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    Optical waveguide and lamp including same
    11.
    发明授权
    Optical waveguide and lamp including same 有权

    公开(公告)号：US10408986B2

    公开(公告)日：2019-09-10

    申请号：US15443660

    申请日：2017-02-27

    Applicant: CREE, INC.

    Inventor： Zongjie Yuan ,  Kurt S. Wilcox ,  Eric J. Tarsa ,  Fabian Jean-Daniel Rol ,  James Ibbetson ,  Bernd P. Keller

    IPC: F21K9/23 ,  F21K9/61 ,  F21V8/00 ,  F21Y101/00 ,  F21Y115/10

    Abstract: An optical waveguide includes a body of optically transmissive material having a width substantially greater than an overall thickness thereof and including a first side, a second side opposite the first side, a central bore extending between the first and second sides and adapted to receive a light emitting diode, and extraction features on the second side. A light diverter extends into the central bore for diverting light into and generally along the width of the body of material. The extraction features direct light out of the first side and wherein at least one extraction feature has an extraction surface dimension transverse to the thickness that is between about 5% and about 75% the overall thickness of the body of material.

    SOLID STATE LIGHTING APPARATUS WITH HIGH SCOTOPIC / PHOTOPIC (S/P) RATIO
    14.
    发明申请
    SOLID STATE LIGHTING APPARATUS WITH HIGH SCOTOPIC / PHOTOPIC (S/P) RATIO 有权
    具有高光照/照度（S / P）比率的固态照明装置

    公开(公告)号：US20150097200A1

    公开(公告)日：2015-04-09

    申请号：US14045474

    申请日：2013-10-03

    Applicant: Cree, Inc.

    Inventor： Michael Bergmann ,  James Ibbetson ,  David Clatterbuck ,  Charles Draper ,  Nalini Gupta

    IPC: H01L33/50 ,  H01L25/075 ,  H01L33/58

    CPC classification number: H01L33/50 ,  H01L25/0753 ,  H01L33/504 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2924/12044 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: Solid state light emitting apparatuses include blue LEDs (including but not limited to a combination of short wavelength and long wavelength blue LEDs) to stimulate green lumiphors, with supplemental emissions by either red lumiphors and/or red solid state light emitters, to provide aggregate emissions with high S/P ratio (e.g., at least 1.95) and favorably high color rendering values (e.g., 85 or greater), preferably in combination with high brightness and high luminous efficacy. In certain embodiments, a solid state light emitting apparatus may be devoid of a LED having a peak wavelength of from 470-599 nm and/or devoid of lumiphors peak wavelengths in the yellow range. Multiple LEDs may be arranged in an emitter package.

    Abstract translation: 固态发光装置包括蓝色LED（包括但不限于短波长和长波长蓝色LED的组合），以刺激绿色荧光体，由红色发光体和/或红色固态发光体补充发射，以提供聚集排放 具有高S / P比（例如，至少1.95）和有利的高显色值（例如，85或更大），优选结合高亮度和高发光效率。 在某些实施例中，固态发光装置可以没有具有470-599nm的峰值波长和/或在黄色范围内没有发光体峰值波长的LED。 多个LED可以布置在发射器封装中。

    FLIP-CHIP PHOSPHOR COATING METHOD AND DEVICES FABRICATED UTILIZING METHOD
    15.
    发明申请
    FLIP-CHIP PHOSPHOR COATING METHOD AND DEVICES FABRICATED UTILIZING METHOD 审中-公开
    FLIP-CHIP磷酸盐涂层方法和装置制造的利用方法

    公开(公告)号：US20150008457A1

    公开(公告)日：2015-01-08

    申请号：US14494795

    申请日：2014-09-24

    Applicant: CREE, INC.

    Inventor： Ashay Chitnis ,  James Ibbetson ,  Bernd Keller

    IPC: H01L33/44 ,  H01L33/62 ,  H01L33/50 ,  H01L33/10 ,  H01L33/08 ,  H01L27/15

    CPC classification number: H01L33/44 ,  H01L27/15 ,  H01L33/08 ,  H01L33/10 ,  H01L33/502 ,  H01L33/505 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/13 ,  H01L2933/0041 ,  H01L2933/0066

    Abstract: Methods for fabricating light emitting diode (LED) chips one of which comprises flip-chip mounting a plurality of LEDs on a surface of a submount wafer and forming a coating over said LEDs. The coating comprising a conversion material at least partially covering the LEDs. The coating is planarized to the desired thickness with the coating being continuous and unobstructed on the top surface of the LEDs. The LEDs chips are then singulated from the submount wafer. An LED chip comprising a lateral geometry LED having first and second contacts, with the LED flip-chip mounted to a submount by a conductive bonding material. A phosphor loaded binder coats and at least partially covers the LED. The binder provides a substantially continuous and unobstructed coating over the LED. The phosphor within the coating absorbs and converts the wavelength of at least some of the LED light with the coating planarized to achieve the desired emission color point of the LED chip.

    Abstract translation: 制造发光二极管（LED）芯片的方法，其中之一包括倒装芯片，将多个LED安装在底座晶片的表面上并在所述LED上形成涂层。 所述涂层包含至少部分地覆盖所述LED的转化材料。 将涂层平坦化到所需的厚度，涂层在LED的顶表面上是连续的并且不受阻碍。 然后将LED芯片从底座晶片分离。 一种LED芯片，包括具有第一和第二触点的侧向几何形状LED，其中LED倒装芯片通过导电接合材料安装到基座。 荧光体负载的粘合剂涂层并且至少部分地覆盖LED。 粘合剂在LED上提供基本上连续且无障碍的涂层。 涂层内的荧光体吸收并转换至少一些LED光的波长，使涂层平坦化，以达到LED芯片的期望的发射色点。

    Quantum Dot Narrow-Band Downconverters for High Efficiency LEDs
    17.
    发明申请
    Quantum Dot Narrow-Band Downconverters for High Efficiency LEDs 有权
    用于高效率LED的量子点窄带下变频器

    公开(公告)号：US20130341590A1

    公开(公告)日：2013-12-26

    申请号：US13837442

    申请日：2013-03-15

    Applicant: CREE, INC.

    Inventor： Nalini Gupta ,  James Ibbetson ,  Bernd Keller

    IPC: H01L33/06 ,  H01L33/08

    CPC classification number: H01L33/06 ,  H01L33/08 ,  H01L33/502 ,  H05B33/14

    Abstract: The present disclosure is directed to LED components, methods and systems using such components, having light emitter devices with emissions tuned to meet CRI and LER goal values at a defined CCT. These emitter devices and methods may use a combination of light emitting diodes and quantum dots to tune the emission to meet these criteria. The quantum dots may incorporate additional features to protect the quantum dots from environmental conditions and improve heat dissipation, such as coatings and thermally conductive features.

    Abstract translation: 本公开涉及使用这种部件的LED部件，方法和系统，其具有调光的发射器装置，以满足在限定的CCT下的CRI和LER目标值。 这些发射器件和方法可以使用发光二极管和量子点的组合来调节发射以满足这些标准。 量子点可以包含额外的特征以保护量子点免受环境条件的影响，并改善散热，如涂层和导热特征。

    Chip with integrated phosphor
    19.
    发明授权
    Chip with integrated phosphor 有权

    公开(公告)号：US10439107B2

    公开(公告)日：2019-10-08

    申请号：US14053404

    申请日：2013-10-14

    Applicant: CREE, INC.

    Inventor： Sten Heikman ,  James Ibbetson ,  Zhimin Jamie Yao ,  Fan Zhang ,  Matthew Donofrio ,  Christopher P. Hussell ,  John A. Edmond

    IPC: H01L33/44 ,  H01L33/50 ,  H01L33/00 ,  H01L33/20 ,  H01L33/48

    Abstract: This disclosure relates to light emitting devices and methods of manufacture thereof, including side and/or multi-surface light emitting devices. Embodiments according to the present disclosure include the use of a functional layer, which can comprise a stand-off distance with one or more portions of the light emitter to improve the functional layer's stability during further device processing. The functional layer can further comprise winged portions allowing for the coating of the lower side portions of the light emitter to further interact with emitted light and a reflective layer coating on the functional layer to further improve light extraction and light emission uniformity. Methods of manufacture including methods utilizing virtual wafer structures are also disclosed.

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