公开(公告)号：US08466057B2

公开(公告)日：2013-06-18

申请号：US13070789

申请日：2011-03-24

申请人： Linda Pei Ee Chua ,  Byung Tai Do ,  Reza Argenty Pagaila

发明人： Linda Pei Ee Chua ,  Byung Tai Do ,  Reza Argenty Pagaila

IPC分类号： H01L21/4763 ,  H01L29/40 ,  H01L29/06

CPC分类号： H01L23/3128 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming a via hole in the substrate, the via hole having a top end and a bottom end with the bottom end is larger than the top end; forming a pad on the substrate, the pad encloses the top end of the via hole; and reflowing a conductive filler having higher volume than the via hole over the via hole, the conductive filler having a protrusion extending from the bottom end and the bottom end entirely overlaps at least one surface of the protrusion.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基板; 在基板中形成通孔，具有顶端和底端与底端的通孔大于顶端; 在基板上形成焊盘，焊盘包围通孔的顶端; 并且在所述通孔上回流具有比所述通孔更高的体积的导电填料，所述导电填料具有从所述底端和所述底端延伸的突起与所述突起的至少一个表面完全重叠。

公开(公告)号：US20120241973A1

公开(公告)日：2012-09-27

申请号：US13070789

申请日：2011-03-24

申请人： Linda Pei Ee Chua ,  Byung Tai Do ,  Reza Argenty Pagaila

发明人： Linda Pei Ee Chua ,  Byung Tai Do ,  Reza Argenty Pagaila

IPC分类号： H01L23/48 ,  H01L21/56 ,  H01L21/44

CPC分类号： H01L23/3128 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming a via hole in the substrate, the via hole having a top end and a bottom end with the bottom end is larger than the top end; forming a pad on the substrate, the pad encloses the top end of the via hole; and reflowing a conductive filler having higher volume than the via hole over the via hole, the conductive filler having a protrusion extending from the bottom end and the bottom end entirely overlaps at least one surface of the protrusion.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基板; 在基板中形成通孔，具有顶端和底端与底端的通孔大于顶端; 在基板上形成焊盘，焊盘包围通孔的顶端; 并且在所述通孔上回流具有比所述通孔更高的体积的导电填料，所述导电填料具有从所述底端和所述底端延伸的突起与所述突起的至少一个表面完全重叠。

公开(公告)号：US08270176B2

公开(公告)日：2012-09-18

申请号：US12188995

申请日：2008-08-08

申请人： Reza Argenty Pagaila ,  Byung Tai Do ,  Linda Pei Ee Chua

发明人： Reza Argenty Pagaila ,  Byung Tai Do ,  Linda Pei Ee Chua

IPC分类号： H05K7/00

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/31 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: providing a substrate; mounting an integrated circuit above the substrate; connecting an interposer to the integrated circuit with a wire-in-film adhesive; connecting an exposed interconnect having an upper surface to the substrate; and encapsulating the integrated circuit with an encapsulation.

摘要翻译： 集成电路封装系统包括：提供衬底; 在基板上方安装集成电路; 使用线内胶粘剂将插入件连接到集成电路; 将具有上表面的暴露的互连件连接到所述基板; 并用封装封装集成电路。

公开(公告)号：US08241955B2

公开(公告)日：2012-08-14

申请号：US13090192

申请日：2011-04-19

申请人： Reza Argenty Pagaila ,  Byung Tai Do ,  Jong-Woo Ha

发明人： Reza Argenty Pagaila ,  Byung Tai Do ,  Jong-Woo Ha

IPC分类号： H01L21/00

CPC分类号： H01L23/3128 ,  H01L21/6835 ,  H01L23/481 ,  H01L23/492 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/552 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a base circuit assembly having an integrated circuit device; mounting a pre-formed conductive frame having an outer interconnect and an inner interconnect over the base circuit assembly, the inner interconnect on the integrated circuit device and the outer interconnect around the integrated circuit device; applying an encapsulant over the inner interconnect and the outer interconnect; and removing a portion of the pre-formed conductive frame exposing an end of the inner interconnect and the outer interconnect.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有集成电路装置的基本电路组件; 安装预先形成的导电框架，其具有位于基座电路组件上的外部互连和内部互连，集成电路器件上的内部互连和集成电路器件周围的外部互连; 在所述内部互连和外部互连上施加密封剂; 以及去除暴露所述内部互连件和所述外部互连件的端部的所述预先形成的导电框架的一部分。

公开(公告)号：US20120074547A1

公开(公告)日：2012-03-29

申请号：US12890409

申请日：2010-09-24

申请人： Byung Tai Do ,  Reza Argenty Pagaila ,  Linda Pei Ee Chua ,  Arnel Senosa Trasporto

发明人： Byung Tai Do ,  Reza Argenty Pagaila ,  Linda Pei Ee Chua ,  Arnel Senosa Trasporto

IPC分类号： H01L23/14 ,  H01L21/60

CPC分类号： H01L21/4832 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a package paddle; forming a lead adjacent the package paddle, the lead having a hole in a lead body top side and a lead ridge protruding from a lead non-horizontal side; mounting an integrated circuit over the package paddle; connecting an electrical connector to the lead and the integrated circuit; and forming a fill layer within the hole.

摘要翻译： 一种集成电路封装系统的制造方法，包括：形成封装焊盘; 在所述封装焊盘附近形成引线，所述引线在引线主体顶侧具有孔和从引线非水平侧突出的引线脊; 在封装桨上安装集成电路; 将电连接器连接到引线和集成电路; 并在孔内形成填充层。

公开(公告)号：US07927917B2

公开(公告)日：2011-04-19

申请号：US12488089

申请日：2009-06-19

申请人： Reza Argenty Pagaila ,  Byung Tai Do ,  Jong-Woo Ha

发明人： Reza Argenty Pagaila ,  Byung Tai Do ,  Jong-Woo Ha

IPC分类号： H01L21/00

CPC分类号： H01L23/49833 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a base circuit assembly having an integrated circuit device; mounting a pre-formed conductive frame having an outer interconnect and an inner interconnect shorter than the outer interconnect over the base circuit assembly, the inner interconnect over the integrated circuit device and the outer interconnect around the integrated circuit device; applying an encapsulant over the inner interconnect and the outer interconnect; and removing a portion of the pre-formed conductive frame exposing an end of the inner interconnect and an end of the outer interconnect.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有集成电路装置的基本电路组件; 在所述基座电路组件上安装具有外部互连和内部互连的预成形的导电框架，所述内部互连件比所述外部互连件短，所述集成电路器件上的所述内部互连和所述集成电路器件周围的外部互连; 在所述内部互连和外部互连上施加密封剂; 以及去除暴露所述内部互连的一端和所述外部互连的一端的所述预成形导电框架的一部分。

公开(公告)号：US20100140770A1

公开(公告)日：2010-06-10

申请号：US12328762

申请日：2008-12-04

申请人： Reza Argenty Pagaila ,  Byung Tai Do ,  Linda Pei Ee Chua

发明人： Reza Argenty Pagaila ,  Byung Tai Do ,  Linda Pei Ee Chua

IPC分类号： H01L23/48 ,  H01L21/02

CPC分类号： H01L23/5385 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a first internal integrated circuit structure and a second internal integrated circuit structure over the substrate; connecting the first internal integrated circuit structure and the second internal integrated circuit structure to the substrate with internal interconnects; forming asymmetric encapsulation structures above the first internal integrated circuit structure and the second internal integrated circuit structure; and encapsulating the first internal integrated circuit structure and the internal interconnects with an encapsulation.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基板; 在所述基板上安装第一内部集成电路结构和第二内部集成电路结构; 将第一内部集成电路结构和第二内部集成电路结构连接到具有内部互连的基板; 在第一内部集成电路结构和第二内部集成电路结构之上形成不对称封装结构; 并用封装封装第一内部集成电路结构和内部互连。

公开(公告)号：US08962393B2

公开(公告)日：2015-02-24

申请号：US13244273

申请日：2011-09-23

申请人： Reza Argenty Pagaila ,  Byung Tai Do ,  Linda Pei Ee Chua

发明人： Reza Argenty Pagaila ,  Byung Tai Do ,  Linda Pei Ee Chua

IPC分类号： H01L21/00 ,  H01L23/552 ,  H01L23/00 ,  H01L23/433 ,  H01L25/10 ,  H01L23/31 ,  H01L23/498 ,  H01L21/56

CPC分类号： H01L23/552 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1094 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacture of an integrated circuit packaging system includes: mounting a device mounting structure over a bottom substrate; mounting a heat spreader having an opening formed by a single integral structure with a dam and a flange, the dam having a dam height greater than a flange height of the flange; and forming a package encapsulation over the device mounting structure and the bottom substrate with the device mounting structure exposed within the opening.

摘要翻译： 集成电路封装系统的制造方法包括：将器件安装结构安装在底部衬底上; 安装具有由坝和法兰形成的具有单一整体结构的开口的散热器，所述坝具有大于所述凸缘的凸缘高度的坝高度; 以及在器件安装结构和底部衬底之间形成封装封装，其中器件安装结构暴露在开口内。

公开(公告)号：US20120061855A1

公开(公告)日：2012-03-15

申请号：US12882067

申请日：2010-09-14

申请人： Byung Tai Do ,  Linda Pei Ee Chua ,  Reza Argenty Pagaila

发明人： Byung Tai Do ,  Linda Pei Ee Chua ,  Reza Argenty Pagaila

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L21/566 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package substrate having a substrate bottom side and a substrate top side opposite the substrate bottom side; mounting an integrated circuit over the package substrate, the integrated circuit having an inactive side and an active side opposite the inactive side; connecting stack connectors to the substrate top side; applying a multi-layer film over the substrate top side, the integrated circuit, and the stack connectors, the multi-layer film having a base film layer, a penetrable film layer, and a penetrable adhesive; removing the base film layer and the penetrable film layer to expose the penetrable adhesive and exposed portions of the stack connectors; and forming an adhesive film layer by hardening the penetrable adhesive.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有基板底面和与基板底面相对的基板顶面的封装基板; 将集成电路安装在封装基板上，该集成电路具有非活动侧和与非活动侧相对的有效侧; 将堆叠连接器连接到基板顶侧; 在基板顶侧，集成电路和堆叠连接器上施加多层膜，具有基膜层，可穿透膜层和可穿透粘合剂的多层膜; 去除基膜层和可穿透膜层以暴露可穿透粘合剂和堆叠连接器的暴露部分; 以及通过使可渗透​​的粘合剂硬化来形成粘合剂膜层。

公开(公告)号：US20110316133A1

公开(公告)日：2011-12-29

申请号：US12822659

申请日：2010-06-24

申请人： Byung Tai Do ,  Linda Pei Ee Chua ,  Reza Argenty Pagaila

发明人： Byung Tai Do ,  Linda Pei Ee Chua ,  Reza Argenty Pagaila

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49548 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49506 ,  H01L23/4951 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit package system includes: providing a penetrable layer; partially immersing leads in the penetrable layer; coupling an integrated circuit die to the leads; molding a package body on the integrated circuit die, the leads, and the penetrable layer; and exposing stand-off leads from the leads by removing the penetrable layer including establishing a stand-off height between a bottom of the package body and the bottom of the stand-off leads.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供可穿透层; 将引线部分浸渍在可穿透层中; 将集成电路管芯耦合到引线; 在集成电路管芯，引线和可穿透层上成型封装体; 以及通过去除所述可穿透层而使所述引线脱离引线，包括在所述封装主体的底部和所述支座引线的底部之间建立间隔高度。