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11.发明申请INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FILM ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF 有权具有膜片封装的集成电路封装系统及其制造方法公开(公告)号：US20120061855A1
公开(公告)日：2012-03-15
申请号：US12882067
申请日：2010-09-14
CPC分类号： H01L24/97 , H01L21/561 , H01L21/566 , H01L23/3128 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/73 , H01L25/105 , H01L25/50 , H01L2224/13025 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/97 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/0001 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/18161 , H01L2924/19107 , H01L2924/3511 , H01L2224/81 , H01L2924/00011 , H01L2924/00012 , H01L2924/00 , H01L2224/13099 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package substrate having a substrate bottom side and a substrate top side opposite the substrate bottom side; mounting an integrated circuit over the package substrate, the integrated circuit having an inactive side and an active side opposite the inactive side; connecting stack connectors to the substrate top side; applying a multi-layer film over the substrate top side, the integrated circuit, and the stack connectors, the multi-layer film having a base film layer, a penetrable film layer, and a penetrable adhesive; removing the base film layer and the penetrable film layer to expose the penetrable adhesive and exposed portions of the stack connectors; and forming an adhesive film layer by hardening the penetrable adhesive.
摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有基板底面和与基板底面相对的基板顶面的封装基板; 将集成电路安装在封装基板上，该集成电路具有非活动侧和与非活动侧相对的有效侧; 将堆叠连接器连接到基板顶侧; 在基板顶侧，集成电路和堆叠连接器上施加多层膜，具有基膜层，可穿透膜层和可穿透粘合剂的多层膜; 去除基膜层和可穿透膜层以暴露可穿透粘合剂和堆叠连接器的暴露部分; 以及通过使可渗透的粘合剂硬化来形成粘合剂膜层。
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12.发明申请INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE STAND-OFF AND METHOD OF MANUFACTURE THEREOF 有权具有封装的集成电路封装系统及其制造方法公开(公告)号：US20110316133A1
公开(公告)日：2011-12-29
申请号：US12822659
申请日：2010-06-24
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L23/49548 , H01L21/561 , H01L21/565 , H01L21/568 , H01L23/3107 , H01L23/49506 , H01L23/4951 , H01L23/49575 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/14181 , H01L2224/16146 , H01L2224/16227 , H01L2224/16235 , H01L2224/16245 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48257 , H01L2224/73204 , H01L2224/73265 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01046 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/19107 , H01L2924/3025 , H01L2224/81 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacture of an integrated circuit package system includes: providing a penetrable layer; partially immersing leads in the penetrable layer; coupling an integrated circuit die to the leads; molding a package body on the integrated circuit die, the leads, and the penetrable layer; and exposing stand-off leads from the leads by removing the penetrable layer including establishing a stand-off height between a bottom of the package body and the bottom of the stand-off leads.
摘要翻译： 一种集成电路封装系统的制造方法，包括：提供可穿透层; 将引线部分浸渍在可穿透层中; 将集成电路管芯耦合到引线; 在集成电路管芯，引线和可穿透层上成型封装体; 以及通过去除所述可穿透层而使所述引线脱离引线，包括在所述封装主体的底部和所述支座引线的底部之间建立间隔高度。
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公开(公告)号：US20100140813A1
公开(公告)日：2010-06-10
申请号：US12331347
申请日：2008-12-09
IPC分类号： H01L23/498 , H01L21/768 , H01L21/50
CPC分类号： H01L23/3128 , H01L21/76898 , H01L23/3135 , H01L23/481 , H01L23/49816 , H01L23/49833 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/32225 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2224/73257 , H01L2224/73265 , H01L2224/94 , H01L2225/0651 , H01L2225/1023 , H01L2225/1052 , H01L2225/107 , H01L2225/1088 , H01L2924/00014 , H01L2924/01079 , H01L2924/10156 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2224/03 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacture of an integrated circuit packaging system includes providing an integrated circuit having an active side and a non-active side; forming a channel through the integrated circuit; forming an indent, having a flange and an indent side, from a peripheral region of the non-active side; and forming a conformal interconnect, having an offset segment, a sloped segment, and a flange segment, under the indent.
摘要翻译： 一种集成电路封装系统的制造方法，包括提供具有有源侧和非有源侧的集成电路; 通过集成电路形成通道; 从非活动侧的周边区域形成具有凸缘和凹口侧的凹口; 以及在缩进下形成具有偏移段，倾斜段和凸缘段的共形互连。
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公开(公告)号：US20100032821A1
公开(公告)日：2010-02-11
申请号：US12188210
申请日：2008-08-08
申请人： Reza Argenty Pagaila , Byung Tai Do
发明人： Reza Argenty Pagaila , Byung Tai Do
IPC分类号： H01L23/02
CPC分类号： H01L25/0657 , H01L23/3128 , H01L24/73 , H01L25/105 , H01L2224/04042 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2225/1088 , H01L2924/00011 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/19107 , H01L2924/30107 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： An integrated circuit package system includes: providing a first package having a first interposer mounted over a first integrated circuit and the first integrated circuit encapsulated by a first encapsulation; and connecting a second package over the first interposer and on the first encapsulation, the second package including a second integrated circuit having a wire-in-film adhesive thereover, a second interposer mounted on the wire-in-film adhesive and encapsulated by a second encapsulation encapsulating the second integrated circuit, the second interposer including an interconnection pad for connecting a third package to the top thereof.
摘要翻译： 集成电路封装系统包括：提供第一封装，其具有安装在第一集成电路上的第一插入件和由第一封装封装的第一集成电路; 并且在所述第一插入件上连接第二封装，并且在所述第一封装上，所述第二封装包括其上具有线内胶粘剂的第二集成电路，安装在所述线对膜粘合剂上并由第二封装体封装的第二插入件 封装第二集成电路的封装，第二插入器包括用于将第三封装连接到其顶部的互连焊盘。
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公开(公告)号：US20120306078A1
公开(公告)日：2012-12-06
申请号：US13589018
申请日：2012-08-17
CPC分类号： H01L25/0657 , H01L23/3128 , H01L24/16 , H01L24/31 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/04042 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48465 , H01L2224/73215 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06586 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2225/1088 , H01L2924/00011 , H01L2924/00014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit above the substrate; connecting an interposer to the integrated circuit with a wire-in-film adhesive; connecting an exposed interconnect having an upper surface to the substrate; and encapsulating the integrated circuit with an encapsulation.
摘要翻译： 集成电路封装系统包括：提供衬底; 在基板上方安装集成电路; 使用线内胶粘剂将插入件连接到集成电路; 将具有上表面的暴露的互连件连接到所述基板; 并用封装封装集成电路。
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16.发明申请INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECT AND METHOD OF MANUFACTURE THEREOF 有权具有互连的集成电路包装系统及其制造方法公开(公告)号：US20120286432A1
公开(公告)日：2012-11-15
申请号：US13105814
申请日：2011-05-11
申请人： Byung Tai Do , Reza Argenty Pagaila
发明人： Byung Tai Do , Reza Argenty Pagaila
IPC分类号： H01L23/522 , H01L21/50
CPC分类号： H01L23/13 , H01L23/49816 , H01L23/5385 , H01L24/48 , H01L24/73 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/48227 , H01L2224/73207 , H01L2224/73253 , H01L2224/73265 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a base carrier; providing a first integrated circuit having a first integrated circuit inactive side and a first integrated circuit active side; coupling a second integrated circuit, having a second integrated circuit inactive side and a second integrated circuit active side, to the first integrated circuit in an active-to-active configuration; attaching the first integrated circuit over the base carrier; attaching a redistribution structure over the first integrated circuit; and forming a base encapsulation over the redistribution structure, the base encapsulation having a recess partially exposing the redistribution structure.
摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基座; 提供具有第一集成电路无效侧和第一集成电路有源侧的第一集成电路; 将具有第二集成电路无效侧和第二集成电路有源侧的第二集成电路以主动 - 主动配置耦合到第一集成电路; 将第一集成电路连接在基架上; 在第一集成电路上附加再分配结构; 以及在所述再分布结构上形成基底封装，所述基底封装具有部分地暴露所述再分布结构的凹部。
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17.发明授权Integrated circuit packaging system with z-interconnects having traces and method of manufacture thereof 有权具有z型互连件的集成电路封装系统具有迹线及其制造方法公开(公告)号：US08003445B2
公开(公告)日：2011-08-23
申请号：US12412312
申请日：2009-03-26
CPC分类号： H01L25/0657 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L23/3128 , H01L23/49833 , H01L23/5389 , H01L24/19 , H01L24/48 , H01L24/73 , H01L24/82 , H01L24/97 , H01L2221/68345 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/73267 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06524 , H01L2225/06582 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01019 , H01L2924/01033 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2224/82 , H01L2924/00 , H01L2224/0401 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a carrier; mounting an integrated circuit on the carrier; mounting a z-interconnect on the carrier, the z-interconnect for supporting a trace cantilevered over the integrated circuit; encapsulating the integrated circuit with an encapsulation; removing the carrier; and depositing a substrate below the integrated circuit.
摘要翻译： 一种集成电路封装系统的制造方法，包括：提供载体; 在载体上安装集成电路; 在载体上安装z互连，z互连用于在集成电路上支撑悬臂的迹线; 用封装封装集成电路; 移除载体; 以及在所述集成电路下方沉积衬底。
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18.发明授权Integrated circuit packaging system with stacked die and method of manufacture thereof 有权具有堆叠模的集成电路封装系统及其制造方法公开(公告)号：US07977802B2
公开(公告)日：2011-07-12
申请号：US12398782
申请日：2009-03-05
CPC分类号： H01L25/0657 , H01L23/3128 , H01L23/4334 , H01L23/49816 , H01L24/16 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/03 , H01L29/0657 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06575 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/0401 , H01L2224/85399 , H01L2224/05599
摘要： A method of manufacture of an integrated circuit packaging system includes: forming a flip chip die, having a backside protrusion; mounting a wire bond die on the flip chip die, adjacent to the backside protrusion; and mounting an internal stacking module over the backside protrusion and the wire bond die.
摘要翻译： 一种集成电路封装系统的制造方法，包括：形成具有背面突出部的倒装芯片模具; 在倒装芯片上安装引线接合管芯，邻近后端突起; 并将内部堆叠模块安装在所述背面突起和所述引线接合模具上。
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19.发明申请INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING PLANAR INTERCONNECT AND METHOD FOR MANUFACTURE THEREOF 有权具有平面互连的集成电路包装系统及其制造方法公开(公告)号：US20110156275A1
公开(公告)日：2011-06-30
申请号：US13041869
申请日：2011-03-07
IPC分类号： H01L25/07 , H01L21/56 , H01L21/60 , H01L23/498
CPC分类号： H01L23/5385 , H01L23/13 , H01L23/3128 , H01L23/3157 , H01L24/13 , H01L24/17 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/91 , H01L25/105 , H01L2224/04042 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/06135 , H01L2224/06136 , H01L2224/13099 , H01L2224/131 , H01L2224/32225 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/4918 , H01L2224/73215 , H01L2224/73265 , H01L2225/1023 , H01L2225/107 , H01L2225/1088 , H01L2924/00014 , H01L2924/01027 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method for manufacture of an integrated circuit packaging system includes: mounting an integrated circuit, having a planar interconnect, over a carrier with the planar interconnect at a non-active side of the integrated circuit and an active side of the integrated circuit facing the carrier; connecting the integrated circuit and the carrier; connecting the planar interconnect and the carrier; and forming an encapsulation over the integrated circuit, the carrier, and the planar interconnect.
摘要翻译： 一种用于制造集成电路封装系统的方法，包括：在集成电路的非有源侧上将具有平面互连的集成电路安装在载体上，其中所述平面互连面与所述载体的非有源侧的有源侧 ; 连接集成电路和载体; 连接平面互连和载体; 以及在集成电路，载体和平面互连上形成封装。
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20.发明申请INTEGRATED CIRCUIT PACKAGING SYSTEM WITH Z-INTERCONNECTS HAVING TRACES AND METHOD OF MANUFACTURE THEREOF 有权具有Z型互连线的集成电路包装系统及其制造方法公开(公告)号：US20100244232A1
公开(公告)日：2010-09-30
申请号：US12412312
申请日：2009-03-26
CPC分类号： H01L25/0657 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L23/3128 , H01L23/49833 , H01L23/5389 , H01L24/19 , H01L24/48 , H01L24/73 , H01L24/82 , H01L24/97 , H01L2221/68345 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/73267 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06524 , H01L2225/06582 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01019 , H01L2924/01033 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2224/82 , H01L2924/00 , H01L2224/0401 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacture of an integrated circuit packaging system includes: providing a carrier; mounting an integrated circuit on the carrier; mounting a z-interconnect on the carrier, the z-interconnect for supporting a trace cantilevered over the integrated circuit; encapsulating the integrated circuit with an encapsulation; removing the carrier; and depositing a substrate below the integrated circuit.
摘要翻译： 一种集成电路封装系统的制造方法，包括：提供载体; 在载体上安装集成电路; 在载体上安装z互连，z互连用于在集成电路上支撑悬臂的迹线; 用封装封装集成电路; 移除载体; 以及在所述集成电路下方沉积衬底。
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