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公开(公告)号：US10129979B2
公开(公告)日：2018-11-13
申请号：US15274302
申请日：2016-09-23
Applicant: Apple Inc.
Inventor： Albert Wang , Paul A. Martinez
IPC: H05K7/00 , H05K1/14 , H05K1/18 , H05K1/02 , H05K3/30 , H05K3/28 , H05K3/36 , H05K3/34 , H05K3/40 , H05K3/00
Abstract: Methods and devices related to the design and fabrication of molded cores for printed circuit board assemblies and system-on-package (SIP) devices are discussed. The discussed printed circuit board assemblies may have multiple electrical components embedded in a molded core matrix and forming electrical connections with one or more printed circuit boards attached to the molded core matrix. Methods for sourcing of electrical components and production of the molded cores and printed circuit board assemblies are also discussed. The methods and devices may increase a volumetric density of electrical components in printed circuit board assemblies and provide improved mechanical properties to the electrical circuit device.
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公开(公告)号：US20180092212A1
公开(公告)日：2018-03-29
申请号：US15702046
申请日：2017-09-12
Applicant: Apple Inc.
Inventor： Paul A. Martinez , Curtis C. Mead , Scott D. Morrison , Giancarlo F. De La Cruz , Lin Chen , Albert Wang , Brad W. Simeral
CPC classification number: H05K1/181 , H01F27/29 , H01G2/06 , H01G4/12 , H01G4/228 , H01G4/30 , H01G4/40 , H03H1/00 , H03H7/0115 , H03H7/38 , H03H2001/0085 , H05K3/3436 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/1006 , H05K2201/10515 , H05K2201/10636 , Y02P70/611 , Y02P70/613
Abstract: Methods and systems for producing circuitry using stackable passive components are discussed. More specifically, the present disclosure provides designs and fabrication methods for production of stackable devices that may be used as components in circuitry such as filters and impedance matching adaptors. Such components may be used to save space in printed circuit boards. Moreover, stackable passive components may be dual components, which may be improve the electrical performance in certain types of circuits such as matched component filters.
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公开(公告)号：US20230210392A1
公开(公告)日：2023-07-06
申请号：US17987429
申请日：2022-11-15
Applicant: Apple Inc.
Inventor： Motohide Hatanaka , Albert Wang , Wegene H. Tadele
IPC: A61B5/024 , A61B5/0245 , A61B5/00
CPC classification number: A61B5/02438 , A61B5/0245 , A61B5/681 , A61B5/02416 , A61B5/02444 , A61B5/6833 , A61B2562/0266 , A61B2562/0271
Abstract: Embodiments are directed to a patch for coupling a watch body to a body of a user. The patch can include a substrate formed from a flexible material and an adhesive disposed over a surface of the substrate and configured to couple the patch to the body of the user. The patch can include a watch-mounting component disposed over a surface of the substrate and configured to couple the watch body to the patch. The patch can include one or more sensing elements, each having a terminal configured to contact the user, an interface element configured to interface with a watch sensing element of the watch body, and a conduit operably coupling the first terminal to the first interface element. The sensing elements can transmit signals to the watch body and the watch body can determine a physiological measurement of the user using the first and second signals.
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14.发明公开公开(公告)号：US20230204506A1
公开(公告)日：2023-06-29
申请号：US18084342
申请日：2022-12-19
Applicant: Apple Inc.
Inventor： Chin San Han , Ueyn Block , Brian R. Land , Nevzat Akin Kestelli , Serhan Isikman , Albert Wang , Justin Shi
CPC classification number: G01N21/4738 , G01N21/55 , A61B5/0059 , A61B5/6898 , A61B5/7203 , G01N2201/068 , G01N2201/0638 , A61B2562/0233 , A61B5/02416
Abstract: A photoplethysmographic (PPG) device is disclosed. The PPG device can include one or more light emitters and one or more light sensors to generate the multiple light paths for measuring a PPG signal and perfusion indices of a user. The multiple light paths between each pair of light emitters and light detectors can include different separation distances to generate both an accurate PPG signal and a perfusion index value to accommodate a variety of users and usage conditions. In some examples, the multiple light paths can include the same separation distances for noise cancellation due to artifacts resulting from, for example, tilt and/or pull of the device, a user's hair, a user's skin pigmentation, and/or motion. The PPG device can further include one or more lenses and/or reflectors to increase the signal strength and/or and to obscure the optical components and associated wiring from being visible to a user's eye.
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公开(公告)号：US10424438B2
公开(公告)日：2019-09-24
申请号：US15275369
申请日：2016-09-24
Applicant: Apple Inc.
Inventor： Paul A. Martinez , Curtis C. Mead , Scott D. Morrison , Giancarlo F. De La Cruz , Lin Chen , Albert Wang , Brad W Simeral , Vu Vo , Wyeman Chen
Abstract: Systems and methods described in this disclosure are related to fabrication and utilization of two-terminal electrical components that may have terminations with reduced width. Components, such as the ones described herein may be used to increase the density of components in electrical devices, as they may reduce a separation distance between devices that lead to solder bridging. Methods for fabrication are also described, including the use of ceramic layers that may provide reduction in parasitic capacitance and/or inductances.
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Patent Agency Ranking
公开(公告)号：US20190075655A1
公开(公告)日：2019-03-07
申请号：US16184697
申请日：2018-11-08
Applicant: Apple Inc.
Inventor： Albert Wang , Paul A. Martinez
IPC: H05K1/14 , H05K1/02 , H05K3/00 , H05K3/40 , H05K3/34 , H05K3/36 , H05K3/28 , H05K3/30 , H05K1/18 , H05K3/46
Abstract: Methods and devices related to the design and fabrication of molded cores for printed circuit board assemblies and system-on-package (SIP) devices are discussed. The discussed printed circuit board assemblies may have multiple electrical components embedded in a molded core matrix and forming electrical connections with one or more printed circuit boards attached to the molded core matrix. Methods for sourcing of electrical components and production of the molded cores and printed circuit board assemblies are also discussed. The methods and devices may increase a volumetric density of electrical components in printed circuit board assemblies and provide improved mechanical properties to the electrical circuit device.
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公开(公告)号：US20170208710A1
公开(公告)日：2017-07-20
申请号：US15409260
申请日：2017-01-18
Applicant: Apple Inc.
Inventor： Albert Wang , Paul A. Martinez
CPC classification number: G06F1/1613 , G06F1/1656 , G06F1/1658 , G06F1/182 , G06F1/183 , H01R43/205 , H05K2201/0715 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/1006 , H05K2201/10636 , Y02P70/611
Abstract: The present disclosure relates to shield frames that reduce electromagnetic interference in electrical devices. The shield frames may be formed by coupling a shield frame lid to a ground connection of the circuit board through terminations in electrical components. The terminations in these electrical components thus may act both as a ground termination for the component as well as a ground connection for the shield frame. The components may be disposed in the perimeter of the circuit board to establish, with or without additional conductive posts, sections of the shield frame wall.
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公开(公告)号：US20170207024A1
公开(公告)日：2017-07-20
申请号：US15409217
申请日：2017-01-18
Applicant: Apple Inc.
Inventor： Paul A. Martinez , Gang Ning , Curtis C. Mead , Ming Y. Tsai , Albert Wang
CPC classification number: H01G4/30 , H01G2/06 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/35 , H01G4/40
Abstract: Methods and devices related to fabrication and utilization of multilayer capacitors presenting low equivalent series resistance (ESR) is illustrated. The capacitors may present electrodes that are coupled to metallic terminations at the bottom and/or at the side of the capacitor. The position of the electrode coupling may lead to smaller current paths in the MLCC electrode, which may decrease line inductances. Methods and systems for fabrication of the capacitors described are also discussed.
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公开(公告)号：US10811192B2
公开(公告)日：2020-10-20
申请号：US16146042
申请日：2018-09-28
Applicant: Apple Inc.
Inventor： Paul A. Martinez , Won Seop Choi , Gang Ning , Chirag V. Shah , Martin Schauer , Curtis C. Mead , Ming Yuan Tsai , Albert Wang
Abstract: Multilayer ceramic capacitor structures may include structural arrangements, materials, and/or substrate modifications that can improve the reliability of the capacitor for long-term usage when faced with environmental stress. Embodiments may implement reduced entryways in the termination patterns of the capacitor to decrease damage potential due to exposure of moisture. Embodiments may implement structures that decrease interfaces with different physical characteristics, which may lead to a reduction in the formation of micro-fractures during regular usage. Methods of manufacture for the features that improve reliability are also detailed.
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公开(公告)号：US20200105473A1
公开(公告)日：2020-04-02
申请号：US16146042
申请日：2018-09-28
Applicant: Apple Inc.
Inventor： Paul A. Martinez , Won Seop Choi , Gang Ning , Chirag V. Shah , Martin Schauer , Curtis C. Mead , Ming Yuan Tsai , Albert Wang
Abstract: Multilayer ceramic capacitor structures may include structural arrangements, materials, and/or substrate modifications that can improve the reliability of the capacitor for long-term usage when faced with environmental stress. Embodiments may implement reduced entryways in the termination patterns of the capacitor to decrease damage potential due to exposure of moisture. Embodiments may implement structures that decrease interfaces with different physical characteristics, which may lead to a reduction in the formation of micro-fractures during regular usage. Methods of manufacture for the features that improve reliability are also detailed.
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