schulze , Franz-Josef Niedernostheide , Helmut Strack
发明人： Anton Mauder , Frank Hille , Vytla Krishna , Elmar Falck , Hans-Joachim Schulze , Franz-Josef Niedernostheide , Helmut Strack
IPC分类号： H01L21/329 , H01L29/32 , H01L29/861 , H01L21/00
CPC分类号： H01L21/263 , H01L29/32 , H01L29/6609 , H01L29/861
摘要： A semiconductor diode (30) has an anode (32), a cathode (33) and a semiconductor volume (31) provided between the anode (32) and the cathode (33). An electron mobility and/or hole mobility within a zone (34) of the semiconductor volume (31) that is situated in front of the cathode (33) is reduced relative to the rest of the semiconductor volume (31).
摘要翻译： 半导体二极管（30）具有设置在阳极（32）和阴极（33）之间的阳极（32），阴极（33）和半导体体积（31）。 位于阴极（33）前方的半导体体积（31）的区域（34）内的电子迁移率和/或空穴迁移率相对于半导体体积（31）的其余部分减小。
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公开(公告)号：US08541833B2
公开(公告)日：2013-09-24
申请号：US13082679
申请日：2011-04-08
CPC分类号： H01L21/823487 , H01L27/0694 , H01L27/1207 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor component includes a sequence of layers, the sequence of layers including a first insulator layer, a first semiconductor layer disposed on the first insulator layer, a second insulator layer disposed on the first semiconductor layer, and a second semiconductor layer disposed on the second insulator layer. The semiconductor component also includes a plurality of devices at least partly formed in the first semiconductor layer. A first one of the plurality of devices is a power transistor formed in a first region of the first semiconductor layer and a first region of the second semiconductor layer. The first region of the first and second semiconductor layers are in electrical contact with one another through a first opening in the second insulator layer.
摘要翻译： 半导体部件包括一层层，所述层序列包括第一绝缘体层，设置在第一绝缘体层上的第一半导体层，设置在第一半导体层上的第二绝缘体层，以及设置在第二绝缘体层上的第二半导体层 绝缘体层。 半导体部件还包括至少部分地形成在第一半导体层中的多个器件。 多个器件中的第一个是在第一半导体层的第一区域和第二半导体层的第一区域中形成的功率晶体管。 第一和第二半导体层的第一区域通过第二绝缘体层中的第一开口彼此电接触。
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15.发明授权Capacitor structure in trench structures of semiconductor devices and semiconductor devices comprising capacitor structures of this type and methods for fabricating the same 有权包括这种类型的电容器结构的半导体器件和半导体器件的沟槽结构中的电容器结构及其制造方法公开(公告)号：US08187947B2
公开(公告)日：2012-05-29
申请号：US12827035
申请日：2010-06-30
IPC分类号： H01L21/02
CPC分类号： H01L29/66181 , H01L27/10861 , H01L28/82
摘要： A capacitor structure in trench structures of a semiconductor device includes conductive regions made of metallic and/or semiconducting materials. The conducting regions are surrounded by a dielectric and form stacked layers in the trench structure of the semiconductor device.
摘要翻译： 半导体器件的沟槽结构中的电容器结构包括由金属和/或半导体材料制成的导电区域。 导电区域被电介质包围，并在半导体器件的沟槽结构中形成叠层。
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公开(公告)号：US20110147883A1
公开(公告)日：2011-06-23
申请号：US12646503
申请日：2009-12-23
IPC分类号： H01L27/12 , H01L21/762
CPC分类号： H01L29/0649 , H01L21/0237 , H01L21/02642 , H01L21/02647 , H01L21/31144 , H01L21/74 , H01L21/76224 , H01L21/7624 , H01L21/76248 , H01L21/76283
摘要： Disclosed is a method for forming a buried material layer in a semiconductor body, and a semiconductor arrangement including a buried material layer.
摘要翻译： 公开了一种在半导体本体中形成掩埋材料层的方法，以及包括掩埋材料层的半导体装置。
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公开(公告)号：US07511353B2
公开(公告)日：2009-03-31
申请号：US10971572
申请日：2004-10-22
申请人： Anton Mauder , Frank Hille , Vytla Rajeev Krishna , Elmar Falck , Hans-Joachim Schulze , Franz-Josef Niedernostheide , Helmut Strack
发明人： Anton Mauder , Frank Hille , Vytla Rajeev Krishna , Elmar Falck , Hans-Joachim Schulze , Franz-Josef Niedernostheide , Helmut Strack
IPC分类号： H01L29/72
CPC分类号： H01L21/263 , H01L29/32 , H01L29/6609 , H01L29/861
摘要： A semiconductor diode (30) has an anode (32), a cathode (33) and a semiconductor volume (31) provided between the anode (32) and the cathode (33). An electron mobility and/or hole mobility within a zone (34) of the semiconductor volume (31) that is situated in front of the cathode (33) is reduced relative to the rest of the semiconductor volume (31).
摘要翻译： 半导体二极管（30）具有设置在阳极（32）和阴极（33）之间的阳极（32），阴极（33）和半导体体积（31）。 位于阴极（33）前方的半导体体积（31）的区域（34）内的电子迁移率和/或空穴迁移率相对于半导体体积（31）的其余部分减小。
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公开(公告)号：US06441408B2
公开(公告)日：2002-08-27
申请号：US09761241
申请日：2001-01-17
申请人： Alfred Porst , Helmut Strack , Anton Mauder , Hans-Joachim Schulze , Heinrich Brunner , Josef Bauer , Reiner Barthelmess
发明人： Alfred Porst , Helmut Strack , Anton Mauder , Hans-Joachim Schulze , Heinrich Brunner , Josef Bauer , Reiner Barthelmess
IPC分类号： H01L3300
CPC分类号： H01L29/1016 , H01L29/7395 , H01L29/7455 , H01L29/749
摘要： A power semiconductor components has stop zones. In order to optimize the static and dynamic losses of the power semiconductor components, the stop zone is provided with donors which have at least one donor level which lies within the band gap of silicon and is at least 200 meV away from the conduction band edge of silicon.
摘要翻译： 功率半导体元件具有停止区域。 为了优化功率半导体部件的静态和动态损耗，停止区域具有供体，其具有位于硅的带隙内的至少一个施主电平，并且距离导电带边缘至少200meV 硅。
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公开(公告)号：US08288258B2
公开(公告)日：2012-10-16
申请号：US12769976
申请日：2010-04-29
IPC分类号： H01L21/306
CPC分类号： H01L21/26506 , H01L21/263 , H01L21/3242
摘要： A method for producing a semiconductor includes providing a p-doped semiconductor body having a first side and a second side; implanting protons into the semiconductor body via the first side to a target depth of the semiconductor body; bonding the first side of the semiconductor body to a carrier substrate; forming an n-doped zone in the semiconductor body by heating the semiconductor body such that a pn junction arises in the semiconductor body; and removing the second side of the semiconductor body at least as far as a space charge zone spanned at the pn junction.
摘要翻译： 一种制造半导体的方法包括提供具有第一侧和第二侧的p掺杂半导体本体; 通过第一侧将半导体本体中的质子注入半导体本体的目标深度; 将半导体主体的第一侧接合到载体基板; 通过加热所述半导体本体从而在半导体本体中形成pn结，形成半导体本体中的n掺杂区; 以及移除所述半导体本体的所述第二侧至少与在所述pn结处跨过的空间电荷区域一样远。
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20.发明授权Power semiconductor component with charge compensation structure and method for the fabrication thereof 有权具有电荷补偿结构的功率半导体元件及其制造方法公开(公告)号：US08263450B2
公开(公告)日：2012-09-11
申请号：US12350776
申请日：2009-01-08
申请人： Stefan Sedlmaier , Hans-Joachim Schulze , Anton Mauder , Helmut Strack , Armin Willmeroth , Frank Pfirsch
发明人： Stefan Sedlmaier , Hans-Joachim Schulze , Anton Mauder , Helmut Strack , Armin Willmeroth , Frank Pfirsch
IPC分类号： H01L21/00
CPC分类号： H01L29/7811 , H01L21/2205 , H01L21/2252 , H01L21/2255 , H01L23/291 , H01L23/298 , H01L29/0634 , H01L29/0661 , H01L29/1095 , H01L29/1604 , H01L29/1608 , H01L29/165 , H01L29/66712 , H01L29/7802 , H01L29/7813 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor component with charge compensation structure has a semiconductor body having a drift path between two electrodes. The drift path has drift zones of a first conduction type, which provide a current path between the electrodes in the drift path, while charge compensation zones of a complementary conduction type constrict the current path of the drift path. For this purpose, the drift path has two alternately arranged, epitaxially grown diffusion zone types, the first drift zone type having monocrystalline semiconductor material on a monocrystalline substrate, and a second drift zone type having monocrystalline semiconductor material in a trench structure, with complementarily doped walls, the complementarily doped walls forming the charge compensation zones.
摘要翻译： 具有电荷补偿结构的半导体部件具有在两个电极之间具有漂移路径的半导体本体。 漂移路径具有第一导电类型的漂移区域，其在漂移路径中的电极之间提供电流路径，而互补导电类型的电荷补偿区域限制漂移路径的电流路径。 为此，漂移路径具有两个交替布置的外延生长的扩散区类型，第一漂移区类型在单晶衬底上具有单晶半导体材料，以及在沟槽结构中具有单晶半导体材料的第二漂移区类型，具有互补掺杂 壁，形成电荷补偿区的互补掺杂壁。
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