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11.发明授权Electroless metal adhesion to organic dielectric material with phase separated morphology 失效无机金属与相分离形态的有机介电材料粘合
公开(公告)号：US5310580A
公开(公告)日：1994-05-10
申请号：US874665
申请日：1992-04-27
申请人： Eugene J. O'Sullivan , Terrence R. O'Toole , Judith M. Roldan , Lubomyr T. Romankiw , Carlos J. Sambucetti , Ravi Saraf
发明人： Eugene J. O'Sullivan , Terrence R. O'Toole , Judith M. Roldan , Lubomyr T. Romankiw , Carlos J. Sambucetti , Ravi Saraf
CPC分类号： H05K3/387 , B05D1/34 , C23C18/20 , C23C18/2033 , C23C18/208 , C23C18/24 , C23C18/30 , H05K2201/0154 , H05K2201/0212 , H05K2203/0759 , H05K2203/0773 , H05K2203/0793 , H05K3/181 , H05K3/381
摘要： Improved adhesion of electroless metal deposited on an organic dielectric layer with phase separated morphology is accomplished by the spontaneous formation of a morphologically and topographically rough surface. In one embodiment a ternary solution of a polar solvent and two polymer precursors of the same polymer which are separable in two phases of different order are cast in film on a substrate and heated to form two phases of different order to spontaneously produce a rough surface. Upon exposure to an alkaline solution, one phase is etched at a faster rate than the other. Seeding and electroless deposition of a metal on the rough surface results in improved adhesion of the metal to the dielectric layer. In a second embodiment a quaternary solution of a polar solvent, a seeding agent, two polymer precursors of the same polymer which are separable in two phases of different order are cast in a thin film on a substrate and heated to form three phases. Upon curing the precursors there is surface roughening as a result of phase separation. Upon exposure to alkaline solution there is etching of one of the polymer phases at a faster rate and simultaneous opening of the seeding colloid. The rough surface is overcoated with a photoresist, exposed and developed. Subsequent electroless metal deposition results in improved metal to dielectric layer adhesion. The method is applicable to selective deposition of electroless copper onto a polyimide layer.
摘要翻译： 沉积在具有相分离形态的有机电介质层上的化学金属的改善的粘附通过自发形成形态和形貌上粗糙的表面来实现。 在一个实施方案中，可以将不同顺序的两相分离的相同聚合物的极性溶剂和两种聚合物前体的三元溶液在基材上成膜并加热形成不同阶数的两相以自发产生粗糙表面。 在暴露于碱性溶液时，以比另一相更快的速率蚀刻一相。 在粗糙表面上的金属的接种和无电沉积导致金属对电介质层的附着力提高。 在第二个实施方案中，将极性溶剂，接种剂，可以在两相中分离的相同聚合物的两种聚合物前体的四元溶液浇铸在基材上的薄膜中，并加热形成三相。 固化前体由于相分离而导致表面粗糙化。 暴露在碱性溶液中时，以更快的速率蚀刻聚合物相之一并同时打开接种胶体。 粗糙表面用光致抗蚀剂涂覆，曝光和显影。 随后的无电金属沉积导致金属与电介质层粘附性的改善。 该方法适用于将化学镀铜选择性沉积到聚酰亚胺层上。
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公开(公告)号：US5509557A
公开(公告)日：1996-04-23
申请号：US184930
申请日：1994-01-24
申请人： Lisa J. Jimarez , William H. Lawrence , Voya R. Markovich , Robert J. Owen , Carlos J. Sambucetti
发明人： Lisa J. Jimarez , William H. Lawrence , Voya R. Markovich , Robert J. Owen , Carlos J. Sambucetti
CPC分类号： H05K3/38 , C23C18/22 , H05K3/381 , H05K2203/1105 , H05K2203/1152 , H05K3/181
摘要： A method for depositing a conductive metal onto a dielectric substrate is provided. The method includes obtaining a metal sheet having a roughened surface that has the following parameters:R.sub.a =0.05-0.08 mil,R.sub.max =0.20-0.55 mil,S.sub.m =1.00-3.00 mil,R.sub.p =0.20-0.35 mil, andsurface area=0.90-1.20 square milswherein R.sub.a is the average roughness and the arithmetic mean of the departures from horizontal mean line profile;R.sub.max is the maximum peak-to-valley height;S.sub.m is the mean spacing between high spots at the mean line;R.sub.p is the maximum profile height from the mean line; andsurface area is the area under the surface profile from each measurement using a Talysurf S-120 profilometer;The sheet is laminated to the dielectric substrate surface by pressing the roughened surface of the metal sheet against the surface of the substrate and then removed from the substrate. The substrate surface is seeded to render it active for electroless plating thereon; and then a metal from an electroless plating bath is plated thereon.In another method, the dielectric substrate is seeded to render it active for electroless plating thereon. A metal is then plated thereon from an electroless plating bath. The plated metal is subjected to temperature of at least about 100 .degree. C. for a time sufficient to increase the adhesion of the metal to the substrate.
摘要翻译： 提供了一种在电介质基片上沉积导电金属的方法。 该方法包括获得具有以下参数的粗糙表面的金属片：Ra = 0.05-0.08密耳，Rmax = 0.20-0.55密耳，Sm = 1.00-3.00密耳，Rp = 0.20-0.35密耳，表面积= 0.90 -1.20平方米，其中Ra是平均粗糙度和离开水平平均线轮廓的算术平均值; Rmax是最大峰谷高度; Sm是平均线高点之间的平均间距; Rp是距平均线的最大轮廓高度; 表面积是使用Talysurf S-120轮廓仪进行每次测量的表面轮廓下面积; 通过将金属片的粗糙表面压在衬底的表面上，然后从衬底上去除，将片层压到电介质衬底表面上。 将基材表面接种以使其活性以在其上进行无电镀; 然后将来自化学镀浴的金属镀在其上。 在另一种方法中，将电介质基底接种以使其在其上进行无电镀。 然后将金属从化学镀浴镀在其上。 将电镀金属经受至少约100℃的温度足以增加金属与基底的粘合力的时间。
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公开(公告)号：US5105537A
公开(公告)日：1992-04-21
申请号：US596432
申请日：1990-10-12
IPC分类号： H01H1/06 , H01L21/60 , H01R12/04 , H01R12/32 , H01R13/03 , H01R13/22 , H01R43/16 , H05K1/11 , H05K3/06 , H05K3/07 , H05K3/24 , H05K3/38 , H05K3/40
CPC分类号： H05K3/07 , H01R13/22 , H05K3/4007 , H01L2924/0002 , H01R13/03 , H01R43/16 , H05K2201/0367 , H05K2201/0373 , H05K2203/0369 , H05K3/064 , H05K3/383 , Y10T29/49222
摘要： An electrical interconnection, which includes a method for fabricating the device, is disclosed. The interconnection comprises two contact surfaces, on at least one of which is disposed at least one solid metal conical projection in predetermined dimension and location. Rather than necessarily being permanently cojoined, the contact surfaces are attachable and detachable when desired. The conical projections on one contact surface make ohmic contact, either by wiping with an intermeshing like structure on a second contact surface or by contacting a second contact surface which is a substantially flat contact pad. An interconnection, in this invention, is the combination of at least one contact having individual conical projections and another contact, optionally having individual conical projections. The conical projections are formed in metal by electrochemical machining in neutral salt solution, optionally in a continuous foil. The conical projections are also optionally formed on the head of a contact pin.
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14.发明授权Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon 失效调节非导电基底，以便随后在其上选择性沉积金属
公开(公告)号：US4948707A
公开(公告)日：1990-08-14
申请号：US156519
申请日：1988-02-16
申请人： Robert W. Johnson , William H. Lawrence , Gary K. Lemon , Roy H. Magnuson , Voya R. Markovich , Ralph E. Parsons , Carlos J. Sambucetti
发明人： Robert W. Johnson , William H. Lawrence , Gary K. Lemon , Roy H. Magnuson , Voya R. Markovich , Ralph E. Parsons , Carlos J. Sambucetti
CPC分类号： H05K3/181 , H05K3/184 , H05K3/381 , H05K2203/0716 , H05K2203/1152 , H05K2203/122 , H05K2203/1407 , H05K3/0023
摘要： A non-conductive substrate is conditioned for subsequent selective deposition of a metal thereon by providing at least one of the major surfaces of the substrate in roughened form, contacting that surface(s) with a palladium/tin catalyst, activating the catalyst by employing an alkali hydroxide solution, laminating a photosensitive composition to the major surface(s), and exposing the photosensitive composition to actinic light in a predetermined pattern and then developing to provide the predetermined pattern.
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公开(公告)号：US4820643A
公开(公告)日：1989-04-11
申请号：US161233
申请日：1988-02-17
申请人： William J. Amelio , Kenneth R. Czarnecki , Gary K. Lemon , Voya Markovich , Carlos J. Sambucetti , Richard S. Zarr
发明人： William J. Amelio , Kenneth R. Czarnecki , Gary K. Lemon , Voya Markovich , Carlos J. Sambucetti , Richard S. Zarr
CPC分类号： G01N27/48
摘要： The effectiveness of a palladium-tin catalyst for subsequent plating thereon is determined by employing cyclic voltammetry.
摘要翻译： 通过使用循环伏安法测定钯 - 锡催化剂随后电镀的效果。
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16.发明授权Method for conditioning a surface of a dielectric substrate for electroless plating 失效用于调理用于无电镀的电介质基板的表面的方法
公开(公告)号：US4554182A
公开(公告)日：1985-11-19
申请号：US696879
申请日：1985-01-31
申请人： James R. Bupp , Gary K. Lemon , Voya Markovich , Carlos J. Sambucetti , Stephen L. Tisdale , Donna J. Trevitt
发明人： James R. Bupp , Gary K. Lemon , Voya Markovich , Carlos J. Sambucetti , Stephen L. Tisdale , Donna J. Trevitt
摘要： Method for electroless plating metals, such as copper, onto non-conductive substrate surfaces. The method comprises bringing the surfaces into contact with an aqueous composition containing H.sub.2 SO.sub.4 and a multifunctional cationic copolymer containing at least two available cationic moieties and then activating the surfaces by treating them with a colloidal solution containing palladium chloride, stannous chloride and HCl.The inventive method is particularly useful in processes for producing metal circuits on substrates of glass, thermoplastics and thermosetting resins, such as epoxy cards and boards. The method is also applied in reworking substrates having already undergone copper plating and having been rejected due to failures.
摘要翻译： 无电镀金属（如铜）在非导电基材表面上的方法。 该方法包括使表面与含有H 2 SO 4的水性组合物和含有至少两种可得到的阳离子部分的多官能阳离子共聚物接触，然后通过用含氯化钯，氯化亚锡和HCl的胶体溶液处理表面来活化表面。 本发明的方法特别适用于在玻璃，热塑性塑料和热固性树脂（例如环氧树脂卡和板）的基底上生产金属电路的方法。 该方法也适用于已经经过镀铜并由于故障而被拒绝的基板。
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公开(公告)号：US4211616A
公开(公告)日：1980-07-08
申请号：US42177
申请日：1979-05-24
申请人： Carlos J. Sambucetti
发明人： Carlos J. Sambucetti
摘要： An improved electrolytic printing fluid is described. The printing fluid is comprised of an agent for the catalyzation of the electro-oxidation of a color forming agent therein. The fluid may include an agent which can form a clathrate complex with the color forming agent, as well as an agent which prevents discoloring of the paper when said fluid is coated on the same. The coated paper is subjected to an electrolytic printing method using non-consumable electrode.
摘要翻译： 描述了一种改进的电解印刷液。 印刷液由用于催化其中的成色剂的电氧化的试剂组成。 流体可以包括可以与成色剂形成包合物络合物的试剂，以及当所述流体涂覆在其上时防止纸变色的试剂。 对涂布纸进行使用非消耗性电极的电解印刷法。
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公开(公告)号：US06268016B1
公开(公告)日：2001-07-31
申请号：US08672290
申请日：1996-06-28
申请人： Anilkumar Chinuprasad Bhatt , Roy Harvey Magnuson , Thomas Richard Miller , Voya Rista Markovich , Carlos J. Sambucetti , Stephen Leo Tisdale
发明人： Anilkumar Chinuprasad Bhatt , Roy Harvey Magnuson , Thomas Richard Miller , Voya Rista Markovich , Carlos J. Sambucetti , Stephen Leo Tisdale
IPC分类号： B05D512
CPC分类号： H05K3/181 , C23C18/1632 , C23C18/2086 , H01L2224/16 , H01L2924/01046 , H01L2924/01078 , H01L2924/01322 , H01L2924/15312 , Y10T29/49126 , Y10T29/49165
摘要： Circuit boards are manufactured by forming a substrate with a dielectric surface and laminating a metal foil onto the substrate. The metal foil is patterned to form a first wiring layer. A permanent photoimagable dielectric layer is formed over the wiring layer and via holes are formed through the dielectric layer over pads and conductors of the wiring layer. Holes are formed through the substrate and substrate surfaces including the photoimagable dielectric, walls of the via holes, and walls of the through holes subjected to an electroless copper plating process. The process includes seeding the surface, coating the surface with a first solution containing surfactant and electroplating in a second solution in which the level of surfactant is regulated by determining the surface tension and metering surfactant addition to the second solution depending on the determination of surface tension. The copper plating on the photoimagable dielectric is patterned to form an exterior wiring layer which is covered by solder resist with windows over lands around the through holes and surface mount connection pads of the exterior wiring layer to form a high density circuitized substrate. Surface mount components and/or pin in hole components are attached to the circuitized substrate with solder joints between terminals of the components and the lands and/or connection pads to form a high density circuit board assembly. One or more of the circuit board assemblies are mounted in an enclosure with a power supply, CPU, RAM, and I/O means to form an information handling system with increased performance due to shorter signal flight times due to the higher device density.
摘要翻译： 通过形成具有电介质表面的基板并将金属箔层压到基板上来制造电路板。 图案化金属箔以形成第一布线层。 在布线层上方形成永久的光致可变电介质层，并且通过布线层的焊盘和导体上的电介质层形成通孔。 通过基板和基板表面形成孔，包括可光成像的电介质，通孔的壁和穿过无电镀铜工艺的通孔的壁。 该方法包括接种表面，用含有表面活性剂的第一溶液涂覆表面和在第二溶液中电镀，其中通过根据表面张力的测定确定表面张力和计量表面活性剂添加到第二溶液中来调节表面活性剂的含量 。 对可光成像电介质上的镀铜进行图案化以形成外部布线层，该外部布线层由通过孔周围的窗口和外部布线层的表面安装连接焊盘覆盖的阻焊剂覆盖，以形成高密度电路化基板。 表面安装部件和/或销孔部件通过部件的端子与焊盘和/或连接焊盘之间的焊接点附接到电路化的基板，以形成高密度电路板组件。 一个或多个电路板组件安装在具有电源，CPU，RAM和I / O装置的外壳中，由于更高的器件密度，由于更短的信号飞行时间，从而形成具有增加的性能的信息处理系统。
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19.发明授权Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess 失效在聚合物结构中制造双面全金属镀层通孔，无接种或光刻处理
公开(公告)号：US5545429A
公开(公告)日：1996-08-13
申请号：US270086
申请日：1994-07-01
申请人： Richard B. Booth , Emanuel I. Cooper , Edward A. Giess , Mark R. Kordus , Sol Krongelb , Steven P. Ostrander , Judith M. Roldan , Carlos J. Sambucetti , Ravi Saraf
发明人： Richard B. Booth , Emanuel I. Cooper , Edward A. Giess , Mark R. Kordus , Sol Krongelb , Steven P. Ostrander , Judith M. Roldan , Carlos J. Sambucetti , Ravi Saraf
CPC分类号： H05K3/423 , H05K2203/0152 , H05K2203/0733 , H05K2203/1509 , H05K3/205 , H05K3/321
摘要： The present invention is directed to a process of a method for the full metallization of thru-holes in a polymer structure comprising the steps of applying a film-forming amount of a conductive polymer-metal composite paste to a metal cathode; bonding a patterned polymer structure to said paste; subjecting said polymer structure to an electrolytic plating bath for a time sufficient to fully metallize thru-hole surfaces in said patterned polymer structure and removing the structure from the cathode assembly. The fully metallized thru-hole polymer structure can then be cleaned and polished to produce a finished product.
摘要翻译： 本发明涉及一种在聚合物结构中贯穿孔的全金属化方法的方法，包括以下步骤：向金属阴极施加成膜量的导电聚合物 - 金属复合浆料; 将图案化的聚合物结构键合到所述糊料; 使所述聚合物结构经受电解电镀浴足够的时间以完全金属化所述图案化的聚合物结构中的通孔表面，并从阴极组件中去除结构。 完全金属化的通孔聚合物结构然后可以被清洁和抛光以产生成品。
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公开(公告)号：US5190463A
公开(公告)日：1993-03-02
申请号：US797575
申请日：1991-11-25
IPC分类号： H01H1/06 , H01L21/60 , H01R12/04 , H01R12/32 , H01R13/03 , H01R13/22 , H01R43/16 , H05K1/11 , H05K3/06 , H05K3/07 , H05K3/24 , H05K3/38 , H05K3/40
CPC分类号： H05K3/07 , H01R13/22 , H05K3/4007 , H01L2924/0002 , H01R13/03 , H01R43/16 , H05K2201/0367 , H05K2201/0373 , H05K2203/0369 , H05K3/064 , H05K3/383 , Y10T29/49222
摘要： An electrical interconnection, which includes a method for fabricating the device, is disclosed. The interconnection comprises two contact surfaces, on at least one of which is disposed at least one solid metal conical projection in predetermined dimension and location. Rather than necessarily being permanently cojoined, the contact surfaces are attachable and detachable when desired. The conical projections on one contact surface make ohmic contact, either by wiping with an intermeshing like structure on a second contact surface or by contacting a second contact surface which is a substantially flat contact pad. An interconnection, in this invention, is the combination of at least one contact having individual conical projections and another contact, optionally having individual conical projections. The conical projections are formed in metal by electrochemical machining in neutral salt solution, optionally in a continuous foil. The conical projections are also optionally formed on the head of a contact pin.
摘要翻译： 公开了一种包括制造该装置的方法的电互连。 互连包括两个接触表面，其中至少一个接触表面设置有至少一个预定尺寸和位置的固体金属锥形突起。 不必一定地永久地共同接合，当需要时，接触表面是可附接的和可拆卸的。 一个接触表面上的锥形突起通过在第二接触表面上用相互啮合的结构擦拭或者通过接触作为基本上平坦的接触垫的第二接触表面来进行欧姆接触。 在本发明中的互连是至少一个具有单独的锥形突起的接触件和另一个接触件的组合，可选地具有单独的锥形突出部。 锥形凸起通过在中性盐溶液中的电化学机械加工形成金属，任选地在连续的箔中。 锥形突起也可选地形成在接触销的头部上。
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