公开(公告)号：US08138509B2

公开(公告)日：2012-03-20

申请号：US12395086

申请日：2009-02-27

申请人： Tzy-Ying Lin ,  Chun-Chiang Yen ,  Wu-Cheng Kuo

发明人： Tzy-Ying Lin ,  Chun-Chiang Yen ,  Wu-Cheng Kuo

IPC分类号： H01L33/36

CPC分类号： H01L33/508 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01064 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2224/45099 ,  H01L2924/00

摘要： Light emitting devices conformally covered by a luminescent material layer are presented. A light emitting device includes a semiconductor light emitting die attached to a substrate. At least one bond pad is disposed on the semiconductor light emitting die. A luminescent material layer conformally covers the semiconductor light emitting die, wherein the luminescent material layer has at least one opening corresponding to and exposing the at least one bond pad. At least one wirebond is electrically connected to the at least one bond pad and a contact pad on the substrate.

摘要翻译： 呈现由发光材料层共形覆盖的发光器件。 发光器件包括附接到衬底的半导体发光芯片。 至少一个接合焊盘设置在半导体发光管芯上。 发光材料层共形地覆盖半导体发光管芯，其中发光材料层具有至少一个对应于并暴露至少一个焊盘的开口。 至少一个引线键电连接到所述至少一个接合焊盘和所述衬底上的接触焊盘。

公开(公告)号：US20120025387A1

公开(公告)日：2012-02-02

申请号：US12844590

申请日：2010-07-27

申请人： Kuo-Ching CHANG ,  Wu-Cheng Kuo ,  Tzu-Han Lin

发明人： Kuo-Ching CHANG ,  Wu-Cheng Kuo ,  Tzu-Han Lin

IPC分类号： H01L23/492 ,  H01L21/50

CPC分类号： H01L24/33 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/04042 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/32238 ,  H01L2224/32506 ,  H01L2224/335 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/83815 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package and a fabrication method thereof are provided. The chip package includes a substrate and a chip disposed over the substrate. A solder layer is disposed between the chip and the substrate. A conductive pad is disposed between the solder layer and the substrate, wherein the conductive pad includes a first portion disposed under the solder layer, a second portion disposed away from the first portion and a connective portion disposed between the first portion and the second portion. The connective portion has a width which is narrower than a width of the first portion along a first direction perpendicular to a second direction extending from the first portion to the connective portion.

摘要翻译： 提供了芯片封装及其制造方法。 芯片封装包括衬底和布置在衬底上的芯片。 焊料层设置在芯片和衬底之间。 导电焊盘设置在焊料层和衬底之间，其中导电焊盘包括布置在焊料层下方的第一部分，远离第一部分设置的第二部分和设置在第一部分和第二部分之间的连接部分。 连接部分的宽度比沿着从第一部分延伸到连接部分的第二方向垂直的第一方向的第一部分的宽度窄。

公开(公告)号：US20110037081A1

公开(公告)日：2011-02-17

申请号：US12540145

申请日：2009-08-12

申请人： Wu-Cheng Kuo ,  Tzu-Han Lin

发明人： Wu-Cheng Kuo ,  Tzu-Han Lin

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L33/504 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A white light-emitting diode package with tunable color temperature is provided, including a package substrate with a first light emitting diode (first LED) disposed over a first portion of the substrate and a second light emitting diode (second LED) disposed over a second portion different from the first portion of the substrate. A phosphor layer is coated around the first and second LED, wherein the phosphor layer is formed by blending at least one colored phosphor grain with a transparent optical resin, and the at least one colored phosphor grain in the transparent optical resin is excited by light from the first and second LED to react and emit white light. In one embodiment, the first and second LED are both blue LEDs for emitting blue light of different wavelengths or ultraviolet (UV) LEDs for emitting UV light of different wavelengths.

摘要翻译： 提供了具有可调色温的白色发光二极管封装，包括具有设置在衬底的第一部分上的第一发光二极管（第一LED）的封装衬底和设置在衬底的第二部分上的第二发光二极管（第二LED） 部分不同于基板的第一部分。 荧光体层被涂覆在第一和第二LED周围，其中荧光体层通过将至少一个着色荧光体晶粒与透明光学树脂共混而形成，并且透明光学树脂中的至少一个着色荧光体颗粒被来自 第一和第二LED反应并发出白光。 在一个实施例中，第一和第二LED都是用于发射不同波长的蓝光的蓝色LED或用于发射不同波长的UV光的紫外线（UV）LED。

公开(公告)号：US20100237378A1

公开(公告)日：2010-09-23

申请号：US12407363

申请日：2009-03-19

申请人： Tzu-Han LIN ,  Wu-Cheng Kuo ,  San-Yuan Chung

发明人： Tzu-Han LIN ,  Wu-Cheng Kuo ,  San-Yuan Chung

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2924/01322 ,  H01L2924/00

摘要： An ultraviolet light emitting diode package structure is disclosed, comprising a substrate with a through-silicon via (TSV) disposed therein, a first electrode disposed on a top side of the substrate, and a second electrode disposed on a bottom side of the substrate, wherein the first electrode and the second electrode are electrically connected through the TSV, an ultraviolet light emitting diode bonded to the top side of the substrate, and a cover substrate bonded to the substrate, wherein the cover substrate comprises a cavity for receiving the ultraviolet light emitting diode.

摘要翻译： 公开了一种紫外线发光二极管封装结构，其包括：具有设置在其中的贯通硅通孔（TSV）的基板，设置在所述基板的上侧的第一电极和设置在所述基板的底面的第二电极， 其中所述第一电极和所述第二电极通过所述TSV电连接，所述紫外发光二极管与所述基板的顶侧接合，以及覆盖基板，所述盖基板与所述基板接合，其中，所述盖基板包括用于接收所述紫外线的空腔 发光二极管。

公开(公告)号：US08502257B2

公开(公告)日：2013-08-06

申请号：US12613003

申请日：2009-11-05

申请人： Kuo-Ching Chang ,  Wu-Cheng Kuo ,  Tzu-Han Lin

发明人： Kuo-Ching Chang ,  Wu-Cheng Kuo ,  Tzu-Han Lin

IPC分类号： H01L27/15 ,  H01L29/267 ,  H01L31/12 ,  H01L33/00 ,  H01L31/0203

CPC分类号： H01L33/62 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L33/486 ,  H01L2224/05554 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/83815 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/157 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A light-emitting diode package is provided. The light-emitting diode package comprises a substrate and a first metal layer disposed over the substrate. A solder layer is disposed on the first metal layer and a light-emitting diode chip is disposed on the solder layer, wherein the light-emitting diode chip comprises a conductive substrate and a multilayered epitaxial structure formed on the conductive substrate, and wherein the conductive substrate is adjacent to the solder layer.

摘要翻译： 提供了一种发光二极管封装。 发光二极管封装包括衬底和设置在衬底上的第一金属层。 焊料层设置在第一金属层上，并且发光二极管芯片设置在焊料层上，其中发光二极管芯片包括形成在导电衬底上的导电衬底和多层外延结构，并且其中导电 衬底与焊料层相邻。

公开(公告)号：US20110089447A1

公开(公告)日：2011-04-21

申请号：US12581731

申请日：2009-10-19

申请人： Wu-Cheng Kuo ,  Chi-Xiang Tseng

发明人： Wu-Cheng Kuo ,  Chi-Xiang Tseng

IPC分类号： H01L33/00 ,  H01L21/78

CPC分类号： H01L33/44 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/13 ,  H01L2933/0025

摘要： A light-emitting device (LED) chip is disclosed. The LED chip includes a body having a light extraction surface. The body includes semiconductor layers including an n-type region and a p-type region. A plurality of micro-lenses is directly on the light extraction surface of the body. A pair of bond pads is electrically connected to the n-type and p-type regions, respectively. A method for fabricating the LED chip and an LED package with the LED chip are also disclosed.

摘要翻译： 公开了一种发光器件（LED）芯片。 LED芯片包括具有光提取表面的主体。 主体包括包括n型区域和p型区域的半导体层。 多个微透镜直接在身体的光提取表面上。 一对接合焊盘分别电连接到n型和p型区域。 还公开了一种用于制造LED芯片的方法和具有LED芯片的LED封装。

公开(公告)号：US20100219433A1

公开(公告)日：2010-09-02

申请号：US12395086

申请日：2009-02-27

申请人： Tzy-Ying LIN ,  Chun-Chiang Yen ,  Wu-Cheng Kuo

发明人： Tzy-Ying LIN ,  Chun-Chiang Yen ,  Wu-Cheng Kuo

IPC分类号： H01L33/00

CPC分类号： H01L33/508 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01064 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2224/45099 ,  H01L2924/00

摘要： Light emitting devices conformally covered by a luminescent material layer are presented. A light emitting device includes a semiconductor light emitting die attached to a substrate. At least one bond pad is disposed on the semiconductor light emitting die. A luminescent material layer conformally covers the semiconductor light emitting die, wherein the luminescent material layer has at least one opening corresponding to and exposing the at least one bond pad. At least one wirebond is electrically connected to the at least one bond pad and a contact pad on the substrate.

摘要翻译： 呈现由发光材料层共形覆盖的发光器件。 发光器件包括附接到衬底的半导体发光芯片。 至少一个接合焊盘设置在半导体发光管芯上。 发光材料层共形地覆盖半导体发光管芯，其中发光材料层具有至少一个对应于并暴露至少一个焊盘的开口。 至少一个引线键电连接到所述至少一个接合焊盘和所述衬底上的接触焊盘。