公开(公告)号：US10322491B2

公开(公告)日：2019-06-18

申请号：US14885955

申请日：2015-10-16

Applicant: Applied Materials, Inc.

Inventor： Mahendra Christopher Orilall ,  Timothy Michaelson ,  Kasiraman Krishnan ,  Rajeev Bajaj ,  Nag B. Patibandla ,  Daniel Redfield ,  Fred C. Redeker ,  Gregory E. Menk

IPC: B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B33Y10/00 ,  B33Y80/00 ,  B24D18/00

Abstract: A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a base material from a first nozzle and an additive material from a second nozzle and solidifying the base and additive material to form a solidified pad material.

公开(公告)号：US11965103B2

公开(公告)日：2024-04-23

申请号：US16996744

申请日：2020-08-18

Applicant: Applied Materials, Inc.

Inventor： Yingdong Luo ,  Sivapackia Ganapathiappan ,  Ashwin Murugappan Chockalingam ,  Daihua Zhang ,  Uma Sridhar ,  Daniel Redfield ,  Rajeev Bajaj ,  Nag B. Patibandla ,  Hou T. Ng ,  Sudhakar Madhusoodhanan

IPC: C09D11/107 ,  B24B37/24 ,  B29C64/112 ,  B29K33/00 ,  B29K509/02 ,  B29L31/00 ,  B33Y10/00 ,  B33Y40/10 ,  B33Y70/10 ,  B33Y80/00 ,  C09K3/14

CPC classification number: C09D11/107 ,  B24B37/245 ,  B29C64/112 ,  B33Y10/00 ,  B33Y40/10 ,  B33Y70/10 ,  B33Y80/00 ,  C09K3/1409 ,  B29K2033/08 ,  B29K2509/02 ,  B29L2031/736

Abstract: A formulation, system, and method for additive manufacturing of a polishing pad. The formulation includes monomer, dispersant, and nanoparticles. A method of preparing the formulation includes adding a dispersant that is a polyester derivative to monomer, adding metal-oxide nanoparticles to the monomer, and subjecting the monomer having the nanoparticles and dispersant to sonication to disperse the nanoparticles in the monomer.

公开(公告)号：US11958162B2

公开(公告)日：2024-04-16

申请号：US16746065

申请日：2020-01-17

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Kasiraman Krishnan ,  Mahendra C. Orilall ,  Daniel Redfield ,  Fred C. Redeker ,  Nag B. Patibandla ,  Gregory E. Menk ,  Jason G. Fung ,  Russell Edward Perry ,  Robert E. Davenport

IPC: B24B37/26 ,  B24B37/20 ,  B24B37/22 ,  B24B37/24 ,  B24D18/00 ,  B29C64/112 ,  B33Y80/00

CPC classification number: B24B37/26 ,  B24B37/205 ,  B24B37/22 ,  B24B37/24 ,  B24D18/0018 ,  B24D18/0045 ,  B29C64/112 ,  B33Y80/00

Abstract: Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

公开(公告)号：US20230219190A1

公开(公告)日：2023-07-13

申请号：US18124529

申请日：2023-03-21

Applicant: Applied Materials, Inc.

Inventor： Uma Sridhar ,  Sivapackia Ganapathiappan ,  Ashwin Murugappan Chockalingam ,  Mayu Felicia Yamamura ,  Daniel Redfield ,  Rajeev Bajaj ,  Yingdong Luo ,  Nag B. Patibandla

IPC: B24B37/24 ,  B24B37/22 ,  B33Y80/00 ,  B33Y70/00

CPC classification number: B24B37/24 ,  B24B37/22 ,  B33Y80/00 ,  B33Y70/00

Abstract: Interpenetrating polymer networks (IPNs) for a forming polishing pad for a semiconductor fabrication operation are disclosed. Techniques for forming the polishing pads are provided. In an exemplary embodiment, a polishing pad includes an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.

公开(公告)号：US20230080430A1

公开(公告)日：2023-03-16

申请号：US17472006

申请日：2021-09-10

Applicant: Applied Materials, Inc.

Inventor： Sivapackia GANAPATHIAPPAN ,  Rajeev Bajaj ,  Yingdong Luo ,  Aniruddh Jagdish Khanna ,  You Wang ,  Daniel Redfield

IPC: B24B37/24 ,  B24B37/26

Abstract: Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements. Each polishing element comprises an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface to define a plurality of channels disposed between the polishing elements. Each of the polishing elements has a plurality of pore-features formed therein. Each of the polishing elements is formed of a pre-polymer composition and a sacrificial material composition. In some cases, a sample of the cured pre-polymer composition has a glass transition temperature (Tg) of about 80° C. or greater. A storage modulus (E′) of the cured pre-polymer composition at a temperature of 80° C. (E′80) can be about 200 MPa or greater.

公开(公告)号：US20210379726A1

公开(公告)日：2021-12-09

申请号：US16897195

申请日：2020-06-09

Applicant: Applied Materials, Inc

Inventor： Uma Sridhar ,  Sivapackia Ganapathiappan ,  Ashwin Murugappan Chockalingam ,  Rajeev Bajaj ,  Daniel Redfield ,  Mayu Felicia Yamamura ,  Yingdong Luo ,  Nag B. Patibandla

IPC: B24B37/24 ,  C09D11/102 ,  C09D11/101 ,  B33Y80/00 ,  B29C64/112 ,  B33Y10/00 ,  B33Y70/00

Abstract: A polishing pad for a semiconductor fabrication operation includes a polishing region and a window region, wherein both regions are made of an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.

公开(公告)号：US11154961B2

公开(公告)日：2021-10-26

申请号：US16737818

申请日：2020-01-08

Applicant: Applied Materials, Inc.

Inventor： Mayu Felicia Yamamura ,  Jason Garcheung Fung ,  Daniel Redfield ,  Rajeev Bajaj ,  Hou T. Ng

IPC: B24B37/26 ,  B24D18/00 ,  B29C64/393 ,  B29C64/112 ,  B29C64/165 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y80/00 ,  B24B37/20 ,  B29L31/00

Abstract: A method of fabricating a polishing pad using an additive manufacturing system includes receiving data indicative of a desired shape of the polishing pad to be fabricated by droplet ejection. The desired shape defines a profile including a polishing surface and one or more grooves on the polishing pad. Data indicative of a modified pattern of dispensing feed material is generated to at least partially compensate for distortions of the profile caused by the additive manufacturing system, and a plurality of layers of the feed material are dispensed by droplet ejection in accordance to the modified pattern.

公开(公告)号：US11072050B2

公开(公告)日：2021-07-27

申请号：US16050442

申请日：2018-07-31

Applicant: Applied Materials, Inc.

Inventor： Boyi Fu ,  Sivapackia Ganapathiappan ,  Daniel Redfield ,  Rajeev Bajaj ,  Ashwin Chockalingam ,  Dominic J. Benvegnu ,  Mario Dagio Cornejo ,  Mayu Yamamura ,  Nag B. Patibandla ,  Ankit Vora

IPC: B24B37/20 ,  B24B37/26 ,  B24B37/24

Abstract: Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material, and methods of forming thereof. In one embodiment a method of forming a polishing pad includes forming a first layer of the polishing pad by dispensing a first precursor composition and a window precursor composition, the first layer comprising at least portions of each of a first polishing pad element and a window feature, and partially curing the dispensed first precursor composition and the dispensed window precursor composition disposed within the first layer.

公开(公告)号：US10919123B2

公开(公告)日：2021-02-16

申请号：US16259597

申请日：2019-01-28

Applicant: Applied Materials, Inc.

Inventor： Venkat Hariharan ,  Rajeev Bajaj ,  Daniel Redfield

IPC: B24B37/24 ,  B24B37/005 ,  B24B37/04 ,  B24B49/10 ,  B24B49/16 ,  B24B37/26 ,  B24B37/22 ,  B29C64/112 ,  H01L21/768 ,  H01L21/321 ,  C09G1/02

Abstract: Embodiments described herein relate to methods of detecting a polishing endpoint using one or more sensors embedded in the polishing material of a polishing pad, the polishing pads, and methods of forming the polishing pads. In one embodiment, a method of polishing a substrate includes urging a to be polished surface of a substrate against a polishing surface of a polishing pad, the polishing pad having one or more sensors embedded in the polishing pad material thereof, wherein the polishing pad is mounted on a polishing platen of a polishing system, detecting a force exerted against a polishing surface of the polishing pad using the one or more sensors, converting the detected force into signal information, wirelessly communicating the signal information received from the one or more sensors to one or more interrogators disposed in the polishing platen, and changing one or more polishing conditions based on the signal information.

公开(公告)号：US20180339447A1

公开(公告)日：2018-11-29

申请号：US15873834

申请日：2018-01-17

Applicant: Applied Materials, Inc.

Inventor： Daniel Redfield

IPC: B29C64/112 ,  C09G1/16 ,  B29C64/282 ,  B29C64/40 ,  B29C64/393 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y80/00

Abstract: A method of fabricating a polishing pad using an additive manufacturing system includes depositing successive layers by droplet ejection to form the polishing pad. The polishing pad includes a polishing surface having one or more partitions separated by one or more grooves. Depositing a layer of the successive layers includes dispensing first regions corresponding to edges of the one or more partitions by a first droplet ejection process. After curing the first regions, a second region corresponding to interior of the one or more partitions is dispensed between the edges by a different second droplet ejection process.