公开(公告)号：US20150148098A1

公开(公告)日：2015-05-28

申请号：US14552831

申请日：2014-11-25

Applicant: BROADCOM CORPORATION

Inventor： Alfred Grau Besoli ,  Nicolaos Georgiou Alexopoulos ,  Jesus Alfonso Castaneda ,  Chryssoula Angelakis Kyriazidou

IPC: H04B7/04 ,  H01Q1/24 ,  H01Q3/24

CPC classification number: H04B7/0404 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/15192 ,  H01Q1/007 ,  H01Q1/2291 ,  H01Q3/26 ,  H01Q9/20 ,  H01Q21/065 ,  H01Q21/067 ,  H01Q21/205 ,  H01Q21/28 ,  H01Q21/293 ,  H01Q25/00 ,  H04B7/0617 ,  H04B7/086

Abstract: Aspects of the subject disclosure may include, for example, an integrated circuit that includes at least one die having transceiver circuitry that generates outbound signals that convey outbound data and that receives inbound signals that convey inbound data. A first array of antenna elements arranged along the top portion of the IC package operate in conjunction with the transceiver circuitry to transmit at least a first portion of the outbound signals as first wireless transmissions and/or generate at least a first portion of the inbound signals from first wireless receptions. A second array of antenna elements arranged along the bottom portion of the IC package operate in conjunction with the transceiver circuitry to transmit at least a second portion of the outbound signals as second wireless transmissions and/or to generate at least a second portion of the inbound signals from second wireless receptions. Other embodiments are disclosed.

Abstract translation: 主题公开的方面可以包括例如集成电路，其包括具有收发器电路的至少一个管芯，其具有产生传出出站数据并且接收传达入站数据的入站信号的出站信号。 沿着IC封装的顶部布置的第一阵列天线元件与收发器电路一起工作，以将至少第一部分出站信号作为第一无线传输传输和/或生成入站信号的至少第一部分 从第一次无线接收。 沿着IC封装的底部布置的第二阵列天线元件与收发器电路一起工作，以将至少第二部分出站信号作为第二无线传输传输和/或产生入站的至少第二部分 来自第二次无线接收的信号。 公开了其他实施例。

公开(公告)号：US20140027903A1

公开(公告)日：2014-01-30

申请号：US13935164

申请日：2013-07-03

Applicant: Broadcom Corporation

Inventor： Michael Boers ,  Arya Reza Behzad ,  Ahmadreza Rofougaran ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda

IPC: H01L23/498

CPC classification number: H01L23/49811 ,  H01L23/5222 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05647 ,  H01L2224/131 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/81815 ,  H01L2225/06531 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01P1/182 ,  H01P3/023 ,  H01P3/12 ,  H01P3/121 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05552

Abstract: Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

Abstract translation: 公开了用于在集成电路内的集成电路和/或功能模块之间进行无线通信的方法和装置。 半导体器件制造操作使用预定的照相和/或化学处理步骤顺序在半导体衬底上形成一个或多个功能模块。 功能模块耦合到形成在半导体衬底上和/或连接到其上以形成集成电路的集成波导。 功能模块通过集成波导使用多址传输方案彼此通信以及其他集成电路。 一个或多个集成电路可以耦合到集成电路载体以形成多芯片模块。 多芯片模块可以耦合到半导体封装以形成封装的集成电路。

公开(公告)号：US20130285848A1

公开(公告)日：2013-10-31

申请号：US13930327

申请日：2013-06-28

Applicant: BROADCOM CORPORATION

Inventor： Alfred Grau Besoli ,  Nicolaos G. Alexopoulos ,  Jesus Alfonso Castaneda

IPC: G01S13/42

CPC classification number: G01S13/428 ,  G01S7/03 ,  G01S13/72 ,  G01S13/87 ,  H01Q1/525 ,  H01Q3/24 ,  H01Q3/30 ,  H01Q3/40

Abstract: An integrated radar system includes a processing module and a radar device. The radar device includes an antenna module, a configurable shaping module, and a configurable transceiver module. The processing module generates an outbound signal and a control signal to configure the integrated radar system. The configured transceiver module converts the outbound signal into an outbound wireless signal. The configured shaping module shapes the outbound wireless signal into a shaped signal. The antenna module transmits the shaped signal and then receives an inbound radar signal. The configured shaping module shapes the inbound radar signal into an inbound wireless signal. The configured transceiver module converts the inbound wireless signal into an inbound symbol stream. The processing module determines location information regarding an object based on the inbound symbol stream.

Abstract translation: 集成雷达系统包括处理模块和雷达装置。 雷达装置包括天线模块，可配置整形模块和可配置的收发模块。 处理模块产生出站信号和控制信号以配置集成的雷达系统。 配置的收发器模块将出站信号转换为出站无线信号。 配置的整形模块将出站无线信号整形成成形信号。 天线模块发送成形信号，然后接收入站雷达信号。 配置的整形模块将入站雷达信号整形为入站无线信号。 配置的收发器模块将入站无线信号转换为入站符号流。 处理模块基于入站符号流来确定关于对象的位置信息。

公开(公告)号：US20150276856A1

公开(公告)日：2015-10-01

申请号：US14735994

申请日：2015-06-10

Applicant: Broadcom Corporation

Inventor： Jesus Alfonso Castaneda ,  Arya Reza Behzad ,  Ahmadreza Rofougaran ,  Sam Ziqun Zhao ,  Michael Boers

IPC: G01R31/28 ,  G01R31/303 ,  G01R31/302

CPC classification number: G01R31/2834 ,  G01R31/2822 ,  G01R31/2831 ,  G01R31/3025 ,  G01R31/303 ,  H01L2224/16225 ,  H01L2924/15311

Abstract: Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

Abstract translation: 公开了用于在集成电路内的集成电路和/或功能模块之间进行无线通信的方法和装置。 半导体器件制造操作使用预定的照相和/或化学处理步骤顺序在半导体衬底上形成一个或多个功能模块。 功能模块耦合到形成在半导体衬底上和/或连接到其上以形成集成电路的集成波导。 功能模块通过集成波导使用多址传输方案彼此通信以及其他集成电路。 一个或多个集成电路可以耦合到集成电路载体以形成多芯片模块。 多芯片模块可以耦合到半导体封装以形成封装的集成电路。

公开(公告)号：US20150223275A1

公开(公告)日：2015-08-06

申请号：US14615866

申请日：2015-02-06

Applicant: Broadcom Corporation

Inventor： Ahmadreza (Reza) ROFOUGARAN ,  Arya Reza Behzad ,  Michael Boers ,  Jesus Alfonso Castaneda ,  Sam Ziqun Zhao

IPC: H04W76/02 ,  H04B7/26

CPC classification number: G06F9/50 ,  H04B5/0037 ,  H04B7/10 ,  H04B7/26 ,  H04W4/80 ,  H04W84/18 ,  Y10T307/492

Abstract: Disclosed herein are systems, apparatuses, and methods for creating a system of wireless-enabled components (WECs). Such a system includes a server and a plurality of wireless-enabled component (WECs). Each WEC includes a functional resource (e.g., a processing resource and/or a memory resource) and is configured for wireless communication with the server and one or more other WECs. A first WEC is configured to wirelessly upload, to the server, an availability of the functional resource of the first WEC. The first WEC is further configured to wirelessly download, from the server, a linking resource for linking with one or more of the plurality of WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips of multiple devices.

Abstract translation: 这里公开了用于创建无线组件（WEC）的系统的系统，设备和方法。 这样的系统包括服务器和多个无线使能分量（WEC）。 每个WEC包括功能资源（例如，处理资源和/或存储器资源），并且被配置用于与服务器和一个或多个其他WEC的无线通信。 第一WEC被配置为向服务器无线地上传第一WEC的功能资源的可用性。 第一WEC还被配置为从服务器无线地下载链接资源，用于与多个WEC中的一个或多个相关联。 多个WEC可以位于单个芯片上，在单个设备的多个芯片上，或者位于多个设备的多个芯片上。